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SAMSUNG ELECTRO-MECHANICS
| SAMSUNG ELECTRO-MECHANICS Patent applications | ||
| Patent application number | Title | Published |
|---|---|---|
| 20110012261 | Post bump and method of forming the same - A post bump formed over an electrode pad of a substrate for electrically connecting to an external device, the post bump including a metal post formed over the electrode pad; and a solder formed over the metal post and shaped as a dome, the dome occupying a space defined by imaginary lines extending from a perimeter of the metal post along an axial direction of the metal post. | 01-20-2011 |