| Samsaung Electronics Co., Ltd. Patent applications |
| Patent application number | Title | Published |
|---|
| 20100213591 | Semiconductor package and method of manufacturing the same - A semiconductor package includes a first package and a second package, a connection terminal disposed between the first and second packages and including a first solder ball and a second solder ball that are vertically stacked, a solder passivation layer with which a surface of at least one of the first and second solder balls is coated, and a ring-shaped short prevention part surrounding a coupling portion between the first and second solder balls. | 08-26-2010 |
| 20100013077 | SEMICONDUCTOR DEVICE - A semiconductor device includes a semiconductor chip having a top surface on which a first conductive pad is disposed, a bottom surface opposite to the top surface, and a side surface connecting the top and bottom surfaces to each other, a first reinforcement layer on the top surface of the semiconductor chip, a first absorption layer between the top surface of the semiconductor chip and the first reinforcement layer to absorb a stress resulting from a difference in thermal expansion coefficient between the first reinforcement layer and the semiconductor chip, and a connection terminal disposed on the first reinforcement layer and electrically connected to the first conductive pad. | 01-21-2010 |
