| Samsung Electro-Mechanics Co., Ltd. Patent applications |
| Patent application number | Title | Published |
|---|
| 20120129297 | METHOD OF MANUFACTURING WAFER LEVEL PACKAGE - A method of manufacturing a wafer level package including: separating chips by dicing a wafer; forming a removable resin layer in a space between the separated chips and at upper parts thereof; separating the chips by dicing the removable resin layer; mounting the chips separated in a state of being surrounded by the removable resin layer, on a carrier plate; forming a molding material on the carrier plate to cover the removable resin layer; separating the carrier plate from the chips; forming a dielectric layer having redistribution lines connected to the chips, on the chips exposed by separating the carrier plate; and forming a solder resist layer on the dielectric layer to expose portions of the redistribution lines. | 05-24-2012 |
| 20120127847 | Motor and recording disk drive including the same - There is provided a motor including a rotating member coupled with a shaft and rotating in connection with the shaft, and a fixing member having the shaft inserted thereinto to support the shaft and including a round part whose outer surface corresponding to the rotating member is formed to be rounded to thereby allow oil to be sealed between the round part and the rotating member. | 05-24-2012 |
| 20120127681 | SOLDERING CONNECTING PIN, SEMICONDUCTOR PACKAGE SUBSTRATE AND METHOD OF MOUNTING SEMICONDUCTOR CHIP USING THE SAME - Disclosed herein are a soldering connecting pin, a semiconductor package substrate and a method of mounting a semiconductor chip using the same. A semiconductor chip is mounted on the printed circuit board using the soldering connecting pin inserted into a through-hole of the printed circuit board, thereby preventing deformation of the semiconductor package substrate and fatigue failure due to external shocks. | 05-24-2012 |
| 20120127666 | Heat-Radiating Substrate and Method Of Manufacturing The Same - Disclosed herein are a heat-radiating substrate and a method of manufacturing the same. The heat-radiating substrate includes: a base substrate with a heat sink, having a groove; an insulating layer formed on the base substrate by performing anodization thereon; and a circuit layer formed on the insulating layer, whereby the heat-radiating substrate with the heat-sink, made of metal material, is manufactured, thereby making it possible to protect devices weak against heat and thus solve the problem in view of reduced life span and degraded reliability. | 05-24-2012 |
| 20120125096 | INERTIAL SENSOR - Disclosed herein is an inertial sensor which includes a sensing unit including a mass mounted to be displaced on a flexible substrate part, a driving unit moving the mass, and a displacement detecting unit detecting a displacement of the mass, the inertial sensor comprising: a top cap covering a top of the flexible substrate part; and a bottom cap covering a bottom of the mass. Thereby, the inertial sensor can be implemented in an economic EMC molding package shape, while protecting the mass and the piezo-electric element. Further, the inertial sensor optimizes a thickness of the cap covering the mass and the piezo-electric element and an interval between the mass and the piezo-electric element to have improved freedom in design of space utilization as well as improved driving characteristics and Q values. | 05-24-2012 |
| 20120124828 | ELECTRONIC COMPONENT EMBEDDED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - A printed circuit board with an electronic component embedded printed circuit board and a manufacturing method thereof are disclosed. According to an embodiment of the present invention, the method of manufacturing a printed circuit board with an embedded electronic component having a groove formed on one surface thereof and an electrode formed inside the groove includes: forming a first circuit pattern on one surface of a first metal layer; pressing the first metal layer against a first insulator; forming a first conductive protrusion by selectively etching the other surface of the first metal layer; and mounting a first electronic component by disposing a conductive adhesive layer such that an electrode of the first electronic component and the first conductive protrusion are electrically connected to each other. Thus, an electronic component without its electrode protruded outward can be mounted easily and reliably and the manufacturing time can be shortened. | 05-24-2012 |
| 20120123574 | Plating method of substrate and manufacturing method of circuit board using the same - A method of plating a substrate and a method of manufacturing a circuit board using the method of plating a substrate. The method of manufacturing a circuit board may include: providing a panel substrate, the panel substrate divided into a circuit board area and a dummy area; calculating a ratio of an area of a circuit pattern to be formed by plating in the circuit board area; determining a ratio of an area being plated in the dummy area by considering the ratio of the area being plated in the circuit board area; setting a plating part in the circuit board area and the dummy area; and forming the circuit pattern by electroplating the panel substrate. Accordingly, deviation in thickness of plating between circuit patterns can be improved. | 05-17-2012 |
| 20120122278 | Method Of Manufacturing Semiconductor Package Board - Disclosed herein is a method of method of manufacturing a semiconductor package board, including: providing a substrate including a connection part formed on one side thereof, the connection part being provided thereon with a solder layer; disposing a conductive heat generator equipped with current wiring on the solder layer; applying current to the current wiring and thus heating the solder layer to attach a semiconductor chip to the connection part; and removing the current wiring from the conductive heat generator. The method is advantageous in that the semiconductor chip is attached to the substrate by applying current to the current wiring of the conductive heat generator to locally heat only the solder layer, thus reducing thermal stress and preventing the deformation of the substrate. | 05-17-2012 |
| 20120121361 | LOOSE PREVENTING ASSEMBLY - Disclosed herein is a loose preventing assembly including a bolt, a fastening member, and a pin-spring washer coupled between the bolt and the fastening member. The pin-spring washer includes a spring washer portion, a curved portion of which one end is connected to the spring washer portion to be curved upward and the other end is positioned in an inward direction of the spring washer portion, and a pin portion which extends in one direction from the other end of the curved portion tightens the bolt to couple the pin portion to an insertion groove formed in the bolt, thereby preventing the bolt and the fastening member from being loosened from each other. | 05-17-2012 |
| 20120120623 | LEAD PIN FOR PACKAGE SUBSTRATE AND PACKAGE SUBSTRATE USING THE SAME - Disclosed herein are a lead pin for a package substrate and a package substrate using the same. The lead pin for a package substrate, includes: a connection pin having a first through hole; and a pin head part provided with a groove including a second through hole formed therein and having a first head formed at one end part of the connection pin in a trapezoidal column shape, wherein the first through hole and the groove are connected to each other through the second through hole through which the upper portion and the lower portion the lead pin penetrate each other, whereby voids generated at the time of reflow can be discharged to the outside through the through hole formed in the lead pin, thereby making it possible to reduce a defect rate generated during a process of manufacturing a package substrate. | 05-17-2012 |
| 20120120525 | Motor and recording disk drive device - There is provided a motor allowing for an increase in the rigidity of a hydrodynamic bearing by controlling a gap between a shaft and a sleeve as well as minimizing power consumption and a recording disk derive device including the motor. The motor includes a sleeve having a cylindrical shape and including a hole whose inner circumferential surface has at least one dynamic pressure groove therein; and a shaft rotatably inserted into the hole of the sleeve and having at least one rigidity reinforcing portion protruding in an outer diameter direction from an outer circumferential surface thereof corresponding to the dynamic pressure groove. | 05-17-2012 |
| 20120120506 | LENS ACTUATOR AND CAMERA MODULE HAVING THE SAME - Disclosed are a lens actuator and a camera module having the lens actuator. The lens actuator, which includes: a housing; a magnet installed in the housing; a lens holder supporting a lens and installed to ascend and descend in the housing; a spring coupled to the lens holder and supported by the housing to elastically support the lens holder; and a coil coupled to the lens holder in such a way that the coil faces the magnet, a lead line of the coil being interposed between the lens holder and the spring, forms an electric connection structure between the coil and the spring that durable against shocks and humidity, improving the reliability of electric connection, and simplifies the connection structure between the spring and the coil, making it easier to manufacture the lens actuator. | 05-17-2012 |
| 20120119819 | CURRENT CIRCUIT HAVING SELECTIVE TEMPERATURE COEFFICIENT - There is provided a current circuit having a selective temperature coefficient. The current circuit may include: a first current generating unit generating a first current having a positive temperature characteristic which increases depending on temperature; a second current generating unit generating a second current having a negative temperature characteristic which decreases depending on temperature; a multiplying unit multiplying and outputting each of the first current and the second current; and a switching unit selectively synthesizing and outputting a plurality of currents outputted from the multiplying unit depending on on/off control signals. Therefore, it is possible to prevent performance from being deteriorated by temperature and easily and efficiently adjust a temperature coefficient through a simple switching logic. | 05-17-2012 |
| 20120119734 | HALL INTEGRATED CIRCUIT USING RECTIFIER CIRCUIT - There is provided a hall integrated circuit using a rectifier circuit including: a hall device receiving a power supply voltage for excitation and outputting a hall voltage which is in proportion to the intensity of an applied magnetic field; an amplifier amplifying the hall voltage; and a rectifying unit rectifying the amplified hall voltage to improve sensitivity and modify for user convenience by ensuring a high headroom at even a low power supply voltage. | 05-17-2012 |
| 20120119595 | Linear vibrator - Disclosed is a linear vibrator including a fixing part providing an inner space of a predetermined size, at least one magnet disposed in the inner space of the fixing part to generate a magnetic force, a vibration part including a coil disposed to face the magnet to generate electromagnetic force by interacting with the magnet and a vibrating mass body, an elastic member coupled to the fixing part and the vibration part to provide an elastic force, and a substrate coupled to the vibration part and including a through hole through which the magnet passes to prevent the substrate from contacting the magnet when the vibration part is vibrated. | 05-17-2012 |
| 20120119358 | SEMICONDIUCTOR PACKAGE SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein is a semiconductor package substrate including: a substrate for package having connection pads; and a solder resist layer formed on one surface or both surfaces of the substrate for package and having openings exposing the connection pads, wherein the solder resist layer includes a roughness layer formed thereon. | 05-17-2012 |
| 20120118621 | PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein is a printed circuit board, including: a base substrate having a connection pad; a lead pin bonded to the connection pad; and a surface treatment layer formed at the exposed portions of the connection pad and the lead pin. | 05-17-2012 |
| 20120118620 | LEAD PIN FOR PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD USING THE SAME - Disclosed herein are a lead pin for a printed circuit board and a printed circuit board using the same. The lead pin for a printed circuit board includes: a connection pin; and a pin head part formed at one end portion of the connection pin and including a protrusion, the diameter thereof being formed to be increasingly small based on a surface contacting the connection pin and the outer peripheral surface thereof being provided with a protrusion-shaped or depression-shaped band, whereby it forms a protrusion-shaped band or a depression-shaped band on the pin head part of the lead pin to increase a contacting area with the solder, thereby improving an adhesion between the lead pin and the printed circuit board. | 05-17-2012 |
| 20120118618 | Printed circuit board and method for manufacturing the same - Disclosed herein are a printed circuit board and a method for manufacturing the same. The method for manufacturing a printed circuit board includes: (a) forming at least one plate through hole penetrating through an insulating layer; (b) forming pattern grooves for implementing inner layer circuits on both surfaces of the insulating layer; and (c) filling the plate through hole and the pattern grooves with a conductive material. The method for manufacturing a printed circuit board may provide the printed circuit board having excellent heat radiating characteristics and reduce process cost. | 05-17-2012 |
| 20120118615 | METAL CLAD LAMINATE, METHOD OF MANUFACTURING THE SAME, AND HEAT-RADIATING SUBSTRATE - Disclosed herein is a metal clad laminate, a method of manufacturing the same and a heat-radiating substrate using the same. The metal clad laminate has increased adhesion because a layer of carbon nanoparticles is formed between bonding surfaces of upper and lower metal foils to a prepreg, and has improved heat conductive properties and mechanical properties because the prepreg has carbon fibers incorporated therein. Also, resin members having carbon nanofibers incorporated therein may be alternately stacked with metal layers, and metal layers may be inserted in the prepreg thus improving heat conductive properties, and the number of stacked layers may vary depending on the end use thereby controlling heat conductive properties and mechanical properties of the metal clad laminate. | 05-17-2012 |
| 20120118606 | CONDUCTIVE FILM AND MANUFACTURING METHOD THEREOF - Disclosed herein are conductive film including: a base member; N transparent electrodes formed on one surface of the base member, the N transparent electrodes being arranged in a second direction of the base member, while being extended in a first direction of the base member; and electrode wirings each correspondingly connected to one end or both ends of the N transparent electrodes and including wiring portions configured of a plurality of wirings extended in a third direction of the base member and bent and extended in the second direction of the base member and insulating portions having the wiring portions impregnated therein and formed on an upper surface of one side or both sides of the transparent electrode and a manufacturing method thereof. Accordingly, the plurality of wirings are formed in a three-dimensional shape vertically in the insulating portion rather than a plane of the base member, making it possible to reduce the area of a non-display region due to the electrode wirings. | 05-17-2012 |
| 20120113790 | Motor and recording disk drive device having the same - There is provided a motor including: a rotating member coupled to a shaft and rotating in connection with the shaft; a stationary member having the shaft inserted therein and supporting the shaft; a wall part protruding from a surface of the rotating member and allowing oil to be sealed between the rotating member and the stationary member; and a pumping groove formed in at least one of the wall part and an outer surface of the stationary member corresponding to the wall part and pumping the oil between the shaft and the stationary member. | 05-10-2012 |
| 20120113564 | Lithium ion capacitor and method of fabricating the same - There are provided a lithium ion capacitor and a method of fabricating the same. The lithium ion capacitor includes: a first electrode made of a first electrode material including activated carbon, a water-soluble metal oxide, and a water based binder; and a second electrode disposed to be faced to the first electrode, having a separating film therebetween and made of a second electrode material capable of reversibly containing lithium ions. Therefore, the lithium ion capacitor having improved energy density and output density may be provided, and the fabricating method thereof having environmentally-friendly characteristics and a competitive pricing may be provided. | 05-10-2012 |
| 20120113545 | Motor and recording disk drive including the same - There is provided with a motor, including: a rotating member coupled with a shaft and rotating in connection with the shaft; a stationary member having the shaft inserted therein to support the shaft and having a convex part formed to be protruded from the outside surface thereof; and a wall part protruding from one surface of the rotating member to allow oil to be sealed between the rotating member and the stationary member, and including a concave part having a concave groove formed at a position corresponding to the convex part. | 05-10-2012 |
| 20120113181 | Resist ink printing device - There is provided a resist ink printing device according to an exemplary embodiment of the present invention including: a transfer unit transferring a substrate on which lead-in wires for electrolytic gold plating are patterned into a main body; a controller formed on the main body to measure a warpage degree of the substrate and recognizing a gerber file stored with circuit diagram information of the substrate to compensate for the warpage degree of the substrate and correct the gerber file; and at least one inkjet printing head part discharging liquid photo resist ink to the lead-in wires by the corrected gerber file. | 05-10-2012 |
| 20120113175 | Driving apparatus of inkjet printer head and driving method thereof - Disclosed herein is a driving apparatus for an inkjet printer head including: a controller generating and outputting pulse control signals for driving an inkjet printer head; a level switching unit operated to be switched according to the pulse control signals to output a predetermined level of switching signals; a driver selectively controlling a plurality of nozzles by using the driving waveforms generated by combining the switching signals, whereby the inkjet printer head can be implemented simpler at low cost. | 05-10-2012 |
| 20120113063 | TOUCH PANEL AND A MANUFACTURING METHOD THE SAME - Disclosed herein are a touch panel and a method of manufacturing the same. The touch panel | 05-10-2012 |
| 20120112740 | HALL DEVICE MODULE EQUIPPED WITH INTERCONNECTED DOUBLE HALL DEVICES - There is provided a hall device module equipped with interconnected double hall devices. The hall device module includes: a first hall device having a first pair of terminals for excitation and a pair of output terminals; and a second hall device having a second pair of terminals for excitation and a pair of output terminals, wherein the first and second hall devices have the same equivalent circuit, the second hall device is disposed to be rotated by a predetermined angle based on the first hall device, a first terminal of the first pair of terminals is interconnected to a first terminal of the second pair of terminals to receive driving power for excitation, a second terminal of the first pair of terminals is interconnected to a second terminal of the second pair of terminals and is grounded, terminals outputting a positive component, which is a voltage rising according to an applied external magnetic field, among the pair of output terminals of the first hall device and the pair of output terminals of the second hall device, are interconnected, and terminals outputting a negative component, which is a voltage falling according to the applied external magnetic field, are interconnected, to thereby remove an offset. | 05-10-2012 |
| 20120112712 | POWER FACTORY CORRECTION CIRCUIT AND POWER SUPPLY HAVING THE SAME - A power supply includes an EMI filter removing noises from an input signal, a rectifying circuit rectifying and outputting the input signal, and a power factor correction circuit varying a magnitude in output voltage according to a duty ratio of a driving signal while generating an output voltage by an energy storage unit storing and discharging energy, controlling the duty ratio of the driving signal according to the change in the output voltage, and controlling the magnitude in output voltage before the output voltage is determined to be in an overvoltage state by using a second threshold voltage to be set lower than the first threshold voltage while determining whether the output voltage is in an overvoltage state by using the first threshold voltage. The power supply controls the magnitude in output voltage before it is determined that the output voltage is in an overvoltage state by being overshot. | 05-10-2012 |
| 20120112587 | Hydrodynamic bearing assembly and motor including the same - Disclosed is a hydrodynamic bearing assembly including: a rotary member fixed to a shaft and rotating in linkage with the shaft; and a sleeve supporting the shaft, wherein a coating film is formed by spraying, at high pressure, a solid lubricant having a single component onto one surface of at least one of the sleeve and the rotary member corresponding to the sleeve. | 05-10-2012 |
| 20120111730 | COMPOSITE ELECTRODE AND METHOD FOR MANUFACTURING THE SAME - A composite electrode and a method for manufacturing the same are disclosed. By using a composite electrode that includes a porous support made of ceramic or metal and a conductive polymer or a metal oxide formed on a surface of the porous support, a capacitor or secondary cell that provides increased charge/discharge capacity and increased energy/output density, as well as high-temperature stability and high reliability, can be manufactured. | 05-10-2012 |
| 20120111728 | METHOD OF MANUFACTURING CIRCUIT BOARD - Disclosed herein is a method of manufacturing a circuit board. The method of manufacturing a circuit board according to a preferred embodiment of the present invention is configured to include (A) forming a cavity | 05-10-2012 |
| 20120111625 | Printed circuit board and method for filling via hole thereof - Disclosed herein is a method for filling a via hole of a printed circuit board, the method including: a dividing step of dividing a via hole that is to be formed in a base substrate into a predetermined number; a first via forming step of forming a first divided via by primarily processing portions of the divided via hole; a first filling step of filling the formed first divided via with a metal; a second via forming step of forming a second divided via by secondarily processing other portions of the divided via hole; and a second filling step of filling the formed second divided via with a metal to fill the via hole, thereby making it possible to fill the via hole without a dimple. | 05-10-2012 |
| 20120111611 | Printed circuit board and method of manufacturing the same - Disclosed herein are a method of manufacturing a printed circuit board, including: providing a base substrate including a conductive layer provided on at least one surface thereof; forming conductive resist patterns by printing a conductive paste on the conductive layer; forming circuit wirings by etching the conductive layer using the conductive resist patterns as an etching mask; and forming a solder resist on the circuit wiring, and a printed circuit board manufactured therefrom. | 05-10-2012 |
| 20120111610 | HEAT-RADIATING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are a heat-radiating substrate and a method for manufacturing the same. The heat-radiating substrate includes: an anodized substrate having an anodized film formed over a metal substrate; a circuit pattern formed on one surface of the anodized substrate; and a metal layer formed on the other surface of the anodized substrate. The metal layer formed on the other surface of the anodized substrate has the same area as that of the circuit pattern formed on one surface thereof, and is formed within an edge of the anodized substrate. The metal layer is added, making it possible to minimize a warpage problem of the substrate. In addition, a heat radiating plate is in direct contact with the anodized substrate, thereby making it possible to solve a performance deterioration problem of the heat-radiating substrate and a heat generating element and improve a heat-radiating performance. | 05-10-2012 |
| 20120111609 | PRINTED CIRCUIT BOARD HAVING PLATING PATTERN BURIED IN VIA - A printed circuit board having a plating pattern buried in a via. The printed circuit board has: an insulating substrate including an electrically insulating resin; a via hole passing through the insulating substrate; a via including a metal layer formed on an inner wall of the via hole and a filler charged in the via hole; a circuit layer including a circuit pattern buried in the insulating substrate and transmitting an electrical signal; and a plating pattern buried in an end of the filler. | 05-10-2012 |
| 20120111607 | CIRCUIT BOARD WITH HIGH-DENSITY CIRCUIT PATTERNS - A circuit board including: an insulator having a trench; a first circuit pattern formed to bury a portion of the trench; and a second circuit pattern formed on a surface of the insulator having the trench formed therein. | 05-10-2012 |
| 20120106936 | Image photographing device having function for compensating hand vibration - Disclosed herein is an image photographing device having a function for compensating hand vibration. The image photographing device having a function for compensating hand vibration includes: an optical unit; a magnet combined with an outer peripheral surface of the optical unit; a housing inserted with the optical unit and the magnet and having coils disposed at a position corresponding to the magnet; suspension wires arranged at four corners of the optical unit, having the upper end portions and the lower end portions each combined with the optical unit and the housing to support the optical unit in a state floated from the bottom surface of the housing, and having a predetermined bending part formed at any point; a flexible printed circuit board surrounding the outer peripheral surface of the housing and applying current to the coils; and a substrate having the image sensor mounted on the top surface thereof and combined with the lower portion of the housing. | 05-03-2012 |
| 20120106109 | POWER MODULE USING SINTERING DIE ATTACH AND MANUFACTURING METHOD THEREOF - Disclosed herein are a power module using sintering die attach and a manufacturing method of the same. The power module includes: a substrate having an insulating layer formed on a surface of a metal plate; a circuit layer formed on the substrate and including a wiring pattern and an electrode pattern; a device mounted on the wiring pattern; a sintering die attach layer applying a metal paste between the wiring pattern and the device and sintering the metal paste to bond the wiring pattern to the device; and a lead frame electrically connecting the device to the electrode pattern, whereby making it possible to to simplify and facilitate the process, increase electrical efficiency and improve radiation characteristics, and manufacture firm and reliable power module. | 05-03-2012 |
| 20120105543 | Inkjet head package, apparatus and method for assembling the same - There are provided an inkjet head package, an apparatus and a method for assembling the same. The inkjet head package may include a plurality of inkjet heads each having an ink channel so as to eject ink through a plurality of nozzles formed on one surface thereof, and a frame having one surface to which another surface of the plurality of inkjet heads is fixed while facing the one surface thereof, the frame including an opening for exposing a portion of the another surface disposed therein. | 05-03-2012 |
| 20120105359 | RESISTIVE TOUCH SCREEN - Disclosed herein is a resistive touch screen, including: a lower substrate formed with a lower electrode pattern unit made of a conductive polymer and a lower electrode wiring unit connected to the lower electrode pattern unit; an upper substrate disposed on the upper side of the lower substrate and formed with an upper electrode pattern unit made of a conductive polymer and an upper electrode wiring unit connected to the upper electrode pattern unit, formed on an opposite surface thereto; a spacer disposed between the lower substrate and the upper substrate and provided with an opening formed therein; and a surface modifying layer covering at least any one of the lower electrode pattern unit and the upper electrode pattern unit and made of a material having a work function smaller than the conductive polymer. | 05-03-2012 |
| 20120104889 | Spindle motor - There is provided a spindle motor including: a sleeve including a hollow part having a shaft inserted thereinto and rotatably supporting the shaft; a thrust plate coupled to a lower portion of the shaft in an axial direction to thereby rotate together with the shaft; a cover plate coupled to a lower portion of the sleeve in the axial direction and covering the hollow part; and a step part stepped upwardly from a lower surface of the thrust plate in the axial direction so that the shaft and the thrust plate are easily coupled to each other and having surface roughness greater than that of other portions of the thrust plate. | 05-03-2012 |
| 20120104652 | ANTENNA FORMED WITH CASE AND METHOD OF MANUFACTURING THE SAME - There is provided an antenna integrally formed with a case and a method of manufacturing the same. An antenna integrally formed with a case according to an aspect of the invention includes: a case unit formed of a dielectric material; a radiator including a radiation unit tightly fixed to an outer surface of the case unit and terminal units each extending from an end portion of the radiation unit, passing through the case unit, and exposed on the inside of the case unit; and contact pins provided on a board disposed adjacent to the case unit and electrically connected to the individual terminal units. | 05-03-2012 |
| 20120104621 | POWER PACKAGE MODULE AND METHOD FOR FABRICATING THE SAME - Disclosed herein are a power package module and a method for fabricating the same, including: a base substrate; a plurality of high power chips and a plurality of low power chips electrically connected to the base substrate; and a plurality of metal lead plates electrically connecting the plurality of high power chips and the plurality of low power chips to the base substrate. | 05-03-2012 |
| 20120104570 | SEMICONDUCTOR PACKAGE MODULE - There is provided a semiconductor package module allowing a shield of a semiconductor package to be easily grounded and securing bonding reliability between the shield and a ground pattern. The semiconductor package module includes a semiconductor package having a shield formed on an upper surface thereof and side surfaces thereof; a main substrate having at least one ground electrode formed on a surface thereof and having the semiconductor package mounted thereon; and a bonding part bonding the ground electrode to the shield to electrically connect the ground electrode to the shield. | 05-03-2012 |
| 20120103671 | PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are a printed circuit board and a method for manufacturing the same capable of implementing a slim and small semiconductor package by the printed circuit board configured to include a circuit layer and an insulating layer as a single layer and shortening a process time and reducing processing costs by forming a bump using a screen printing method. Further, disclosed herein is a method for manufacturing a printed circuit board capable of improving a warpage problem of the printed circuit board that occurs during a polishing process by adopting a coining process instead of a polishing process. | 05-03-2012 |
| 20120103662 | Printed circuit board and manufacturing method thereof - Disclosed herein are a printed circuit board including a first low-viscosity solder resist layer formed on one surface of a substrate having circuit patterns formed thereon and a second high-viscosity solder resist layer stacked on the first solder resist layer, thereby being advantageous in controlling the deviation in application thickness of solder resist (SR), while having excellent adhesion to the substrate, and a manufacturing method thereof. | 05-03-2012 |
| 20120103589 | HEAT DISSIPATION DEVICE FOR POWER CONVERSION MODULE - Disclosed herein is a heat dissipation device for a power conversion module. The device includes a casing, a high-heat-dissipation heat sink and a circuit board. The casing includes a heat-dissipation fin unit which has heat dissipation fins arranged at positions spaced apart from each other by predetermined intervals. The casing has a mounting space therein. The high-heat-dissipation heat sink is installed in the mounting space of the casing. The circuit board is coupled to a lower surface of the casing. Therefore, the weight and size of the heat dissipation device can be reduced. In addition, the heat sink and the casing having the heat dissipation fins dissipate heat at the same time, thus enhancing the heat dissipation efficiency. Moreover, in an optimal design, the high-heat-dissipation heat sink is located at a position corresponding to a part which generates high heat so that the heat dissipation efficiency can be maximized. | 05-03-2012 |
| 20120103588 | HEAT-DISSIPATING SUBSTRATE - Disclosed herein is a heat-dissipating substrate in order to improve heat-dissipating characteristics. The heat-dissipating substrate, comprising: a copper layer having a predetermined thickness; anodized insulating layers formed on upper and lower surfaces of the copper layer; and aluminum (Al) layers formed between the copper layer and the anodized insulating layer. Therefore, a heat-dissipating function of the base made of the aluminum (Al) layer and the copper (Cu) layer is improved, thereby making it possible to provide a high-output metal substrate appropriate for high-integration/high capacity electronic components. | 05-03-2012 |
| 20120103507 | Photosensitive composite and build-up insulation film with the photosensitive composite, and method for manufacturing circuit board using the build-up insulation film - Disclosed herein is a method for manufacturing a circuit board. The method for manufacturing a circuit board includes: preparing a photosensitive composite; preparing a build-up insulating film by casting the photosensitive composite into a film made of poly ethylene terephthalate (PET) material; stacking the build-up insulation film on the board; forming via holes on the build-up insulation film by using a photolithography process; and forming conductive vias in the via holes. | 05-03-2012 |
| 20120100424 | CATHODE ACTIVE MATERIAL, AND CATHODE AND MAGNESIUM BATTERY INCLUDING THE SAME - Cathode active materials, and cathodes and magnesium batteries including the cathode active materials. The cathode active materials, and cathodes and magnesium batteries include a metal sulfide-based nanosheet. | 04-26-2012 |
| 20120099950 | SYSTEM AND METHOD FOR MANAGEMENT OF TRANSPORTATION DEVICE - Disclosed herein are a system for management of a transportation device, including: a plurality of work tables disposed to be spaced from each other; charging terminals provided around the work tables; and transportation devices transporting objects between the work tables and including a supercapacitor as a power supply, and a method therefor. | 04-26-2012 |
| 20120098781 | CAPACITIVE TOUCH SCREEN AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are a capacitive touch screen and a method for manufacturing the same. The capacitive touch screen includes: a base member on which a plurality of electrode patterns are formed; conductive adhesive members formed at ends of the electrode patterns; a window disposed over the base member and having a plurality of electrode wirings formed in an outer region thereof, the plurality of electrode wirings being opposite to the electrode patterns; and auxiliary electrodes formed at one of the ends of the electrode wirings to conduct the electrode patterns with the electrode wirings by the conductive adhesive members. | 04-26-2012 |
| 20120098496 | DEVICE AND METHOD FOR STABILIZING VOLTAGE OF ENERGY STORAGE - The present invention provides a device and a method for stabilizing a voltage of an energy storage capable of performing voltage stabilization in different ways by setting different references when charging or discharging and when standing by. Therefore, system resources consumed for the voltage stabilization of the energy storage can be minimized. | 04-26-2012 |
| 20120097438 | Printed Circuit Board and Method For Fabricating The Same - Disclosed herein is a method for fabricating a printed circuit board, including: stacking a second insulating layer including a reinforcement on an outer surface of a first insulating layer having a post via formed thereon; polishing an upper surface of the second insulating layer to expose an upper side of the post via; stacking a film member on the second insulating layer to cover the post via and compress the second insulating layer; polishing an upper surface of the film member to expose an upper side of the post via; and forming a circuit layer connected to the post via on the upper surface of the film member. | 04-26-2012 |
| 20120092552 | IMAGE SENSOR MODULE - An image sensor module including: a lower substrate having a plurality of top pads formed on the top surface thereof; an upper substrate that is installed along the edge of the top surface of the lower substrate and has a plurality of connection grooves formed on the inner side surface thereof, each connection groove having a side pad corresponding to each of the top pads of the lower substrate; an image sensor installed on the top surface of the upper substrate; and a connection element that electrically connects the top pads and the side pads. | 04-19-2012 |
| 20120092274 | TOUCH SCREEN - Disclosed herein is a touch screen, including: a first transparent electrode formed on one surface of a first transparent substrate; a second transparent electrode formed on one surface of a second transparent substrate; a first adhesive layer configured to adhere the first transparent substrate and the second transparent substrate to each other; a window plate adhered to the first transparent substrate; and hardness dots formed on one surface of the window plate or the other surface of the first transparent substrate. The present invention has been made in an effort to provide a touch screen which can lower the operational load of a transparent electrode. | 04-19-2012 |
| 20120092090 | COUPLING STRUCTURE FOR MULTI-LAYERED CHIP FILTER, AND MULTI-LAYERED CHIP FILTER WITH THE STRUCTURE - Disclosed herein are a coupling structure for a multi-layered chip filter capable of overcoming a limitation of an existing coupling by improving a coupling structure and a multi-layered chip filter with the structure. | 04-19-2012 |
| 20120091994 | INTEGRATED APPARATUS FOR SENSING CURRENT - There is provided an integrated apparatus for sensing current including: a voltage regulator; a Hall effect device receiving current by the voltage regulator and outputting hall voltage in proportional to strength of a magnetic field; and a coil having one end connected to a first connecting terminal and the other end connected to a second connecting terminal, wound to have a plurality of turns along a circumference of the Hall effect device on the same plane spaced apart by a predetermined distance from the Hall effect device in a direction of the magnetic field, and forming the magnetic field according to current flowing through the first connecting terminal and the second connecting terminal, wherein the Hall effect device and the coil are integrated within one chip. A manufacturing cost of a product may be reduced, simultaneously with sensing the current without loss of the magnetic field according to a distance through the above-mentioned configuration. | 04-19-2012 |
| 20120091970 | CHARGING EQUIPMENT OF VARIABLE FREQUENCY CONTROL FOR POWER FACTOR - Disclosed herein is a charging equipment of variable frequency control for power factor. In addition, the present invention relates to a charging equipment of variable frequency control for power factor including: an AC-DC converter converting AC power into DC power; a DC-DC converter converting DC power output from the power factor calibration circuit into DC power for charging a battery and outputting the converted DC power; and a power factor calibration circuit calibrating power factor by the operation of the switching device and outputting the calibrated power factor; and a power factor calibration circuit controller performing the switching control by varying the frequency of the pulse signal when performing a switching control by modulating a pulse width of a pulse signal on the switching devices of the power factor calibration circuit, thereby making it possible to maintain the power factor even in the light load status. | 04-19-2012 |
| 20120091861 | CERAMIC COMPOSITION FOR PIEZOELECTRIC ACTUATOR AND PIEZOELECTRIC ACTUATOR COMPRISING THE SAME - The present invention relates to a ceramic composition for a piezoelectric actuator and a piezoelectric actuator comprising the same. The ceramic composition for piezoelectric actuator includes a piezoelectric ceramic powder expressed by a Chemical Formula: (1-x)Pb(Zr | 04-19-2012 |
| 20120091842 | Hydrodynamic bearing assembly and motor including the same - There is provided a fluid dynamic bearing assembly including: a hub coupled to a shaft and rotating together with the shaft; a sleeve supporting the shaft and including a storage groove formed in an upper surface thereof to thereby store oil between the sleeve and the hub; and a protrusion part protruding from one surface of the hub corresponding to the upper surface of the sleeve, allowing the oil to be sealed between the protrusion part and the sleeve, and having an oil interface formed in an outer radial direction thereof. | 04-19-2012 |
| 20120090875 | CONDUCTIVE FILM AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein is a conductive film. The conductive film includes: a base member; a transparent electrode formed on the base member; and electrode wirings connected to one side or both sides of the transparent electrode and having a first metal layer formed on the lower portion thereof and a second metal layer made of a metal different from the first metal layer and formed to be thicker than the thickness of the first metal layer stacked on the upper portion thereof. | 04-19-2012 |
| 20120090172 | Method of manufacturing printed circuit boad - Disclosed herein is a method of manufacturing a printed circuit board, including: forming a first circuit wiring layer on a substrate; forming an organic metal compound layer on the surface of the first circuit wiring layer; performing a surface treatment on the surface of the organic metal compound layer; forming an insulating layer on the first circuit wiring layer including the organic metal compound layer; and forming a second circuit wiring layer on the insulating layer. | 04-19-2012 |
| 20120088334 | METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE - Disclosed herein is a method for manufacturing a semiconductor package which uses a base member | 04-12-2012 |
| 20120088178 | FUEL CELL AND MANUFACTURING METHOD THEREOF - There are provided a fuel cell and a manufacturing method thereof. The manufacturing method of a fuel cell includes: providing a support for a fuel cell; and forming an interconnecting member layer including metal-glass and interconnecting unit cells on the support. According to the present invention, since an interconnecting member having high durability, chemical resistance properties and improved electrical conductivity is provided, a fuel cell having improved electrical characteristics and an improved durability may be provided. | 04-12-2012 |
| 20120087420 | Data Interface Apparatus Having Adaptive Delay Control Function - Disclosed herein is a data interface apparatus having an adaptive delay control function, which includes a transmitter generating and transmitting data and strobe signals through an intermediate signal path; and a receiver restoring data by receiving the signals, detecting a time difference of a low-level signal and a high-level signal of a strobe signal after an interval where data is high and strobe is low, regulating skew according to the detected time difference, and outputting the strobe signal with the regulated skew. Hence, the skew can be actively regulated in an environment where the skew changes. | 04-12-2012 |
| 20120087160 | POWER FACTOR CORRECTION CIRCUIT - There is provided a power factor correction circuit capable of correcting a power factor of a power converting module through increasing an input current by switching a main switching element of a power converting module on the basis of a first reference wave having a slope based on a first signal and an error voltage, in particular, by limiting a switching frequency on the basis of a first reference wave having a slope based on a second signal lower than a first signal and an error voltage when the switching frequency of the main switching element increases because an input voltage of the power converting module is low. | 04-12-2012 |
| 20120087098 | PACKAGE SUBSTRATE - Disclosed herein is a package substrate, including: a printed circuit board having a connection terminal and a conductive adhesive layer formed thereon; components mounted in the connection terminal; wires coupled to the components; a wall printed circuit board coupled to the conductive adhesive layer and configured to cover the components; and a metal cap coupled to an upper end of the wall printed circuit board to cover the components, thereby ensuring firmness and reliability despite external impact. | 04-12-2012 |
| 20120087097 | PRINTED CIRCUIT BOARD HAVING ELETRONIC COMPONENTS EMBEDDED THEREIN - Disclosed herein is a printed circuit board having electronic components embedded therein. The printed circuit board having electronic components embedded therein includes: a metal core layer connected to a ground terminal of an external power supply to be grounded and having a cavity or a groove part formed thereon; an electronic component accommodated in the cavity and having a plurality of terminals, a ground terminal included in the plurality of terminals being connected to the metal core layer; an internal insulating layer stacked on both sides of the metal core layer; and circuit patterns formed on an external surface of the internal insulating layer. | 04-12-2012 |
| 20120086515 | RELAXATION OSCILLATOR - There is provided relaxation oscillator. The relaxation oscillator includes: a ramp wave generator generating ramp waves by a complementary operation between a first capacitor module charged and discharged according to a first switching signal and a second capacitor module charged and discharged according to a second switching signal; a negative feedback circuit unit generating a compensation voltage for compensating errors with reference voltage by being fedback with the ramp waves; and a switching signal generator generating the first switching signal controlling the charging and discharging of the first capacitor module and the second switching signal controlling the charging and discharging of the second capacitor module from the compensation voltage and the ramp waves. As a result, the present invention can generate ramp waves having a stable frequency while preventing a frequency from being changed due to a delay or an offset of the comparator. | 04-12-2012 |
| 20120085810 | JIG FOR ROUND SOLDER BALL ATTACHMENT - Disclosed herein is a jig for solder ball attachment capable of sensing whether missing balls occur by electrical sensing using an electrical sensor structure in which a conductive thin film is embedded in the jig and electrically sensing whether abnormal solder balls, for example, large ball/small ball/ball size are attached, without confirming whether abnormal solder balls, for example, large ball/small ball/ball size are attached by vision one by one, thereby shortening operating time and improving workability. | 04-12-2012 |
| 20120085574 | Heat radiating substrate and method of manufacturing the same - Provided are a heat radiating substrate and a method of manufacturing the same. The heat radiating substrate includes a substrate having a via-hole, an anode oxide layer formed on the entire surface of the substrate having the via-hole through an anodizing process, a first circuit pattern formed on the substrate on which the anode oxide layer is formed, and a second circuit pattern formed at a lower part of the via-hole to be connected to the via-hole. Therefore, it is possible to simplify a circuit forming process and readily manufacture the heat radiating substrate by applying a metal anodic bonding process, without using a conventional adhesion layer and metal seed when the heat radiating substrate is manufactured. | 04-12-2012 |
| 20120084977 | METHOD OF MANUFACTURING BLOCK MODULE - Disclosed herein is a method of manufacturing a block module including: mounting an electronic part on a base substrate on which a ground terminal is formed; forming a lead frame to extend to the outside of the base substrate from the ground terminal; connecting a flexible printed circuit to a circuit layer on the base substrate; forming a mold to surround the base substrate; cutting the lead frame and exposing the cut surface of the lead frame to the outside of the mold; and forming a metal coating layer connected to the lead frame on the mold, whereby the metal coating layer is formed to surround the mold to interrupt the electromagnetic waves and the metal coating layer is connected to the ground terminal by the lead frame to make the process simple. | 04-12-2012 |
| 20120084029 | ELECTRONIC WATT-HOUR METER MANAGING MULTIPLE INPUT SIGNALS AND METHOD OF CALCULATING WATT-HOURS - There are provided an electronic watt-hour meter capable of processing a plurality of input signals and a method of calculating watt-hours. The electronic watt-hour meter includes: a signal sensor sensing analogue type voltage and current signals; a multiplexer selectively outputting any one signal of the sensed voltage and current signals; a signal converter converting the selectively outputted signal into a digital signal; a demultiplexer outputting the converted digital signal through a port corresponding to the converted digital signal; and a calculator calculating watt-hours based on the converted digital signal, thereby allowing for a reduction in power consumption and the miniaturizing of the watt-hour meter. | 04-05-2012 |
| 20120082442 | Image photographing device having function for compensating for hand vibration - Disclosed herein is an image photographing device having a function for compensating hand vibration to simultaneously perform auto focusing and hand vibration compensation. The image photographing device having a function for compensating hand vibration includes: a bobbin having a lens unit mounted therein, a driving coil in a Z axis direction wound on an outer peripheral surface thereof, and a driving coil in an X axis direction and a driving coil in a Y axis direction mounted outside the driving coil in a Z direction; a plurality of magnets mounted outside the driving coil in an X axis direction and the driving coil in a Y axis direction; an elastic member elastically combined with an upper portion and a lower portion of the bobbin; a housing into which the bobbin combined with the magnet and the elastic member is inserted; and a shield case combined with an upper portion of the housing. | 04-05-2012 |
| 20120081331 | TOUCH SCREEN - Disclosed herein is a touch screen. The touch screen includes: a transparent substrate; and transparent electrodes formed on the transparent substrate and sensing a change in capacitance at the time of a touch input, wherein the transparent electrodes include internal transparent electrodes and external transparent electrodes, and the internal transparent electrodes include first sensing units sensing the change in capacitance, extending portions extending to edges of the transparent substrate from the first sensing units, and the extending portions of the adjacent internal transparent electrodes face each other, whereby the extending portions face each other to reduce the frequency of the coordinate errors of the touch input corrected in the controller. | 04-05-2012 |
| 20120081329 | DIGITAL RESISTIVE TYPE TOUCH PANEL - Disclosed is a digital resistive type touch panel, including a transparent substrate, a plurality of bar-shaped transparent electrodes mutually formed in parallel in an X-axis direction on the transparent substrate, and electrode wires extending from either or both ends of the bar-shaped transparent electrodes and bundled to one side in a Y-axis direction of the transparent substrate, wherein the bar-shaped transparent electrodes become wider as becoming more distant from one side in the Y-axis direction of the transparent substrate. Thus because the bar-shaped transparent electrodes become wider as the electrode wires get longer, errors can be prevented from occurring when touch coordinates are determined, making it possible for information to be precisely input using the digital resistive type touch panel. | 04-05-2012 |
| 20120080959 | Linear vibrator - There is provided a linear vibrator according to an exemplary embodiment of the present invention, including: a fixing unit providing an internal space having a predetermined size; a plurality of magnets disposed in the internal space of the fixing unit and positioned to have the same poles face each other so as to generate magnetic force; a vibration unit disposed to face the magnets and including a coil generating electromagnetic force through interaction with the magnets and a vibrating mass body; and an elastic member joined to the fixing unit and the vibration unit to provide elastic force. | 04-05-2012 |
| 20120080401 | METHOD OF FABRICATING MULTILAYER PRINTED CIRCUIT BOARD - A method of fabricating a multilayer printed circuit board includes preparing a first substrate, and preparing a second substrate, in parallel to the formation of the first substrate, that is, at the same time of the formation of the first substrate, by forming a third inner circuit pattern on one surface of a third insulating layer and forming a window on the other surface of the third insulating layer. | 04-05-2012 |
| 20120080224 | Circuit board for signal transmission and method of manufacturing the same - Provided is a circuit board for signal transmission and a method of manufacturing the same. The circuit board for signal transmission includes a first insulating layer, a plurality of signal interconnection disposed on the first insulating layer, ground interconnections disposed on the first insulating layer at both sides of the plurality of signal interconnections, a second insulating layer disposed on the first insulating layer including the plurality of signal interconnections and ground interconnections, a first shield layer disposed on the second insulating layer, a first shield wall for electrically connecting the ground interconnections and the first shield layer and passing through the second insulating layer, a second shield layer disposed under the first insulating layer, and a second shield wall for electrically connecting the ground interconnections and the second shield layer and passing through the first insulating layer. | 04-05-2012 |
| 20120079716 | METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD - Disclosed herein is a method of manufacturing a printed circuit board, including: providing a carrier including an insulation layer, first metal foils formed on both sides of the insulation layer, adhesive layers respectively formed on the first metal foils and made of a thermoplastic resin, and second metal foils respectively formed on the adhesive layers; applying resists having openings for forming metal posts onto both sides of the carrier; forming metal plating layers for forming the metal posts in the openings; grinding surfaces of the resists; removing the resist and forming insulation layers on both sides of the carrier; and grinding surfaces of the insulation layers. The method is advantageous in that both sides of a carrier are simultaneously layered, it is possible to prevent a substrate from warping during the process of manufacturing the printed circuit board. | 04-05-2012 |
| 20120079511 | Motor, method for manufacturing the same, and optical disk drive using the same - There are provided a motor capable of preventing scratches from occurring on an outer surface of a rotor case thereof, a method for manufacturing the same, and an optical disk drive using the same. The motor includes a shaft rotatably inserted into a bearing assembly; and a rotor case fixedly fastened to the shaft and rotating together with the shaft, wherein the rotor case is provided with a chamfered part along the outer peripheral edge of the bottom surface thereof. The rotor case includes a rotor hub fastened to anone end of the shaft; an extending part extending in an outer-diameter direction from the rotor hub; and a vertical extending part formed to be vertically extended downwardly in a shaft direction from anthe outer peripheral edge of the extending part and having the chamfered part formed on the bottom end surface thereof. | 03-29-2012 |
| 20120076074 | APPARATUS AND METHOD FOR ESTABLISHING CONTENTION WINDOW IN WIMEDIA WIRELESS NETWORK - There are provided an apparatus and a method for establishing a contention window in a WiMedia wireless network. The contention window establishing apparatus includes: a parsing unit extracting the number of devices that intend to transmit data from a beacon received during a beacon period and an access category (AC) of each device; a calculation unit calculating a transmission probability of each access category (AC) on the basis of the extracted number of devices; and a contention window establishing unit establishing a contention window for each access category (AC) on the basis of the calculated transmission probability, to reduce contentions among the devices and decrease data transmission latency time, thereby maximizing efficiency in data transmission latency time. | 03-29-2012 |
| 20120075818 | EMBEDDED PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed is an embedded printed circuit board, in which electronic devices having different thicknesses can be embedded together, thus achieving highly dense electronic devices, and when electronic devices having considerably different thicknesses are embedded, two electronic devices which are comparatively thinner can be embedded in a perpendicular direction, thus reducing an embedding area and suppressing warping of the printed circuit board, and an insulating member the thickness of which is variably adjusted is interposed between base substrates, so that spaces between the electronic devices are completely filled therewith, thus solving the problem of void defects, resulting in reliable printed circuit boards, and, when a base substrate includes a core made of metal, the printed circuit board can less warp. Also a method of manufacturing the embedded printed circuit board is provided. | 03-29-2012 |
| 20120075643 | Method of revising printing error in PCB - Provided is a method of revising a printing error in a PCB, including acquiring alignment mark coordinates and recognition mark coordinates formed at corners of each sheet through design specification information of the PCB, acquiring distorted alignment mark coordinates and recognition mark coordinates of each sheet through actually measured information of the PCB, calculating coordinate information acquired from the design specification information of the PCB and coordinate information acquired from the actually measured information of the PCB to acquire a revision coefficient, calculating an actual deformation value of the PCB using the revision coefficient, and converting the actual deformation value into deformation data of a binary image applied to the design specification information to be revised, and performing a printing operation on the PCB using the deformation data as a reference. | 03-29-2012 |
| 20120075642 | LASER NAVIGATION MODULE - Disclosed herein is a laser navigation module. A light source emits a laser beam. A housing includes an IR window and a transparent or semitransparent part. The IR window transmits or reflects the laser beam emitted from the light source, and also interrupts transmission of external visible rays. The transparent or semitransparent part allows light emitted in the housing to be transmitted out of the housing. An illuminator is installed in the housing. A light diffusion unit transmits the light emitted from the illuminator to the housing. The light diffusion unit has a re-reflective layer on a portion thereof facing the illuminator. | 03-29-2012 |
| 20120075617 | LASER NAVIGATION MODULE - Disclosed herein is a laser navigation module. A light source emits a laser beam. A housing includes an IR window and a transparent or semitransparent part. The IR window transmits or reflects the laser beam emitted from the light source, and also interrupts transmission of external visible rays. The transparent or semitransparent part allows light emitted in the housing to be transmitted out of the housing. An illuminator is installed in the housing. A light diffusion unit transmits the light emitted from the illuminator to the housing. A re-reflective layer is formed on the upper surface of the light diffusion unit. | 03-29-2012 |
| 20120075236 | TERMINAL WITH TOUCH SCREEN - Disclosed herein is a terminal with a touch screen, including: a main body part including a display and a first touch screen positioned on the display; a folder part including a second touch screen, and transparent dots protruding from the second touch screen; a hinge part connecting one side of the folder part to the main body part so that the folder part is in a closed state or an open state with respect to the main body part; and a controller selectively operating the first touch screen and the second touch screen, whereby the transparent dots are provided on the second touch screen, thereby making it possible to improve operating feeling to at the time of touching the terminal and accomplishing accurate touch. | 03-29-2012 |
| 20120074999 | SCHMITT TRIGGER CIRCUIT OPERATED BASED ON PULSE WIDTH - There are provided a Schmitt trigger circuit that has hysteresis characteristics in which a release point and an operating point are determined based on a width of an inputted pulse. The Schmitt trigger circuit may include a signal/pulse conversion unit that receives an analog signal to generate an input pulse having a width corresponding to a magnitude of the analog signal, a pulse width determination unit that compares the width of the input pulse generated in the signal/pulse conversion unit with a predetermined first threshold width and a second threshold width greater than the first threshold width to output state information indicating the compared result, and an output determination unit that outputs a high signal, when the width of the input pulse is changed from a state of being smaller than the second threshold width to a state of being greater than the second threshold width based on the state information, and outputs a low signal when the width of the input pulse is changed from a state of being greater than the first threshold width to a state of being smaller thali the first threshold width based on the state information. | 03-29-2012 |
| 20120074905 | DEVICE AND METHOD FOR STABILIZING VOLTAGE OF ENERGY STORAGE - Disclosed herein are a device and a method for stabilizing voltage of an energy storage. The device for stabilizing voltage of an energy storage includes: a bypass unit connected to a unit cell in parallel; a controller connected to the unit cell in parallel to monitor voltage of the unit cell and connected to the bypass unit to control turn on/off of the bypass unit; and an analog circuit unit connected to the unit cell in parallel to detect the voltage of the unit cell and turning on the bypass unit when the detected voltage is higher than a preset second reference voltage. | 03-29-2012 |
| 20120074430 | Radiating substrate and method for manufacturing the radiating substrate, and luminous element package with the radiating substrate - Disclosed herein is a radiating substrate radiating heat generated from a predetermined heating element to the outside. The radiating substrate includes polymer resins and graphenes distributed in the polymer resins. | 03-29-2012 |
| 20120073870 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed is a printed circuit board, including a base member, an insulating layer formed on each of both surfaces of the base member so that the surfaces of the base member are flattened, a circuit layer formed on the insulating layer, and a via for connecting the circuit layer formed on one surface of the base member with the circuit layer formed on the other surface of the base member. A method of manufacturing the printed circuit board is also provided. | 03-29-2012 |
| 20120073863 | ANODIZED HEAT-RADIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is an anodized heat-radiating substrate. The anodized heat-radiating substrate is advantageous in that it has good radiation characteristics because an anodized oxide layer is formed on the entire surface of a metal layer. And, the anodized heat-radiating substrate is advantageous in that it has high-density/high accumulation characteristics because it forms multi-layered structure by using the connecting member. | 03-29-2012 |
| 20120073747 | EMBEDDED PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed is an embedded printed circuit board, in which electronic devices having different thicknesses can be embedded together, thus achieving highly dense electronic devices, and when electronic devices having considerably different thicknesses are embedded, two electronic devices which are comparatively thinner can be embedded in a perpendicular direction, thus reducing an embedding area and suppressing warping of the printed circuit board, and an insulating member the thickness of which is variably adjusted is interposed between base substrates, so that spaces between the electronic devices are completely filled therewith, thus solving the problem of void defects, resulting in reliable printed circuit boards, and, when a base substrate includes a core made of metal, the printed circuit board can less warp. Also a method of manufacturing the embedded printed circuit board is provided. | 03-29-2012 |
| 20120072620 | TERMINAL AND WIRELESS COMMUNICATION METHOD THEREOF - There are provided a terminal capable of selecting a suitable wireless module among a plurality of wireless modules depending on a situation and providing an optimal image even in a state in which a display unit is separated from a main body by performing wireless communication, and a wireless communication method thereof. To enable this, the terminal includes a main body generating and transmitting image data in response to an external input; a display unit mountable on or demountable from the main body, receiving the image data from the main body and displaying an image corresponding to the image data; and a wireless communication unit provided in each of the main body and the display unit, switching a wireless communication frequency band on the basis of a transmission rate of the image data and transmitting the image data to the display unit. | 03-22-2012 |
| 20120069603 | ADAPTER POWER SUPPLY - An adapter power supply includes an AC/DC converter converting a commercial AC power into a DC power; a DC/DC converter including a transformer composed of a primary terminal and a secondary terminal in order to output an output power by converting a link voltage of the DC power; and a controller presuming a load current of the output power through a primary current of the transformer and varying the link voltage of the DC power according to variation of the estimated load current. | 03-22-2012 |
| 20120068960 | TOUCH SCREEN AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a touch screen and a method of manufacturing the same. The touch screen includes: a transparent substrate; a transparent electrode formed on the transparent substrate and including a sensing part sensing a touch input and an extension part extending from the sensing part to an edge of the transparent substrate; a wiring electrode formed at the edge of the transparent substrate and spaced apart from the extension part of the transparent electrode; and a conductive paste formed at the edge of the transparent substrate and covering both the extension part and the wiring electrode so as to electrically connect the transparent electrode to the wiring electrode, whereby the transparent electrode is formed after the wiring electrode is formed and the wiring electrode is connected to the transparent electrode through the conductive paste, thereby preventing the transparent electrode from being damaged. | 03-22-2012 |
| 20120068959 | RESISTIVE TOUCH SCREEN - Disclosed herein is a resistive touch screen. The resistive touch screen includes a resistive touch panel configured to include a lower substrate formed with a lower electrode pattern in an active region through which images pass, an upper substrate formed with an upper electrode pattern to be opposite to the lower electrode pattern, and a spacer spacing the upper substrate from the lower substrate in order to contact the upper electrode pattern to the lower electrode pattern by external pressure; and a window bonded to the upper portion of the resistive touch panel by an optical clear adhesive, and including a covering film formed in the outer side region on the lower surface thereof and an elastic suppressing layer formed in the inner side region of the covering film. | 03-22-2012 |
| 20120068738 | DEVICE AND METHOD FOR GENERATING THREE MODE SIGNAL - The device for generating three mode signals includes: a voltage setting block including an input terminal receiving three input signals of driving voltage, open, and ground and setting three voltages according to the three input signals; and an output block including two output terminals and a second node B receiving the three voltages from the voltage setting block, and outputting three combined signals by comparing an input voltage with a reference voltage, whereby only a small number of resistors and amplifiers generates three mode signals to further reduce the chip size than the related art and the external power source is not required to solve the problems of the related art due to noise. | 03-22-2012 |
| 20120068619 | DEVICE FOR CONTROLLING CURRENT OF LED - Disclosed herein is a device for controlling current of an LED including a constant current generator, a current mirror, and a current amplifier, the device controlling current of an LED, comprising: a selector outputting an L signal or an H signal according to an input control signal; and a current changing unit formed by connecting at least one switching unit in parallel, the switching unit including a transistor and a switch connected to the transistor in series. The device for controlling current of an LED adjusts current supplied to the current amplifier using a SEL input without an effect of a noise, thereby making it possible to change the current of the LED without separately changing a resistor. | 03-22-2012 |
| 20120067729 | NICKEL ELECTROPLATING SOLUTION AND CHIP PARTS USING THE SAME - Disclosed herein is a nickel electroplating solution and chip parts using the same, and more particularly, to a nickel electroplating solution including: nickel metal; nickel chloride; boric acid; a first additive of at least one selected from a group consisting of benzene, naphthalene, xylene, sulfonic acid, sodium sulfonate, and saccharine (C | 03-22-2012 |
| 20120067636 | INTERPOSER-EMBEDDED PRINTED CIRCUIT BOARD - Disclosed herein is an interposer-embedded printed circuit board, including: a substrate including a cavity formed in one side thereof and having a predetermined height in a thickness direction of the substrate; an interposer disposed in the cavity and including a wiring region and an insulating region; and a circuit layer formed in the substrate and including a connection pattern connected with one side of the wiring region. The interposer-embedded printed circuit board is advantageous in that an interposer is embedded in a substrate, so that the thickness of a semiconductor package can be reduced, thereby keeping up with the trend of slimming the semiconductor package. | 03-22-2012 |
| 20120067623 | HEAT-RADIATING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein is a heat-radiating substrate, including: a copper substrate; an alumina layer formed on one side of the copper substrate; a first circuit layer formed on the alumina layer; and a second circuit layer formed on the first circuit layer, wherein a heat-radiating element is mounted on a first pad of the first circuit layer or a second pad of the second circuit layer, or is directly mounted on the exposed side of the copper substrate after forming an opening on the alumina layer. | 03-22-2012 |
| 20120066902 | METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD INCLUDING LANDLESS VIA - A method of manufacturing a printed circuit board, including: preparing a double-sided substrate which comprises an insulating layer, a first copper layer formed on one side of the insulating layer and a second copper layer formed on the other side of the insulating layer; forming a via-hole through the second copper layer and the insulating layer; forming a plating layer on an inner wall of the via-hole; and forming, on the double-sided substrate, a via, a first circuit layer including a circuit pattern that is formed on a surface of the via having a minimum diameter and has a line width smaller than the minimum diameter of the via, and a second circuit layer including a lower land. | 03-22-2012 |
| 20120064436 | INTERCONNECTING PLATE FOR SOLID OXIDE FUEL CELL AND MANUFACTURING METHOD THEREOF, AND SOLID OXIDE FUEL CELL USING THE INTERCONNECTING PLATE - Disclosed herein are an interconnecting plate for a solid oxide fuel cell, a manufacturing method thereof, and a solid oxide fuel cell using the interconnecting plate. The interconnecting plate for a solid oxide fuel cell includes a metal substrate; and a conductive ceramic protective layer surrounding the metal substrate, wherein the ceramic protective layer is formed by disposing and stacking the metal substrate between a pair of ceramic sheets. | 03-15-2012 |
| 20120064433 | MATERIAL FOR SOLID OXIDE FUEL CELL, CATHODE INCLUDING THE MATERIAL, AND SOLID OXIDE FUEL CELL INCLUDING THE MATERIAL - A material for a solid oxide fuel cell, the material including a lanthanum metal oxide having a perovskite-type crystal structure; and a ceria metal oxide, wherein the ceria metal oxide includes at least one material selected from the group consisting of metal oxides represented by Formula 1 below and metal oxides represented by Formula 2: | 03-15-2012 |
| 20120064432 | SOLID OXIDE FUEL CELL - Disclosed herein is a solid oxide fuel cell. A solid oxide fuel cell | 03-15-2012 |
| 20120064428 | SOLID OXIDE FUEL CELL MODULE - Disclosed herein is a solid oxide fuel cell module. The solid oxide fuel cell module according to the present invention includes: a plurality of unit cells each formed by laminating an electrolyte and a cathode in this order on an outer circumferential surface of an anode support formed in a tubular shape; and one or more metal foam connection plates each formed in a plate shape having a predetermined thickness, the metal foam connection plate having grooves formed on one surface thereof in a thickness direction such that the unit cells are respectively received in the grooves. The present invention need not perform a complicated wiring process, unlike the prior art, by employing metal foam connection plates to collect current, thereby simplifying the manufacturing process and reducing the manufacturing costs. | 03-15-2012 |
| 20120063062 | Electrolyte solution composition and energy storage device with the same - Disclosed herein are an electrolyte solution composition and an energy storage device including the same. The electrolyte solution composition contains: a lithium salt including lithium ions; and a solvent made of a material selected from a group consisting of at least one cyclic carbonate compound. The electrolyte solution composition may balancedly maintain characteristics at a room temperature and a high temperature and be used for pre-doping lithium ions, thereby making it possible to improve pre-doping efficiency. | 03-15-2012 |
| 20120063061 | Electrolyte solution composition and energy storage device including the same - Disclosed herein are an electrolyte solution composition and an energy storage device including the same. The electrolyte solution composition contains: a lithium salt including lithium ions; and a solvent made of a material selected from a group consisting of at least one cyclic carbonate compound and propionate compound. The electrolyte solution composition may balancedly maintain characteristics at a room temperature and a low temperature and be used for pre-doping lithium ions, thereby making it possible to improve pre-doping efficiency. | 03-15-2012 |
| 20120062742 | Black box having function of lane recognition and method of processing image using the same - There are provided a black box having a function of lane recognition and a method of processing an image using the same. The black box having a function of lane recognition includes: an image photographing module having a first angle of view and photographing a first image taken towards the front of a vehicle; an image storing module compressing and storing the photographed first image; an image cropping module cropping a second image within a second angle of view smaller than the first angle of view of the photographed first image; and a lane departure sensing module extracting a lane from the cropped second image and sensing the lane departure of the vehicle based on the extracted lane, thereby making it possible to reduce cost and efficiently utilize the internal space of a vehicle. | 03-15-2012 |
| 20120062629 | Piezo-electric inkjet print head and apparatus for driving the print head - Disclosed herein are a piezo-electric inkjet print head and an apparatus for driving the print head. The piezo-electric inkjet print head includes: a pressure chamber; a piezo-electric actuator applying a driving force for discharging ink to the pressure chamber; and a pulse applying unit applying a driving pulse to the piezo-electric actuator. The exemplary embodiment of the present invention can obtain the stable discharge characteristics even at the time of discharging at a high frequency of 30 kHz or more by forming the driving waveform of the inkjet head under the condition of measuring the unique vibration period owned by the inkjet head and simultaneously generating constructive interference and destructive interference against the vibrations. | 03-15-2012 |
| 20120062507 | CAPACITIVE TOUCH SCREEN AND MANUFACTURING METHOD THEREOF - Disclosed herein are a capacitive touch screen and a manufacturing method thereof. The capacitive touch screen includes a base member on which a plurality of electrode patterns are formed; a conductive adhesive member formed on ends of the electrode patterns; and a window disposed on an upper side of the base member and having a plurality of electrode wirings formed in the outer side thereof to be conducted with the electrode patterns by the conductive adhesive member and to be opposite to the electrode patterns. | 03-15-2012 |
| 20120062506 | CAPACITIVE TOUCH SCREEN - Disclosed herein is a capacitive touch screen. The capacitive touch screen is formed with a first type of electrode patterns formed in plural so as to prevent electrode wirings from being formed in a region through which images pass and a second type of electrode patterns having unique coordinate information so as to improve touch sensitivity of an outside region. | 03-15-2012 |
| 20120062505 | CAPACITIVE TOUCH PANEL AND METHOD OF MANUFACTURING THE SAME - Disclosed is a capacitive touch panel, which includes a transparent substrate, transparent electrodes formed on one surface of the transparent substrate, and electrode wires formed on the other surface of the transparent substrate, wherein the transparent substrate includes through holes which are formed therethrough and are filled with a filler so that the transparent electrodes are electrically connected with the electrode wires, and in which the patterned transparent electrodes are connected with the electrode wires by the through holes formed on the transparent electrodes, thus increasing the force of adhesion between the electrode wires and the transparent electrodes, and also, the through holes are filled with a filler and thus the transparent electrodes and the electrode wires are electrically connected with each other, thus reducing contact resistance. | 03-15-2012 |
| 20120062504 | TOUCH SCREEN AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a touch screen and a method of manufacturing the same. The touch screen includes a transparent substrate, a transparent electrode formed on the transparent substrate and adopted for sensing a change in capacitance when a touch input is performed, an adhesive layer formed on the transparent substrate in which the transparent electrode is formed, a window plate bonded with the transparent substrate by the adhesive layer, and a circular polarization-coating layer coated on the window plate and adopted for transmitting light in one direction, whereby a circular polarization coating layer may block reflected light from an inside of the touch screen, thereby improving visibility of the touch screen. | 03-15-2012 |
| 20120062478 | TOUCH PANEL - Disclosed herein is a touch panel. The touch panel according to the present invention includes a first adhesive layer bonding an edge of an image display device to an edge of a window so that a predetermined space is partitioned between the image display device and the window; a first transparent substrate provided in the predetermined space and having a first transparent electrode formed on one surface thereof, a second transparent substrate provided in the predetermined space and having a second transparent electrode formed on one surface thereof, and a second adhesive layer bonding an edge of the first transparent electrode to an edge of the second transparent electrode so that the first transparent electrode faces the second transparent electrode and an air gap is provided between the first transparent electrode and the second transparent electrode. | 03-15-2012 |
| 20120062325 | POWER AMPLIFIER CIRCUIT - There is provided a power amplifier circuit capable of improving cross isolation between a high frequency band power coupler and a low frequency band power coupler, by directly transmitting power to the high frequency band power coupler and the low frequency band power coupler from a power amplifier, and forming a predetermined inductance circuit or an LC resonance circuit in a line transmitting the power to the high frequency band power coupler. The power amplifier circuit may include a power amplifying unit supplied with power from the outside and amplifying an input signal, a coupling unit having a high frequency band power coupler and a low frequency band power coupler, and an isolation unit including a first power line and a second power line, wherein the first power line has an inductor blocking signal interference generated in a predetermined frequency band. | 03-15-2012 |
| 20120062324 | RF POWER AMPLIFIER - An RF power amplifier includes an RF choke coil, a power amplification circuit unit, and an electrostatic discharge (ESD) protection unit. The RF choke coil is connected to a voltage terminal through which an operating voltage is applied. The RF choke coil supplies the operating voltage and interrupts an RF signal. The power amplification circuit unit is supplied with the operating voltage through the RF choke coil. The power amplification circuit unit amplifies an input signal inputted through an input terminal and outputs the amplified input signal through an output terminal. The ESD protection unit is connected between a first connection node and a ground. The ESD protection unit bypasses an ESD voltage from the first connection node to the ground, the first connection node being a node between the voltage terminal and the RF choke coil. | 03-15-2012 |
| 20120061833 | EMBEDDED BALL GRID ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF - Disclosed herein are an embedded ball grid array substrate and a manufacturing method thereof. The embedded ball grid array includes: a core layer having a cavity therein; a semiconductor device embedded in the cavity of the core layer; a first circuit layer having a circuit pattern including a wire bonding pad formed thereon; a second circuit layer having a circuit pattern including a solder ball pattern formed thereon; and a wire electrically connecting the semiconductor device to the wire bonding pad. | 03-15-2012 |
| 20120061571 | LASER NAVIGATION MODULE - Disclosed herein is a laser navigation module. The laser navigation module includes a light source emitting laser light. An IR window allows the laser light emitted by the light source to pass therethrough and be reflected thereon, and prevents the entry of visible light. A housing is equipped with the IR window and includes a transparent or semi-transparent part. An illuminator is provided in the housing to emit light to the outside of the housing. The laser navigation module further includes an opaque part or a blocking layer for selective blocking, thus enabling light to be emitted to a desired area of the housing, therefore making it convenient to use even in a dark place. | 03-15-2012 |
| 20120061557 | LASER NAVIGATION MODULE - Disclosed herein is a laser navigation module. The laser navigation system includes a light source, one or more illumination devices, and a re-reflecting layer. The light source emits laser light. The housing is configured such that a window for allowing the laser light emitted by the light source to pass therethrough, reflecting the laser light, and blocking entry of visible light is mounted and such that a transparent or translucent portion for diffusing internally diffused light to an outside is formed. The illumination devices are mounted inside the housing. The light diffusion member transfers light emitted by the illumination devices to the housing, and includes a re-reflecting layer partially formed on the side of the light diffusion member opposite the illumination devices. | 03-15-2012 |
| 20120061229 | APPARATUS FOR SEPARATION AND CONDENSATION OF MIXTURE - Disclosed herein is an apparatus for separation and condensation of a mixture. The apparatus for separation and condensation of a mixture includes: a base part: a sample vaporizing unit mounted on the base part, and vaporizing the stored sample; a collecting unit mounted on the base part, in order to collect the sample; a driver moving the collecting unit pass; and a control device controlling the sample vaporizing unit to vaporize the sample and controlling the driver to move the collecting unit, whereby a small amount of mixture can be separated automatically. | 03-15-2012 |
| 20120061132 | Printed circuit board having metal bumps - A printed circuit board having a metal bump, including: an upper circuit layer including a circuit pattern embedded in an upper part of an insulating layer, the circuit pattern being made of electroconductive metal; wherein the metal bump is integrally formed with the circuit pattern and protruding from the circuit pattern and above the insulating layer. | 03-15-2012 |
| 20120061017 | METHOD OF MANUFACTURING CAPACITIVE TOUCH SCREEN - Disclosed herein is a method of manufacturing a capacitive touch screen, including: forming transparent electrodes on an upper surface of a lower transparent film; forming electrode wirings on a lower surface of an upper transparent film; and bonding the transparent electrodes to the electrodes wirings to be closely adhered to each other, whereby it prevents the transparent electrodes from being damaged or deformed due to heat, thereby making it possible to improve reliability and accuracy of the manufacturing process. | 03-15-2012 |
| 20120060887 | ASYMMETRIC THERMOELECTRIC MODULE AND METHOD OF MANUFACTURING THE SAME - Disclosed is an asymmetric thermoelectric module, which includes a plurality of first-type thermoelectric semiconductor elements, a plurality of second-type thermoelectric semiconductor elements, a plurality of pairs of assistant layers having different melting points and disposed on the upper and lower surfaces of the first-type and second-type thermoelectric semiconductor elements, and a pair of substrates. | 03-15-2012 |
| 20120060369 | METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD HAVING LANDLESS VIA HOLE - Method of manufacturing printed circuit board, including: providing a substrate including a first circuit layer having a lower land of a via; forming an insulating layer on the first circuit layer; forming a via hole in the insulating layer; filling the via hole with a first metal, thus forming a via; forming a seed layer with a second metal on the insulating layer and an exposed surface of the via; applying a resist film on the seed layer, and forming a resist pattern having an opening for a second circuit layer with a width formed on the via being smaller than a width of the via; plating a circuit region defined by the opening with a third metal, thus forming a plating layer formed of the third metal; and removing the resist film, and selectively removing an exposed portion of the seed layer, thus forming a second circuit layer. | 03-15-2012 |
| 20120060365 | Method of manufacturing a printed circuit board having metal bumps - A method of manufacturing a printed circuit board having a metal bump, including: forming a recess for creation of the metal bump on a first carrier, forming a first barrier layer on the first carrier, and forming an upper circuit layer on the first barrier layer, the upper circuit layer including a metal bump charged in the recess and a circuit pattern; forming a second barrier layer on a second carrier, and forming a lower circuit layer on the second barrier layer; preparing an insulating layer, and transferring the upper and lower circuit layers to the insulating layer; removing the first and second carriers; and removing the first and second barrier layers. | 03-15-2012 |
| 20120060335 | SOLID ELECTROLYTIC CONDENSER AND APPARATUS AND METHOD FOR FORMING INSULATING LAYER OF THE SOLID ELECTROLYTIC CONDENSER - The present invention provides a solid electrolytic condenser including a condenser element with anode polarity; an anode wire with one side inserted inside the condenser element and the other side projected outside the condenser element; and an insulating layer formed by coating one surface of the condenser element and an exposed region of the anode wire adjacent to the one surface of the condenser element with a liquid insulating material through a non-contact scattering method and an apparatus and a method for forming the insulating layer of the solid electrolytic condenser. | 03-15-2012 |
| 20120058410 | SOLID OXIDE FUEL CELL - Disclosed herein is a solid oxide fuel cell. The solid oxide fuel cell includes: a tubular first electrode support layer formed with a plurality of first passages; an inner electrolyte layer formed in the first electrode support layer; an inner second electrode layer formed on the inner surface of the first electrolyte layer and forming an inner second passage; an outer electrolyte layer formed on the outer surface of the first electrode support layer; and an outer second electrode layer formed on the outer surface of the second electrolyte layer and adjacent to the outer second passage. | 03-08-2012 |
| 20120058406 | SOLID OXIDE FUEL CELL - Disclosed herein is a solid oxide fuel cell. The solid oxide fuel cell | 03-08-2012 |
| 20120058026 | Microfluidic ejection device and method of manufacturing the same - There are disclosed a microfluidic ejection device and a method of manufacturing the same. The microfluidic ejection device includes a flow path plate having an inlet into which a microfluid is drawn, a pressure chamber connected with the inlet and having formed therein, a plurality of chamber units divided by a plurality of partitions, and a nozzle connected with the pressure chamber and ejecting the microfluid by integrating the microfluid, having passed through the plurality of chamber units, into a single flow path; and actuators formed on an upper portion of the flow path plate so as to respectively correspond to the plurality of chamber units and providing driving force for ejecting the microfluid from the pressure chamber to the nozzle. The microfluidic ejection device has superior microfluidic ejection performance because variations in pressure within the pressure chamber can be accurately adjusted. | 03-08-2012 |
| 20120057796 | APPARATUS AND METHOD OF REDUCING NOISE - There are provided an apparatus and a method of reducing noise. The apparatus of reducing noise includes: an edge determining module determining whether each pixel of an image corresponds to an edge; a low pass filter module performing low pass filtering of the image in two directions, i.e., vertical and horizontal directions and performing low pass filtering only for the pixel determined not to be the edge; a filter selecting module selecting a filter having a flexible size to be applied to a mask region for each of the images low pass filtered in the two directions based on the average brightness of the entire region and the average brightness of the mask region having a predetermined size; a sigma filter module sigma filtering the mask region using the selected filter for each of the images low pass filtered in the two directions; and an averaging module averaging the image sigma filtered in the two directions, thereby making it possible to adaptively reduce noise and prevent loss of the edge due to blurring of the image. | 03-08-2012 |
| 20120057274 | Lithium ion capacitor - Provided is a lithium ion capacitor. The lithium ion capacitor includes an electrode cell provided with cathodes and anodes alternately disposed with the separators interposed therebetween, a first electrolyte in a phase of gel arranged on at least one surface of the anode and a second electrolyte in a phase of liquid immerged into the electrode cell. | 03-08-2012 |
| 20120056948 | Solution storage tank and inkjet printer head assembly with the same - Disclosed herein is an inkjet printer head assembly. The inkjet printer head assembly according to exemplary embodiments of the present invention includes: a storage unit having an inner space in which a solution is stored; a fluid supplier supplying fluid to the storage unit; and an agitator provided in the storage unit and driven by the fluid supplied to the storage unit from the fluid supplier to agitate the solution. | 03-08-2012 |
| 20120056869 | ORGANIC LIGHT EMITTING DIODE DRIVER - There is provided an organic light emitting diode driver capable of compensating for pixel deterioration in real time during the driving of pixels by selectively compensating pixels, requiring compensation, for the deterioration thereof. The organic light emitting diode driver includes: a converter converting input data into compensation data used to selectively compensate for pixel deterioration according to whether or no the input data has been calibrated; a driver driving pixels of a pixel unit according to the compensation data from the converter; and a compensator providing the converter with a deterioration compensation signal according to deterioration information obtained from a pixel driven by the driver. | 03-08-2012 |
| 20120056866 | ACTIVE MATRIX ORGANIC LIGHT EMITTING DIODE DISPLAY HAVING RESET FUNCTION - There is provided an active matrix organic light emitting diode (AMOLED) display including a driver generating analog driving signals based on previously prepared driving data; a pixel unit including an organic light emitting diode connected between first and second power supply terminals receiving first and second power, respectively, charging values equivalent to the driving data according to the driving signals and simultaneously detecting the driving signals in order to detect deterioration in a preset tracking period, allowing current to flow through the organic light emitting diode according to the values charged in the tracking period in a preset holding period, and setting a reset period between the holding period and a tracking period subsequent thereto to reset the charged values; and an ADC detecting a deterioration voltage corresponding to the driving signals having deterioration information of the organic light emitting diode of the pixel unit in the tracking period. | 03-08-2012 |
| 20120056845 | TOUCH SCREEN - Disclosed herein is a touch screen including a touch panel and a window disposed at a top side of the touch panel. In particular, a groove part is formed in the window or the lower substrate and the touch panel is configured in the groove part to reduce an interface of the touch panel, exposed to the outside, thereby making it possible to prevent infiltration of moisture and oil. | 03-08-2012 |
| 20120056844 | CAPACITIVE TOUCH SCREEN - Disclosed herein is a capacitive touch screen. The capacitive touch screen includes: a base member including an active region through which an image generated in a display passes and an inactive region which extends from the active region and is formed to be stepwise; a plurality of electrode patterns which intersects with the top and the bottom of the base member and are disposed in the active region; electrode wirings which are connected to the electrode patterns disposed in the active region and extend to the inactive region; and a window formed on the top of the base member. | 03-08-2012 |
| 20120056843 | RESISTIVE TOUCH PANEL - Disclosed herein is a resistive touch panel, including: a transparent substrate; a transparent electrode formed on the transparent substrate and including a conductive polymer; and a curing agent applied to the transparent electrode, the curing agent undergoing a hydrolysis reaction with the conductive polymer to cure the transparent electrode. The resistive touch panel is advantageous in that, even when a transparent electrode is formed using a conductive polymer having low hardness, the hardness of the transparent electrode is improved by the application of the curing agent, so that it is possible to prevent the contact resistance between the transparent electrodes facing each other from changing in relation to the pressure intensity of input means, thereby improving the touch sensitivity and performance of the resistive touch panel. | 03-08-2012 |
| 20120056705 | LAYERED INDUCTOR AND MANUFACTURING METHOD THEREOF - There is provided a layered inductor and a manufacturing method of the layered inductor. There is provided a layered inductor, comprising: a main body in which a plurality of non-magnetic layers are stacked; coil parts ha-ving a plurality of conductor patterns and a plurality of via electrodes formed on the plurality of non-magnetic layers; a plurality of magnetic paths formed in the inner central portion of the coil parts and passing the magnetic flux induced from the coil parts therethrough; and first and second external electrodes formed on the external surface of the main body to be connected to both ends of the coil part, respectively. | 03-08-2012 |
| 20120055901 | SUBSTRATE FABRICATING APPARATUS AND SUBSTRATE FABRICATING METHOD - Disclosed herein are a substrate fabricating apparatus and a substrate fabricating method. The substrate fabricating apparatus includes: a first injector that injects a first etchant to a circuit layer formed as an outermost layer of a base substrate to form first type of ruggedness; and a second injector that injects a second etchant to the circuit layer formed with the first type of ruggedness to form second type of ruggedness. The present invention provides the substrate fabricating apparatus and the substrate fabricating method that inject different etchants to the circuit layer to form different ruggedness, thereby making it possible to widen the specific surface area of the circuit layer to improve adhesion between the circuit layer and the protective layer. | 03-08-2012 |
| 20120055800 | METHOD FOR FORMING PLATING LAYER OF PRINTED CIRCUIT BOARD - Disclosed herein is a method for forming a plating layer of a printed circuit board. A deviation in plating thickness of a copper plating layer filled in a circuit pattern part and a through-hole part in a SIP product group having a narrow through-hole pitch and a large through-hole volume may be reduced. To this end, there is provided a method for forming a plating layer of a printed circuit board, the method including: processing a though-hole in a copper clad lamination (CCL); forming a seed plating layer in the through hole; applying a resist on the CCL and the seed plating layer and exposing and developing the resist; forming a primary plating layer on the seed plating layer; forming a copper plating layer on the primary plating layer; and removing the resist remaining on the primary plating layer and the seed plating layer to thereby form patterns. | 03-08-2012 |
| 20120055706 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a printed circuit board, including: a core layer having a first circuit layer formed on an outer surface thereof; and a capacitor layer stacked on the core layer to be electrically connected to the first circuit layer, having an inner insulating layer therebetween, and including a plurality of conductive projection parts formed on the opposite surfaces of an upper electrode layer and a lower electrode layer and a dielectric layer formed between the upper electrode layer and the lower electrode layer. | 03-08-2012 |
| 20120055698 | SINGLE LAYER PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURNING THE SAME - Disclosed herein are a single layer printed circuit board and a method for manufacturing the same. The single layer printed circuit board includes: an insulating layer having a plurality of holes, which are filled with a plating layer to form circuit patterns; a first protection layer stacked on one surface of the insulating layer to protect the circuit patterns formed in the insulating layer, the first protection layer having holes for exposing portions of the plating layer of the insulating layer; and a second protection layer formed on the opposite surface of the surface of the insulating layer, on which the first protection layer is formed, to protect the circuit patterns formed in the insulating layer. According to the present invention, a thin type printed circuit board can be provided. | 03-08-2012 |
| 20120055628 | Doping apparatus for manufacturing electrode of energy storage device, and method for manufacturing electrode with the same - Disclosed herein is a doping apparatus for manufacturing an electrode of an energy storage device. The doping apparatus according to the exemplary embodiment of the present invention includes: a doping chamber body providing a doping space where a process of doping lithium ions onto an electrode plate is performed; a plurality of doping plates laminated vertically in the doping chamber body and containing lithium; and an electrode plate feeder feeding the electrode plate so that the electrode plate passes through gaps among the doping plates. | 03-08-2012 |
| 20120055610 | CERAMIC SUBSTRATE, METHOD OF MANUFACTURING THE SAME, AND ELECTRICAL DEVICE USING THE SAME - Provided are a ceramic substrate, a method of manufacturing the same, and an electrical device using the same. A ceramic substrate includes a first laminated body, a second laminated body and an adhesive part. The first laminated body includes a predetermined electrode formed therein. The second laminated body is laminated on and electrically connected to the first laminated body. Also, the adhesive part is intervened between the first laminated body and the second laminated body to adhere the first and second laminated bodies through interfacial reaction. | 03-08-2012 |
| 20120055531 | SOLAR CELL MODULE AND METHOD OF MANUFACTURING THE SAME, AND MOBILE APPARATUS WITH THE SOLAR CELL MODULE - The present invention provides a solar cell module including: a light transmitting plate having light transmittance; solar cells having bonding pads and conductive bumps bonded to the bonding pads; an adhesive film disposed between the light transmitting plate and the solar cells to bond the light transmitting plate and the solar cells; and a conductive pad disposed by being inserted in the adhesive film and surrounding and electrically connecting the conductive bumps of the adjacent solar cells. | 03-08-2012 |
| 20120047523 | Spindle motor and disk driver having the same - Disclosed herein is provided a spindle motor and a disk driver having the same. There is provided a spindle motor including: a sleeve rotatably supporting a shaft; a bush combined with the top portion of the shaft to be rotated together with the shaft; a rotor case including a cylindrical wall part combined with the outer peripheral surface of the bush; an air flow spreading part formed on the axial bottom part of the bush and spreading the air flow generated between the shaft and the sleeve to the radial outer side when the shaft is rotated; and a sealing part formed on the axial bottom portion of the bush and formed between the cylindrical wall part and the air flow spreading part to seal oil when the shaft is rotated. | 02-23-2012 |
| 20120045570 | Plating solution for forming tin alloy and method of forming tin alloy film using the same - There are provided a plating solution for forming a tin alloy, and a method of forming a tin alloy film by using the same. The plating solution for forming a tin alloy, the plating solution includes a tin salt and one or more metal salts each comprising indium or zinc, and at least one reducing agent selected from the group consisting of boron hydride compounds, the reducing agent providing electrons to metal ions of the metal salts and tin ions of the tin salt to form a tin alloy film on an object to be plate. | 02-23-2012 |
| 20120044613 | Electrolyte for lithium ion capacitor and lithium ion capacitor including the same - There are provided an electrolyte for a lithium ion capacitor, and a lithium ion capacitor including the same. The electrolyte includes a lithium salt having divalent anions. The lithium ion capacitor including the electrolyte may have high capacitance and stability, even at high temperatures. | 02-23-2012 |
| 20120044591 | Camera module - Disclosed herein is a camera module directly mountable on a main substrate without a socket. | 02-23-2012 |
| 20120044360 | DETERIORATION SENSING APPARATUS FOR DISPLAY DEVICE - Disclosed is a deterioration sensing apparatus for a display device, capable of rapidly sensing deterioration by pre-charging a sensing voltage in adjacent pixels while a deterioration of a single pixel is sensed in a display device having a plurality of pixels, in, particular, an organic light emitting diode panel. | 02-23-2012 |
| 20120044357 | Image processing apparatus and method for night vision - There are provided an image processing apparatus and an image processing method for night vision that can generate a night vision image in which the overall quality thereof is maintained to be excellent and an obstacle is easily distinguished. The image processing apparatus for night vision includes: a brightness improving unit improving the brightness of an inputted infrared image; an obstacle judging unit judging whether an obstacle is present by analyzing an infrared image in which brightness is improved by the brightness improving unit; an obstacle region separating unit separating an image of a region judged as the obstacle by the obstacle judging unit; and an image synthesizing unit synthesizing the image of the region judged as the obstacle separated by the obstacle region separating unit with the inputted infrared image. | 02-23-2012 |
| 20120044271 | ACTIVE MATRIX ORGANIC LIGHT EMITTING DIODE DISPLAY HAVING DETERIORATION DETECTION FUNCTION IN PROGRAMMING PERIOD - There is provided an active matrix organic light emitting diode display including: a data driving unit converting previously prepared correction data into a correction signal and generates a driving signal according to the analog correction signal; a pixel unit having an organic light emitting diode (OLED) between first and second power supply terminals receiving first and second powers, respectively, charging a value corresponding to the correction data according to the driving signal in a predetermined programming period, detecting the driving signal in order to detect deterioration, and allowing current to flow through the OLED according to the value charged in the predetermined programming period in a predetermined holding period; and an ADC detecting deterioration voltage corresponding to the driving signal having deterioration information of the OLED of the pixel unit in the holding period. | 02-23-2012 |
| 20120044269 | ORGANIC LIGHT EMITTING DIODE DRIVER - There is provided an organic light emitting diode driver capable of compensating for pixel deterioration in real time during the driving of pixels by selectively compensating pixels, requiring compensation, for the deterioration thereof, and precisely setting calibration data by removing an IR drop across a transistor, employed as a switch in the pixels, by calculating a difference between at least two representative values of different gray scale ranges among predetermined gray scale ranges. | 02-23-2012 |
| 20120044235 | ACTIVE MATRIX ORGANIC LIGHT EMITTING DIODE DISPLAY - There is provided an active matrix organic light emitting diode display, including a data driver converting pre-prepared correction data into an analog correction signal and generating a driving signal according to the analog correction signal, a selector selecting a charging path for programming, according to the driving signal in a preset programming period and selecting a deterioration detection path in a preset emission period, a pixel unit including an organic light-emitting diode connected between a power supply receiving power and a ground, charging a value corresponding to the correction data according to the driving signal in the programming period, and allowing current to flow to the organic light-emitting diode according to the charged value in the emission period, and an ADC detecting deterioration voltage having deterioration information of the organic light-emitting diode of the pixel unit in the emission period. | 02-23-2012 |
| 20120043945 | APPARATUS FOR EQUALIZING VOLTAGE USING TIME SWITCH - There is provided an apparatus for equalizing voltage using a time switch. The apparatus for equalizing voltage includes a plurality of energy storage unit cells connected in series; a single first balance capacitor connected with each energy storage unit cell in parallel through the first switch module for equally charging voltage between the plurality of energy storage unit cells; and a first switch module including a plurality of switches disposed between each energy storage unit cell and the first balance capacitor to sequentially open and close the connection between each energy storage unit cell and the first balance capacitor, whereby the voltage unbalance between the energy storage unit cells can be prevented at low cost. | 02-23-2012 |
| 20120043855 | Inertial Sensor - Disclosed herein is an inertial sensor of the present invention. An inertial sensor | 02-23-2012 |
| 20120043842 | Hydrodynamic bearing assembly and motor including the same - Disclosed are a hydrodynamic bearing assembly and a motor including the same. The hydrodynamic bearing assembly may include a sleeve supporting a shaft to allow a top portion of the shaft to be protruded upwardly in an axial direction and including a coupling part of which a bottom end is protrusively formed, a base cover coupled with a bottom of the sleeve in the axial direction while maintaining a gap therebetween, and support part formed at an outer end portion of the base cover and formed to be protruded in the axial direction such that an outer peripheral surface thereof is in contact with and coupled to an inner peripheral surface of the coupling part of the sleeve. | 02-23-2012 |
| 20120043811 | POWER SUPPLY HAVING IMPROVED SYSTEM EFFICIENCY - A power supply having improved system efficiency includes: a standby stage converting a DC voltage into an operating voltage and a first standby voltage, which have a preset magnitude, and supplying the first standby voltage to a standby output terminal; a DC/DC stage supplied with the operating voltage from the standby stage, converting the DC voltage into a main voltage having a preset magnitude, and supplying the main voltage to a main output terminal; and a main/standby stage converting the main voltage from the DC/DC stage into a second standby voltage having a preset magnitude, and supplying the second standby voltage to the standby output terminal. | 02-23-2012 |
| 20120043653 | LEAD PIN FOR PACKAGE SUBSTRATE, AND METHOD FOR MANUFACTURING PACKAGE SUBSTRATE WITH THE SAME - Disclosed herein is a lead pin for a package substrate. The lead pin for the package substrate according to the exemplary embodiment of the present invention includes a head part having one surface opposite to the package substrate and the other surface that is an opposite side to the one surface; and a connection pin having a pin shape bonded to the other surface of the head part, wherein the head part has a concave depression part toward the package substrate. | 02-23-2012 |
| 20120043128 | Printed circuit board and method of manufacturing the same - The present invention provides a multilayer printed circuit board and a method for manufacturing the same. The printed circuit board includes: an inner circuit layer which is disposed on a first insulating layer; a via land which is disposed on the first insulating layer to be spaced apart from the inner circuit layer and has a hole; a second insulating layer which is disposed on the first insulating layer including the inner circuit layer and the via land; first and second outer circuit layers which are disposed on outer surfaces of the first and second insulating layers, respectively; and a via which passes through the hole of the via land and the first and second insulating layers and electrically interconnects the first and second outer circuit layers. | 02-23-2012 |
| 20120043126 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a printed circuit board and a method of manufacturing the same, including: forming a protective layer on which a cover film is stacked on a base substrate; exposing the protective layer on which the cover film is stacked to photosensitize the protective layer and photodegrade the cover film; and developing the photodegraded cover film and the photosensitized protective layer to form an opening exposing a pad unit of a circuit layer which is an outermost layer of the base substrate on the protective layer, whereby the productivity of the printed circuit board can be improved without performing a process of separating a cover film. | 02-23-2012 |
| 20120043122 | BOARD WITH FINE PITCH BUMP AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a board with a fine pitch bump and a method of manufacturing the same. The method of manufacturing a board with a fine pitch bump includes: forming a solder resist layer by stacking a solder resist on a core layer having a circuit pattern formed thereon; forming a seed layer on an upper surface of the solder resist layer; forming a dry film layer by stacking a dry film on an upper surface of the seed layer; forming holes by simultaneously drilling the solder resist layer, the seed layer, and the dry film layer; and forming a copper post bump by performing copper filling plating in the holes and removing the seed layer and the dry film layer. The holes having the same size are simultaneously drilled into the solder resist layer and the dry film layer to improve a matching degree of the copper post bump, thereby making it possible to form the fine pitch bump. | 02-23-2012 |
| 20120043121 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a printed circuit board and a method of manufacturing the same. The printed circuit board includes: an insulating layer; a first circuit layer including a first metal layer and a first plating layer provided on an outer side of the first metal layer and embedded in one surface of the insulating layer; a second circuit layer including a second metal layer and a second plating layer provided on an outer side of the second metal layer and embedded in the other surface of the insulating layer; and a bump interconnecting the first circuit layer and the second circuit layer while penetrating through the insulating layer. The bump is used, such that there is no need to perform hole plating. Therefore, an increase in the surface plating thickness due to the hole plating is previously prevented. | 02-23-2012 |
| 20120042921 | Method for manufacturing thermoelectric module and thermoelectric module manufactured from the same - The present invention provides a method for manufacturing a thermoelectric module and a thermoelectric module manufactured from the same. The method includes the steps of: forming each of first and second green laminates; forming first and second preliminary electrodes by printing a conductive paste on each of the first and second green laminates; disposing thermoelectric elements on any one of the first and second preliminary electrodes; stacking the first and second green laminates in such a manner that the thermoelectric elements are interposed between the first and second preliminary electrodes; and firing the stacked first and second green sheet laminates, thereby forming the first and second electrodes, and first and second ceramic substrates, and simultaneously bonding the first ceramic substrate to the first electrode, the first and second electrodes to the thermoelectric elements, and the second ceramic substrate to the second electrode. | 02-23-2012 |
| 20120042513 | Manufacturing method of printed circuit board embedded chip - A method of manufacturing an electronic component embedded printed circuit board including: mounting an electronic component on an insulating layer in a fluidal condition so that a part of the electronic component is inserted into the insulating layer and another part of the electronic component is protruded out of a top surface of the insulating layer by pressing the electronic component onto the insulating layer; fixing the electronic component by curing the insulating layer; forming a metallic seed layer on a top surface of the insulating layer including an exposed surface of the electronic component; forming a plating layer on the metallic seed layer; forming via-holes at positions on the insulating layer, which correspond to pads of the electronic component and forming circuit patterns electrically conducted with the pads; and forming a solder resist layer including the via-holes electrically connected to the circuit patterns. | 02-23-2012 |
| 20120039095 | BOOST CONVERTER - There is provided a boost converter capable of reducing internal pressure in elements without the employment of a separate snubber by clamping a voltage, transmitted to the elements, to a charging voltage or an output voltage during power conversion. The boost converter includes a transformer including a primary winding receiving input power and a secondary winding electromagnetically coupled to the primary winding and having a predetermined turns ratio therewith; a switching part allowing the input power transmitted to the primary winding to be on or off according to a predetermined switching duty; a clamping part including a link capacitor charged with the input power obtained when the switching part is switched on, and power transformed based on the predetermined turns ratio; and a stabilizing part stabilizing power outputted from the clamping part. | 02-16-2012 |
| 20120039094 | INTERLEAVED TYPE POWER FACTOR CORRECTION CIRCUIT HAVING TRANSFORMER FORMING SEPARATED WINDING STRUCTURE - There is provided an interleaved type power factor correction circuit having a transformer forming a separated winding structure, which is formed by integrating two inductors separately wound around the transformer. The interleaved type power factor correction circuit including a rectifying unit rectifying a commercial alternating current power, a transformer having a first inductor winding and a second inductor winding, a bobbin part, and a core part, a switching unit switching a power transmitted to the first and second inductor windings, a controlling unit controlling a switching operation of the switching unit in order to allow a phase difference between a current and a voltage of the switched power to satisfy a predetermined phase difference, and a stabilizing unit stabilizing the switched power from the switching unit. | 02-16-2012 |
| 20120039050 | ELECTRONIC DEVICE HAVING TRANSMISSION LINE PATTERN EMBEDDED IN CASE AND METHOD FOR MANUFACTURING THE SAME - There are provided an electronic device having a transmission line pattern embedded in a case and a method for manufacturing the same. The electronic device includes a line pattern body embedded in a case and including a line pattern for electrically connecting components to each other, terminal portions respectively disposed at portions of the line pattern corresponding to terminals of the components to be electrically connected, and exposed from the bottom of the case, and connection members connecting the terminals of the components with the terminal portions. | 02-16-2012 |
| 20120038594 | TOUCH SCREEN DEVICE - Disclosed herein is a touch screen device, including: a first transparent electrode formed on one surface of a first transparent substrate to sense a touched input; a second transparent electrode formed on one surface of a second transparent substrate formed to be opposite to the first transparent electrode to sense a touched input; a display formed on the other surface of the second transparent substrate; a first adhesive layer bonding the first transparent substrate to the second transparent substrate; and a second adhesive layer bonding a first connection part formed on an outer side of first transparent substrate to a second connection part formed on an outer side of the display. The touch screen device directly bonds the first transparent substrate to the display, thereby making it possible to provide a high definition image to a user and to reduce infiltration of moisture or the like. | 02-16-2012 |
| 20120038471 | Haptic feedback actuator, haptic feedback device and electronic device - There is provided a haptic feedback actuator, a haptic feedback device and an electronic device. The haptic feedback actuator includes a support plate disposed in a lower portion of a haptic device; one or more actuators disposed on the support plate, each having one end towards a central portion of the support plate and the other end towards a corner of the support plate, and generating vibrations so as to give different types of haptic feedback according to a change in contact pressure applied to the haptic device; and one or more dividing portions, each penetrating the support plate in a thickness direction thereof and dividing the support plate into vibration areas corresponding to the respective actuators. | 02-16-2012 |
| 20120038470 | Haptic feedback device and electronic device having the same - There is provided a haptic feedback device and an electronic device having the same. The haptic feedback device includes a display panel receiving contact pressure applied thereto; an actuator generating vibrations so as to give different types of haptic feedback according to a change in the contact pressure applied to the display panel; a support plate supporting the actuator; a bonding portion provided between an end portion of the actuator in a lengthwise direction thereof and the support plate so as to fix the actuator to the support plate; and a vibration space expanding portion formed to be recessed in a portion of the support plate corresponding to the actuator. | 02-16-2012 |
| 20120038448 | Transformer and display device using the same - There is provided a transformer in which lead wires of a coil are disposed to be separated from each other so as to prevent a short-circuit between the lead wires. The transformer includes a winding unit having a plurality of partitions formed on an outer circumferential surface of a tubular body part; a base provided at one end of the winding unit and including at least one external connection terminal protruding outwardly; a coil wound on a bobbin and having a lead wire connected to the external connection terminal; and a core electromagnetically coupled with the coil to thereby form a magnetic path, wherein the bobbin includes at least one lead wire supporting portion protruding outwardly from the partitions, supporting the lead wire and guiding the lead wire to the external connection terminal. | 02-16-2012 |
| 20120038235 | SPINDLE MOTOR - Disclosed herein is a spindle motor including: a rotating part including a hub coupled to a rotating shaft and a magnet coupled to the hub; and a fixing part including a sleeve supporting the rotating shaft and an armature facing the magnet, wherein the magnet has a contact part formed on an upper end portion thereof in a direction of the rotating shaft, the contact part partially contacting a lower end portion of the hub. | 02-16-2012 |
| 20120038220 | WIRELESS POWER TRANSMISSION APPARATUS AND TRANSMISSION METHOD THEREOF - Disclosed herein are a wireless power transmission apparatus and a transmission method thereof. The wireless power transmission apparatus is configured to include a wireless power transmitter generating a wireless power signal to be wireless transmitted, wirelessly transmitting the generated wireless power signal by a magnetic resonance manner, receiving a reflection wireless power signal to determine whether or not a load apparatus is presented, and supplying power to the load apparatus; and a wireless power receiver connected to the load apparatus and receiving the transmitted wireless power signal by the magnetic resonance manner and supplying it to the connected load apparatus and reflecting the remaining wireless power signal to the wireless power transmitter, whereby a transmission apparatus can recognize a receiving environment and resonance characteristics are improved, without a separate communication device or a system. | 02-16-2012 |
| 20120037588 | Piezoelectric sealing cap and assembly including the same - Disclosed herein is a piezoelectric sealing cap, including: a piezoelectric element generating displacement by a driving voltage; and a sealing part formed to surround the piezoelectric element and sealing a bottle neck when the piezoelectric element is inserted into the bottle neck. | 02-16-2012 |
| 20120036343 | ELECTRONIC APPARATUS AND METER OPERABLE DURING PROGRAM UPDATING - There are provided an electronic apparatus and a meter which are operable during the updating of an operating program and firmware. The electronic apparatus operable during program updating includes an operation unit performing a preset operation, a micro controller controlling an operation result of the operation unit to be stored according to a predetermined period of storing time, and controlling a program received from the outside to be stored, an update controller allowing the program stored during the predetermined period of storing time to be updated in the micro controller, and a storing unit storing the program and the operation result under control of the micro controller. | 02-09-2012 |
| 20120035482 | METHOD FOR ESTIMATING ACOUSTIC VELOCITY OF ULTRASONIC IMAGE AND ULTRASONIC DIAGNOSIS APPARATUS USING THE SAME - Disclosed herein are a method for estimating acoustic velocity of an ultrasonic image and an ultrasonic diagnosis apparatus using the same. The method for estimating acoustic velocity of an ultrasonic image includes: (A) dividing each of the ultrasonic images into a plurality of blocks; (B) extracting contours of ultrasonic images for each block of one frame among the ultrasonic images; (C) calculating and analyzing average luminance values of each block; (D) determining the optimal block number using the average luminance values and selecting the optimal blocks; and (E) estimating and applying the real acoustic velocity, whereby the acoustic velocity is estimated in real time and is applied to the ultrasonic diagnosis apparatus. | 02-09-2012 |
| 20120034892 | HIGH-RATE WIRELESS RECEIVING APPARATUS - There is provided a high-rate wireless receiving apparatus which can effectively receive a wireless signal even in a Non-Line of Sight state by using a millimeter-wave band (e.g., 60 GHz) or a THz frequency band (100 GHz or above). The high-rate wireless receiving apparatus includes an antenna receiving a high-rate wireless signal, a radio frequency processing unit processing the high-rate wireless signal received from the antenna to thereby generate a base-band signal, a base-band processing unit processing the base-band signal to thereby generate information data included in the high-rate wireless signal, and a reception information data storing unit storing the information data. | 02-09-2012 |
| 20120034386 | APPARATUS AND METHOD FOR COATING - An apparatus and a method for coating are disclosed. The coating apparatus of the present invention, which include: a transporting part configured to transport a substrate; a coating part configured to coat a coating material on the substrate; and a squeegee installed to remove an excessive coating material after the substrate passes through the coating part and being moveable along a transporting path of the substrate, can carry out the coating operation and the squeegeeing operation together, thereby reducing the lead time of the coating operation of the substrate and increasing the productivity. By integrating the conventional coating device and squeegeeing device, the space required for installation can be saved, and the quality of coating can be improved because conditions for coating can be adjusted. | 02-09-2012 |
| 20120033905 | Fluid dynamic bearing assembly - There is provided a fluid dynamic bearing assembly including: a sleeve having a shaft insertedly mounted therein; and upper and lower radial bearing parts formed on at least one of an outer circumferential surface of the shaft and an inner circumferential surface of the sleeve, wherein a clearance between the lower radial bearing part and a surface disposed to face the lower radial bearing part is wider than a clearance between the upper radial bearing part and a surface disposed to face the upper radial bearing part. | 02-09-2012 |
| 20120033885 | APPARATUS FOR IMPROVING SHARPNESS OF IMAGE - There is provided an apparatus for improving the sharpness of an image, which may prevent occurrence of distortion of an image in an edge enhancement process of the image by applying an active weight in accordance with a two-dimensional (2D) high pass filtering value of the image. The apparatus may include: a 2D high pass filter outputting a high frequency element value for the luminance values of pixels of an input image; a weight generating unit generating a weight changed depending on a magnitude of the high frequency element value; a weight applying unit applying the weight to the high frequency element value; and an edge enhancement image generating unit adding, to the luminance values of the pixels of the input image, the high frequency element value to which the weight is applied to thereby output an image of which an edge is enhanced. | 02-09-2012 |
| 20120033884 | APPARATUS AND METHOD FOR ESTIMATING EDGE AREAS OF DIGITAL IMAGE - There are provided an apparatus and a method for estimating edge areas of pixels in a digital image to thereby prevent an edge sharpening algorithm from being applied to non-edge area of the digital image. Therefore, the apparatus can accurately determine whether each pixel is in an edge area or in a non-edge area, by generating a binary mask obtained by using a luminance difference average between each pixel and each of neighboring pixels in the digital image. Moreover, the determination of an edge-area or a non-edge area may be applied to various digital images, by adjusting a level of edge-area determination. | 02-09-2012 |
| 20120033346 | Energy storage device - The present invention relates to an energy storage device. The energy storage device according to an exemplary embodiment of the present invention includes a case providing an internal space with a first space and a second space; an electrolyte solution filled in the internal space of the case; a positive electrode structure disposed on an interface between the first space and the second space and having a cathode active material layer including activated carbon; a first negative electrode disposed in the first space and having a first anode active material layer including graphite; and a second negative electrode disposed in the second space and having a second cathode active material layer including activated carbon. | 02-09-2012 |
| 20120033345 | Electrochemical capacitor and method of manufacturing the same - Disclosed is an electrochemical capacitor and method for manufacturing the same. The electrochemical capacitor includes: at least two winding-type separators which are wound in a spiral shape and are stacked; and stacking-type first and second electrodes which are alternately interposed between the wound separators, respectively. | 02-09-2012 |
| 20120033315 | SCANNER MOTOR - Disclosed herein is a scanner motor, including: a rotor case fixed on a rotation shaft to be rotated; a polygon mirror mounted on a top of the rotor case; and a bonding part formed between the rotor case and the polygon mirror to fix the polygon mirror on the rotor case. | 02-09-2012 |
| 20120032991 | ORGANIC LIGHT EMITTING DIODE DRIVER - There is provided an organic light emitting diode driver being capable of compensating for pixel deterioration in real time during the driving of pixels by selectively compensating pixels, requiring compensation, for the deterioration thereof. The organic light emitting diode driver includes a converting unit converting input data into compensation data used to selectively compensate for pixel deterioration depending on whether the input data has been calibrated or not; a driving unit driving pixels of a pixel unit based on the compensation data from the converting unit; and a compensating unit providing the converting unit with a deterioration compensation signal based on deterioration information obtained from a pixel driven by the driving unit. | 02-09-2012 |
| 20120032927 | TOUCH PANEL - Disclosed herein is a touch panel. The touch panel | 02-09-2012 |
| 20120032924 | TOUCH SCREEN APPARATUS - A touch screen apparatus includes a mirror part arranged on a side of a quadrilateral touch area, retroreflectors arranged on remaining three sides of the touch area, first and second light transmitting and receiving parts, each being disposed on each of two edges formed by one of the retroreflectors and emitting light to the touch area and detecting reflected light out of the emitted light by the mirror part and the retroreflectors, an angle extracting part calculating a plurality of light emitting angles for a location from which no reflected light is received, by at least one of the first and second light transmitting and receiving parts, and a coordinate generating part calculating a coordinate pair of a location in which light paths corresponding to the plurality of light emitting angles calculated by the angle extracting part intersect with each other. | 02-09-2012 |
| 20120032910 | TOUCH PANEL AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a touch panel, including: a transparent substrate; a transparent electrode made of a conductive polymer and formed on one surface of the transparent substrate; an anisotropic conductive adhesion layer formed on an edge of the transparent electrode; and an electrode formed on the anisotropic conductive adhesion layer and electrically connected with the transparent electrode by the anisotropic conductive adhesion layer. The touch panel is advantageous in that the anisotropic conductive adhesion layer is disposed between the transparent electrode and the electrode, so that the chemical reaction between the transparent electrode and the electrode can be prevented, with the result that the resistance between the transparent electrode and the electrode can be maintained constant and the change in physical properties of the transparent electrode can be prevented. | 02-09-2012 |
| 20120032904 | TOUCH PANEL - Disclosed herein is a touch panel. The touch panel includes a transparent substrate and a plurality of transparent electrodes. The transparent electrodes are formed on one surface of the transparent substrate. Each of the transparent electrodes includes a touch part formed to have an identical width and a connection part configured in a stepped form along with the touch part and configured to connect the touch part with the transparent substrate. | 02-09-2012 |
| 20120032858 | ELECTRONIC DEVICE HAVING ANTENNA PATTERN EMBEDDED IN CASE AND METHOD FOR MANUFACTURING THE SAME - An electronic device having an antenna pattern embedded in a case and a method for manufacturing the same are provided. The electronic device includes: a radiator embedded within a case and having an antenna pattern part for transmitting and receiving a signal; a smart card having a matching unit for matching a signal between a main board separated from the case and the radiator and a connection pad formed on one surface thereof to electrically connect the radiator and the matching unit; and a coupling member having one end portion coupled to the radiator so as to be embedded within the case and the other end portion protruded from a lower surface of the case so as to be elastically in contact with the connection pad to allow the radiator and the matching unit to be electrically coupled. | 02-09-2012 |
| 20120032534 | LINEAR VIBRATOR - Disclosed herein is a linear vibrator, including: a stator including a coil; and a vibrator including a magnet opposite to the coil, wherein the linear vibrator is linearly vibrated due to electromagnetic induction of the coil and the magnet, the magnet is formed in a disc shape in which a cut part is formed by cutting a portion thereof, a magnetic fluid band is formed on an outer peripheral surface of the magnet, and a portion of the magnetic fluid band is in contact with the coil. According to the present invention, there is provided the linear vibrator capable of suppressing weak vibration generated at the time of external impact or movement, previously preventing noise generated as the vibrator applies an impact to the stator due to excessive vibration, and minimizing attenuation of the linear vibration quantity as the cut part that is formed by cutting a portion of the magnet to form the air gap with the coil. | 02-09-2012 |
| 20120031550 | Method for forming a plating layer and method for manufacturing a circuit board using the same - A method for forming a plating layer and a method for forming a printed circuit board using the same are disclosed. The method for forming a plating layer in accordance with an embodiment of the present invention can include: providing a metal foil coated with a primer resin layer on one surface thereof, roughness formed the one surface of the primer resin layer; transcribing the primer resin layer, on which roughness is formed, to an insulation layer; reducing the primer resin layer so that an anticorrosive material of the metal foil that remains on the primer resin layer is removed; and plating the primer resin layer, on which roughness is formed. | 02-09-2012 |
| 20120031184 | APPARATUS FOR DRIVING GYROSCOPE SENSOR - There is provided an apparatus for driving a gyroscope sensor, including: a detector detecting voltage corresponding to the deformation of a gyroscope sensor due to vibrations generated by a driving voltage supplied through a driving electrode and Coriolis force by using a detecting electrode; a phase shifter shifting the voltage from the detector by a preset phase to generate the driving voltage, in order to meet oscillation phase conditions; an inverter inverting the voltage from the phase shifter to generate the inverting voltage, in order to stop the driving of the gyroscope sensor; a selector selecting any one of the driving voltage from the phase shifter and the inverting voltage from the inverter; and an amplifier amplifying the driving voltage or the inverting voltage from the selector to a preset gain and supplying it to the driving electrode of the gyroscope sensor, in order to meet oscillation amplitude conditions. | 02-09-2012 |
| 20120030942 | Method for manufacturing multi-layer printed circuit board - Disclosed herein is a method for manufacturing a multi-layer printed circuit board. The method for manufacturing the multi-layer printed circuit board according to an exemplary embodiment of the present invention includes manufacturing a core substrate on which circuit patterns are formed by patterning copper clads on both sides thereof; laminating insulating films on top and bottom surfaces of the core substrate; and stacking the copper clads provided with bumps on the top and bottom surfaces of the core substrate, respectively, on which the insulating films are laminated. | 02-09-2012 |
| 20120030938 | Method of manufacturing printed circuit board - A printed circuit board including: an inner layer substrate part; a first insulation layer laminated on one surface of the inner layer substrate part; a first pattern buried in one surface of the first insulation layer; a first resin layer laminated on one surface of the first insulation layer to cover the first pattern; and a first via electrically connecting the first pattern with the inner layer substrate part, wherein the first resin layer is made of a material comprising one of Liquid Crystal Polymer (LCP), Polyimide (PI), Polytetrafluoroethylene (PTFE). Polyetheretherketon (PEEK) and a photo solder resist. | 02-09-2012 |
