| SAMSUNG ELECTROMECHANICS CO., LTD. Patent applications |
| Patent application number | Title | Published |
|---|
| 20090184420 | Post bump and method of forming the same - A post bump and a method of forming the post bump are disclosed. The method of forming the post bump can include: forming a resist layer, in which an aperture is formed in correspondence to a position of an electrode pad, over a substrate, on which the electrode pad is formed; forming a metal post by filling a part of the aperture with a metallic material; filling a remaining part of the aperture with solder; reflowing the solder by applying heat; and removing the resist layer. This method can be utilized to prevent deviations in the plated solder and prevent the unnecessary flowing of the solder over the sides of the metal post during reflowing, so that the amount of solder used can be minimized. | 07-23-2009 |
| 20080204893 | Small refractive zoom lens optical system - Disclosed is a zoom lens optical system including: a first lens group that is provided close to an object, has a negative refractive power in total, and includes an optical part having a surface that reflects light; a second lens group that has a negative refractive power in total; an iris; a third lens group that has a positive refractive power in total; and a fourth lens group that has a positive refractive power in total. At least one of the second lens group, the third lens group, and the fourth lens group is moved to vary magnification. The second lens group is moved to perform focus adjustment when a distance to an object is changed between a long distance to a short distance, and the distance from a first lens of the first lens group to an imaging surface is fixed even when the lens moves during a change in magnification and the focus adjustment. | 08-28-2008 |
