SAMSUNG ELECTRO-MECHANICS CO., Patent applications |
Patent application number | Title | Published |
20110310055 | Haptic feedback actuator, haptic feedback device and electronic device - There is provided a haptic feedback actuator according to an exemplary embodiment of the present invention, including: a vibrating plate provided on one surface of a haptic device to transfer vibrations; and an actuator provided on the haptic device and including a composite layer in which a sensing electrode providing a sensing voltage Va based on a touch pressure of the haptic device and a driving electrode providing a driving voltage Vd corresponding to the sensing voltage Va are formed and a piezoelectric material generating vibrations according to the driving voltage Vd by being combined with one surface of the composite layer. | 12-22-2011 |
20110290293 | Thermoelectric module and method for manufacturing the same - Disclosed herein is a thermoelectric module. The thermoelectric module includes: first and second substrates that are disposed to be separated from each other, facing each other and includes first and second grooves each formed on inner sides thereof; first and second electrodes that are received in the first and second grooves, respectively; and a thermoelectric device that is interposed between the first and second electrodes and is electrically bonded to the first and second electrodes. As a result, the present invention provide a thermoelectric module and a method for manufacturing the same capable of improving the figure of merit and reliability of the thermoelectric module. | 12-01-2011 |
20110011631 | Ceramic substrate and method of manufacturing the same - The present invention relates to a ceramic substrate and a method of manufacturing the same. The ceramic substrate includes: a ceramic base; an electrode pattern formed on at least one surface of the ceramic base at predetermined internal and external depths; and electrode material filled in the inside of the electrode pattern. The method of manufacturing the ceramic substrate includes: coating first electrode material on at least one surface of a ceramic base; forming a surface layer built-in electrode pattern by pressurizing the coated first electrode material; primarily firing the ceramic base on which the surface layer built-in electrode pattern is formed; coating second electrode material on the surface layer built-in electrode pattern; and secondarily firing the ceramic base on which the second electrode material is coated. | 01-20-2011 |
20100018031 | Motor manufacturing method - A method of manufacturing a motor includes coupling a base cover to a sleeve having a penetration hole formed therein, such that one side of the penetration hole is closed; inserting a shaft in the penetration hole; coupling a plate to the shaft such that the shaft is inserted in the plate; and pressing and coupling a hub to the shaft such that the shaft is inserted in the hub while the base cover is supported in an axial direction of the shaft. | 01-28-2010 |
20100006878 | SEMICONDUCTOR LIGHT EMITTING DEVICE HAVING PATTERNED SUBSTRATE AND MANUFACTURING METHOD OF THE SAME - There is provided a semiconductor light emitting device having a patterned substrate and a manufacturing method of the same. The semiconductor light emitting device includes a substrate; a first conductivity type nitride semiconductor layer, an active layer and a second conductivity type nitride semiconductor layer sequentially formed on the substrate, wherein the substrate is provided on a surface thereof with a pattern having a plurality of convex portions, wherein out of the plurality of convex portions of the pattern, a distance between a first convex portion and an adjacent one of the convex portions is different from a distance between a second convex portion and an adjacent one of the convex portions. | 01-14-2010 |
20090315058 | NITRIDE SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME - There are provided a nitride semiconductor light emitting device and a method of manufacturing the same, the device including: a first conductivity type nitride semiconductor layer formed on a substrate; an active layer formed on the first conductivity type nitride semiconductor layer; a second conductivity type nitride semiconductor layer formed on the active layer; a light-transmitting low refractive index layer formed on the second conductivity type nitride semiconductor layer, the light-transmitting low refractive index layer having a plurality of openings through which the second conductivity type nitride semiconductor layer is partially exposed and formed of a material having a refractive index lower than a refractive index of the second conductivity type nitride semiconductor layer; and a high conductivity ohmic contact layer formed on the light-transmitting low refractive index layer and connected to the second conductivity type nitride semiconductor layer through the openings of the light-transmitting low refractive index layer. | 12-24-2009 |
20090307902 | APPARATUS AND METHOD FOR APPLYING CONDUCTIVE PASTE ONTO ELECTRONIC COMPONENT - An apparatus and a method for applying a conductive paste, for forming electrodes, onto an electronic component, such as a micro chip device. The apparatus includes a first jig unit provided with paste holes, which are filled with the conductive paste; and a second jig unit being movable and provided with extruding pins, which are inserted into the paste holes of the first jig unit, for allowing the conductive paste to be applied onto the electronic component. The conductive paste is applied onto the electronic component, while the electronic component is loaded onto or unloaded from the first jig unit. The apparatus and the method allow the conductive paste for forming electrodes to be precisely applied onto the electronic component, easily adjust the amount of the applied conductive paste, prevent the spreading of the conductive paste or the incorrect application of the conductive paste, allow jig units, for applying the conductive paste onto the electronic component, to be used for a long time without replacement or washing, cause the reduction of the maintenance costs of the apparatus, and facilitate the formation of electrodes having various shapes on the electronic component. | 12-17-2009 |
20090271975 | Jig for assembling rotor - The jig includes an upper jig part, a lower jig part, a support plate, a guide jig part, and a spring. The upper jig part has a pressure protrusion for press-fitting a rotating shaft, and applies pressing force to the rotating shaft. The lower jig part supports a rotor casing in a direction which is opposite the acting direction of the pressing force. The support plate is mounted to the lower jig part, and supports the rotor casing in a direction which is opposite that of the force for press-fitting the rotating shaft. The guide jig part supports the rotor casing in a direction which is opposite that of reaction force generated in the rotor casing by the support plate. The spring elastically biases the guide jig part towards the rotor casing. | 11-05-2009 |
20090064497 | Printed circuit board using paste bump and manufacturing method thereof - The method of manufacturing a printed circuit board using paste bumps includes perforating a core board to form at least one via hole, filling the at least one via hole by fill-plating and forming a circuit pattern on at least one surface of the core board, stacking a paste bump board on at least one surface of the core board, and forming an outer layer circuit on a surface of the paste bump board. The method provides a structurally stable all-layer IVH structure due to increased strength in the BVH's of the plated core boards and the interlayer connection area is increased between circuit patterns for improved connection reliability, and dimple coverage can be obtained. | 03-12-2009 |