| 20090289274 | PACKAGE STRUCTURE OF LIGHT EMITTING DIODE AND METHOD OF MANUFACTURING THE SAME - Provided are a LED package structure and a method of manufacturing the same. The LED package structure includes first and second plate-shaped auxiliary support pieces; a heat-dissipating portion formed upwardly higher than the first and second auxiliary support pieces; a plurality of auxiliary leads connected between each of the auxiliary support pieces and a side surface of the heat-dissipating portion, a portion of each of the plurality of auxiliary leads adjacent to the heat-dissipating portion extending along the same level with the top surface of the heat-dissipating portion; and main leads extending from the auxiliary support pieces to the heat-dissipating portion along the same level with the top surface of the auxiliary leads and spaced apart from the heat-dissipating portion, wherein the heat-dissipating portion, the auxiliary support pieces and the main leads are integrally formed using a conductive metallic material. According to the LED package structure, connection leads are integrally formed with a heat-dissipating portion through perforating or bending a metal plate whose central part is thicker than its peripheral part, followed by molding and cutting process, thereby facilitating and simplifying the manufacturing process. | 11-26-2009 |
