SAMSUNG ELECTRONINCS CO., LTD.
|SAMSUNG ELECTRONINCS CO., LTD. Patent applications|
|Patent application number||Title||Published|
|20150160609||IMAGE FORMING APPARATUS - An image forming apparatus includes a main body having a fusing unit, a first temperature sensor which is disposed in an external surface of the main body and measures an outside temperature, a humidity sensor which is disposed in the external surface of the main body and measures an outside humidity, a second temperature sensor which is disposed inside the main body and measures an inside temperature, at least one fan disposed in the main body, and a controller configured to calculate a dew point temperature using the inside temperature and the outside humidity and operate the at least one fan based on the calculated dew point temperature.||06-11-2015|
|20080237737||OVERLAPPED STRESSED LINERS FOR IMPROVED CONTACTS - A semiconductor structure is provided which includes a first semiconductor device in a first active semiconductor region and a second semiconductor device in a second active semiconductor region. A first dielectric liner overlies the first semiconductor device and a second dielectric liner overlies the second semiconductor device, with the second dielectric liner overlapping the first dielectric liner at an overlap region. The second dielectric liner has a first portion having a first thickness contacting an apex of the second gate conductor and a second portion extending from peripheral edges of the second gate conductor which has a second thickness substantially greater than the first thickness. A first conductive via contacts at least one of the first or second gate conductors and the conductive via extends through the first and second dielectric liners at the overlap region. A second conductive via may contact at least one of a source region or a drain region of the second semiconductor device.||10-02-2008|