SAMSUNG ELECTRO-MECHANICS., LTD.
|SAMSUNG ELECTRO-MECHANICS., LTD. Patent applications|
|Patent application number||Title||Published|
|20150053457||PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a printed circuit board and a method of manufacturing the same. According to the preferred embodiment of the present invention, the printed circuit board includes: a glass substrate through which light is not transmitted; a positive photosensitive insulating layer formed on the glass substrate; and a circuit pattern formed on the glass substrate and buried in the positive photosensitive insulating layer.||02-26-2015|
|20150027760||PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - A printed circuit board includes an insulating layer; a metal pad formed on the insulating layer; a surface treatment layer formed on the metal pad; a solder layer formed on the surface treatment layer and the insulating layer; and an intermetallic compound layer formed between the solder layer and the surface treatment layer. Further, a printed circuit board may include an insulating layer; a metal seed layer formed on the insulating layer; a metal pad formed on the metal seed layer; a surface treatment layer formed on the metal pad and the metal seed layer; a solder layer formed on the surface treatment layer of the metal pad and the surface treatment layer of the metal seed layer; and an intermetallic compound layer formed between the solder layer and the surface treatment layer.||01-29-2015|
|20130162897||CAMERA MODULE - Disclosed herein is a camera module including: a lens barrel including at least one lens L stacked and bonded therein and having a lower protrusion part formed on a bottom surface thereof; a housing having an internal space so as to receive the lens barrel therein and having a supporting surface supporting the lens barrel; and a substrate formed below the housing and having an image sensor mounted thereon.||06-27-2013|
|20120206877||CAPACITOR MODULE - Disclosed herein is a capacitor module including at least one capacitor, a cooling case accommodating the capacitor, and a cooling unit disposed in the cooling case and cooling a side surface of the capacitor.||08-16-2012|
|20110233612||SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - There is provided a semiconductor device having a High Electron Mobility Transistor (HEMT) structure allowing for enhanced performance and a method of manufacturing the same. The semiconductor device includes a base substrate; a semiconductor layer provided on the base substrate; a source electrode, a gate electrode and a drain electrode provided on the semiconductor layer to be spaced apart from one another; and an ohmic-contact layer partially provided at an interface between the drain electrode and the semiconductor layer.||09-29-2011|
|20080278139||SLEEP CURRENT ADJUSTING CIRCUIT OF SYSTEM ON CHIP - There is provided a sleep current adjusting circuit of a system on chip including: a regulator supplying a turn-on voltage and a normal current when a mode selection signal is a normal mode signal, and a turn-off voltage when the mode selection signal is a sleep mode signal; a switching device turned on by the turn-on voltage of the regulator to supply the normal current from the regulator to a main circuit part and a sleep operation circuit part, respectively, and turned off by the turn-off voltage of the regulator to block the normal current from being supplied to the main circuit part and supply the sleep current to the sleep operation circuit part; and a current limit device limiting an operating current flowing in response to the operating voltage and supplying the sleep current to the sleep operation circuit part.||11-13-2008|
Patent applications by SAMSUNG ELECTRO-MECHANICS., LTD.