SAE Magnetics(H.K). Ltd.
|SAE Magnetics(H.K). Ltd. Patent applications|
|Patent application number||Title||Published|
|20110316141||LAYERED CHIP PACKAGE AND METHOD OF MANUFACTURING SAME - A layered chip package includes a main body, and wiring disposed on a side surface of the main body. The main body includes: a main part including a plurality of layer portions stacked; a plurality of first terminals disposed on the top surface of the main part and connected to the wiring; and a plurality of second terminals disposed on the bottom surface of the main part and connected to the wiring. The plurality of layer portions include a first-type layer portion and a second-type layer portion. The first-type layer portion includes a conforming semiconductor chip, and a plurality of first-type electrodes that are connected to the semiconductor chip and the wiring. The second-type layer portion includes a defective semiconductor chip, and a plurality of second-type electrodes that are connected to the wiring and not to the semiconductor chip.||12-29-2011|
|20100246065||Suspension with additional bonding pads, head gimbal assembly and disk drive unit with the same - A suspension for a head gimbal assembly comprises a flexure having a plurality of electrical traces formed thereon, a plurality of first bonding pads formed on a first surface of the flexure and at least one second bonding pad formed on a second surface of the flexure opposite the first surface. The first bonding pads and the at least one second bonding pad are electrically connected with the electrical traces and adapted to electrically connect to a slider of the head gimbal assembly. The invention also discloses a head gimbal assembly and a disk drive unit with the same.||09-30-2010|
Patent applications by SAE Magnetics(H.K). Ltd.