| SAE MAGNETICS (H.K.) LTD. Patent applications |
| Patent application number | Title | Published |
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| 20120126427 | MEMORY DEVICE, LAMINATED SEMICONDUCTOR SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - A memory device has a laminated chip package and a controller chip. In the laminated chip package, a plurality of memory chips are laminated. An interposed chip is laminated between the laminated chip package and the controller chip. The memory chips have a plurality of first wiring electrodes. The interposed chip has a plurality of second wiring electrodes. The second wiring electrodes are formed with a common arrangement pattern common with an arrangement pattern of a plurality of wiring electrodes for controller which are formed in the controller chip. The controller chip is laid on the interposed chip. | 05-24-2012 |
| 20120099227 | Magnetoresistive Sensor, magnetic head, head gimbal assembly and disk drive unit with the same - A MR sensor comprises a first shielding layer, a second shielding layer, a MR element and a pair of hard magnet layers sandwiched therebetween, and a non-magnetic insulating layer formed at a side of the MR element far from an air bearing surface of a slider. The MR sensor further comprises a first non-magnetic conducting layer formed between the first shielding layer and the MR element, and the first non-magnetic conducting layer is embedded in the first shielding layer and kept separate from the ABS. The MR sensor of the invention can obtain a narrower read gap to increase the resolution power and improve the reading performance, and obtain a strong longitudinal bias field to stabilize the MR sensor so as to increase the total sensor area and, in turn, get an improved reliability and performance. The present invention also discloses a magnetic head, a HGA and a disk drive unit. | 04-26-2012 |
| 20120099221 | Head stack assembly and hard disk drive with the same - An HSA comprises at least an HGA, a controlling circuit for controlling the HGA, and an actuator coil assembly comprising at least one top surface for mounting the HGA and a side surface for mounting the controlling circuit. The HGA has a first connection region parallel to the top surface, the first connection region has multiple first terminal pads formed thereon; the controlling circuit has a second connection region with multiple second terminal pads formed thereon, the second terminal pads are arranged in at least one row which is parallel to the top surface and the side surface, the first terminal pads are bonding to the corresponding second terminal pads to implement an electrical connection. The HSA has a compact structure as so to save space, and the connection way of the HGA and the controlling circuit is simple and solid. | 04-26-2012 |
| 20120098484 | Wireless charging system, battery with wireless charging function and electronic devices with the same - A battery adapted to a wireless charging system which comprises a coil, a PCB, a core, a shield and a case. The coil is configured to induce the magnetic power transmitted from the transmitter of the wireless charging system to generate inductive current. The PCB is electrically connected the coil to transform the inductive current of the coil into electrical power. The core is electrically connected the PCB to store the electrical power. The shield is sandwiched between the coil and the core to protect the core from magnetic power of the transmitter and enhance inductance of the coil; and the case is configured to enclose the coil, the PCB, the core, and the shield therein. The invention also discloses a wireless charging system with such a battery, a electronic device with wireless charging function. | 04-26-2012 |
| 20120096705 | Process tray for head stack assembly, shipping tool and manufacturing method for the same - A process tray for head stack assembly includes a main tray and at least one jig. Each jig has a main body with one set of locating holes formed thereon and two elastic arms respectively extending from two sides of the main body for providing force to hold the head stack assembly. The main tray has a main frame and a supporting frame disposed within and connected to the main frame for supporting the jig and/or the head stack assembly. The supporting frame has at least one set of locating bumps formed thereon for locating at least one jig on the main tray by respectively inserting the locating bumps into the locating holes formed on the jig. The process tray of the present invention can carry the head stack assembly during the whole head stack assembly manufacturing process, thereby simplifying the HSA manufacturing process, increasing productive efficiency and reducing the cost. | 04-26-2012 |
| 20120086130 | LAYERED CHIP PACKAGE AND METHOD OF MANUFACTURING SAME - A layered chip package includes a main body. The main body includes a main part, and further includes first terminals and second terminals disposed on the top and bottom surfaces of the main part, respectively. The main part includes first and second layer portions, and through electrodes penetrating them. The through electrodes are electrically connected to the first and second terminals. Each of the layer portions includes a semiconductor chip having a first surface and a second surface opposite thereto, and further includes surface electrodes. The surface electrodes are disposed on a side of the semiconductor chip opposite to the second surface. The first and second layer portions are bonded to each other such that the respective second surfaces face each other. The first terminals are formed by using the surface electrodes of the first layer portion. The second terminals are formed by using the surface electrodes of the second layer portion. | 04-12-2012 |
| 20120084969 | METHOD OF MANUFACTURING THERMAL ASSISTED MAGNETIC WRITE HEAD - A method of manufacturing a thermally-assisted magnetic write head is provided. The method includes steps of: forming a laminate structure including the waveguide; the plasmon generator, and the magnetic pole in order; performing a first polishing process to planarize an end surface of the laminate structure; performing a first etching process to remove impurity attached on the end surface of the laminate structure, and to allow the plasmon generator to be recessed from the waveguide and the magnetic pole, thereby forming a recessed region on the end surface of the laminate structure; forming a protection layer on the end surface of the laminate structure such that at least the recessed region is filled; and performing a second polishing process on the end surface of the laminate structure formed with the protection layer until the plasmon generator is exposed, thereby completing the air bearing surface. | 04-12-2012 |
| 20120082178 | Vertical cavity surface emitting laser and method for manufacturing the same - A vertical cavity surface emitting laser capable of high-speed modulation and stabilized control of polarization direction of the laser light is provided, including a resonator which is formed by stacking a semiconductor substrate, a lower mirror layer formed on the upper side of the semiconductor substrate, an active layer formed on the upper side of the lower mirror layer, and an upper mirror layer including an oxidized layer formed on the upper side of the active layer, and a portion of which is formed in a mesa shape from a predetermined position to the upper surface in a height direction; an insulation layer covering the side surface of the mesa-shaped portion of the resonator, and the upper surface of the non-mesa-shaped portion of the resonator; and electrodes being wired on the upper surface of the upper mirror layer and on the lower surface of the semiconductor substrate, respectively. Further, a portion of the insulation layer formed on the side surface of the mesa-shaped portion of the resonator is formed to be uniformly thicker than another portion along the height direction of the mesa-shaped portion. | 04-05-2012 |
| 20120080782 | METHOD OF MANUFACTURING LAYERED CHIP PACKAGE - A layered chip package includes a main body, and wiring that includes a plurality of wires disposed on a side surface of the main body. The main body includes: a main part including first and second layer portions; and a plurality of first and second terminals that are disposed on the top and bottom surfaces of the main part, respectively, and are electrically connected to the plurality of wires. The first and second terminals are formed by using electrodes of the first and second layer portions. The layered chip package is manufactured by fabricating a layered substructure by stacking two substructures each of which includes an array of a plurality of preliminary layer portions, and then cutting the layered substructure. The layered substructure includes a plurality of preliminary wires that are disposed between two adjacent pre-separation main bodies and are to become the plurality of wires. | 04-05-2012 |
| 20120075741 | Arm coil assembly, arm flexible cable assembly and disk drive unit with the same - An arm coil assembly includes a drive arm having at least two grounding pins formed on a mounting region thereof and a voice coil fixed on the tailing end of the drive arm for controlling the drive arm. The grounding pins are provided for electrically connecting with a flexible printed cable assembly by extending through at least two mounting holes formed on the flexible printed cable assembly. Each grounding pin has a slot formed thereon to clamp the flexible printed cable assembly. The arm coil assembly of the present invention having grounding pins with slot structure to clamp the flexible printed cable assembly which is mounted on the drive arm to form an arm flexible cable assembly, thus, the flexible printed cable assembly can be pre-mounted onto the arm coil assembly without using any additional fixtures or tools, therefore simplifying the mounting process and reducing the manufacturing cost thereof. The invention also discloses an arm flexible cable assembly and a disk drive unit including the same. | 03-29-2012 |
| 20120056333 | LAYERED CHIP PACKAGE AND METHOD OF MANUFACTURING SAME - A layered chip package includes a main body, and wiring that includes a plurality of wires disposed on a side surface of the main body. The main body includes: a main part including first and second layer portions; and a plurality of first and second terminals that are disposed on the top and bottom surfaces of the main part, respectively, and are electrically connected to the plurality of wires. Each layer portion includes a semiconductor chip having a first surface and a second surface opposite thereto, and includes a plurality of electrodes. The electrodes are disposed on a side of the semiconductor chip opposite to the second surface. The first and second layer portions are bonded to each other such that the respective second surfaces face each other. The first terminals are formed by using the electrodes of the first layer portion, and the second terminals are formed by using the electrodes of the second layer portion. | 03-08-2012 |
| 20120036706 | Row bar for forming sliders and method of manufacturing slider - A row bar for forming sliders has a row of slider forming portions, each slider forming portion having a slider to be cut from the row bar and a medial region adjacent the slider, each medial region having a first guide pad disposed thereon; wherein each slider has: a slider body; a magnetic writer and a magnetic reader disposed on the slider body; a second guide pad disposed on the slider body; two electrical lapping guides disposed on the slider body and electrically connecting to the first guide pad and the second guide pad respectively; a row of bonding pads formed on the slider body and electrically connecting to the magnetic reader and the magnetic writer; and a grounding pad disposed on the slider body and electrically connecting to the first guide pad and the second guide pad. The invention also discloses a method of manufacturing the slider. | 02-16-2012 |
| 20120032318 | LAYERED CHIP PACKAGE AND METHOD OF MANUFACTURING SAME - A layered chip package includes a main body, and wiring that includes a plurality of wires disposed on a side surface of the main body. The main body includes: a main part including a plurality of layer portions; a plurality of first terminals disposed on the top surface of the main part and connected to the wiring; and a plurality of second terminals disposed on the bottom surface of the main part and connected to the wiring. Each layer portion includes a semiconductor chip. The plurality of second terminals are positioned to overlap the plurality of first terminals as viewed in a direction perpendicular to the top surface of the main body. A plurality of pairs of first and second terminals that are electrically connected via the wires include a plurality of pairs of a first terminal and a second terminal that are positioned not to overlap each other. | 02-09-2012 |
| 20120025355 | LAMINATED SEMICONDUCTOR SUBSTRATE, LAMINATED CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME - In a laminated semiconductor substrate, a plurality of semiconductor substrates are laminated. Each of the semiconductor substrate has a plurality of scribe-groove parts formed along scribe lines. Further, each of the semiconductor substrate has a plurality of device regions insulated from each other and has a semiconductor device formed therein. Further, an uppermost substrate and a lowermost substrate have electromagnetic shielding layer formed in regions other than the scribe-groove parts using a ferromagnetic body. Further, in the laminated semiconductor substrate, a through hole which penetrates the plurality of semiconductor substrates laminated in a laminated direction is formed in the scribe-groove part, and the laminated semiconductor substrate has a through electrode penetrating the plurality of semiconductor substrates through the through hole. | 02-02-2012 |
| 20120025354 | LAMINATED SEMICONDUCTOR SUBSTRATE, LAMINATED CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME - In a laminated semiconductor substrate, a plurality of semiconductor substrates are laminated. Each of the semiconductor substrate has a plurality of scribe-groove parts formed along scribe lines. Further, each of the semiconductor substrate has a plurality of device regions insulated from each other and has a semiconductor device formed therein. Further, an uppermost substrate and a lowermost substrate have an electromagnetic shielding layer formed using a ferromagnetic body. The electromagnetic shielding layer is formed in a shielding region except the extending zone. The extending zone is set a part which the wiring electrode crosses, in a peripheral edge part of the device region. | 02-02-2012 |
| 20120019945 | Method and system for measuring noise of a magnetic head - A method for measuring noise of a magnetic head includes setting a plurality of threshold values, applying bias current or voltage to a read element of the magnetic head, applying an external transverse magnetic field to the magnetic head, amplifying output signal from the read element to produce an amplified signal, filtering the amplified signal to produce a filtered signal, generating an enable signal for each threshold value in a predetermined time window by a counting control means with input signals which include the filtered signal and the threshold value, measuring the cumulative time duration of each enable signal, making an amplitude-duration distribution according to the cumulative time durations and the threshold values, calculating a plurality of parameters according to the amplitude-duration distribution and analyzing the parameters with a plurality of predetermined criteria to determine the defects of the magnetic head. Accordingly, the invention also discloses a system for measuring noise of a magnetic head. | 01-26-2012 |
| 20120013025 | Layered Chip Package and Method of Manufacturing Same - A layered chip package includes a main body and wiring, the wiring including a plurality of wires disposed on a side surface of the main body. The main body includes a main part and a plurality of terminals. The main part includes a plurality of layer portions stacked. The terminals are disposed on at least either one of the top and bottom surfaces of the main part and electrically connected to the wires. Each of the layer portions includes a semiconductor chip. The plurality of wires include a plurality of common wires and a plurality of layer-dependent wires. In at least one of the layer portions, the semiconductor chip is electrically connected to the plurality of common wires and is selectively electrically connected to only the layer-dependent wire that the layer portion uses, among the plurality of layer-dependent wires. | 01-19-2012 |
| 20120013024 | Layered Chip Package and Method of Manufacturing Same - A layered chip package includes a main body and wiring, the wiring including a plurality of wires disposed on a side surface of the main body. The main body includes a main part and a plurality of terminals. The main part includes a plurality of layer portions stacked. The terminals are disposed on at least either one of the top and bottom surfaces of the main part and electrically connected to the wires. Each of the layer portions includes a semiconductor chip, and a plurality of electrodes that are electrically connected to the wires. The electrodes include a plurality of first electrodes that are intended to establish electrical connection to the semiconductor chip, and a plurality of second electrodes that are not in contact with the semiconductor chip. In at least one of the layer portions, the first electrodes are in contact with and electrically connected to the semiconductor chip. | 01-19-2012 |
| 20120011286 | Optical communication module, universal serial bus cable with the same and processing method of data transfer thereof - The present invention discloses an optical communication module comprising a second mode supporting a data transfer of USB 3.0 standard and a third mode supporting a data transfer of USB 2.0 standard, and the second mode comprises A mode and B mode with a different power consumption and supported data rate, and a detect unit operative to detect idle state of the data traffic on the data path of USB 3.0 standard to determine to stay on the A mode or enter to the B mode automatically during operation in the second mode. The control circuitry can work in different modes to support different status of devices attachment and removal, different data rate of USB 2.0 and 3.0 standards; and it can real time monitor the data traffic to switch different modes to save power consumption. The present invention also discloses a USB cable and a processing method of data transfer for an optical communication module. | 01-12-2012 |
| 20120002326 | Perpendicular Magnetic Write head and method of manufacturing the same - A perpendicular magnetic write head includes: a magnetic pole; a pair of nonmagnetic side gap layers provided on both sides in a track-width direction of the magnetic pole; a nonmagnetic trailing gap layer provided on a trailing side of the magnetic pole; a magnetic shield layer so provided as to surround the magnetic pole with both of the nonmagnetic side gap layer and the nonmagnetic trailing gap layer in between; and a magnetic seed layer formed between the nonmagnetic trailing gap layer and the magnetic shield layer, and having a saturation magnetic flux density higher than that of the magnetic shield layer. The magnetic seed layer is not formed between the nonmagnetic side gap layer and the magnetic shield layer. | 01-05-2012 |
| 20110316123 | Laminated semiconductor substrate, laminated chip package and method of manufacturing the same - In a laminated semiconductor substrate, a plurality of semiconductor substrates are laminated. Each of the semiconductor substrate has a plurality of scribe-groove parts formed along scribe lines. Further, each of the semiconductor substrate has a plurality of device regions insulated from each other and has a semiconductor device formed therein, a first wiring electrode and a second wiring electrode extend to the inside of a interposed groove part from a first device region and a second device region respectively, and are separated from each other. In the laminated semiconductor substrate, a through hole which the first wiring electrode appears is formed. The laminated semiconductor substrate has a through electrode. The through electrode is contact with all of the first wiring electrodes appearing in the through hole. The laminated semiconductor substrate has a plurality of laminated chip regions. | 12-29-2011 |
| 20110299855 | Optical subassembly and manufacturing method thereof - An optical subassembly comprises a transmitter optical subassembly, a receiver optical subassembly, and an electronic assembly connected with the transmitter optical subassembly and the receiver optical subassembly respectively. The transmitter optical subassembly comprises an optical source and an optical source driver driving the optical source; the receiver optical subassembly comprises a photodetector and a control module connecting with the photodetector, and the control module is integrated with a transimpedance amplifier and a limiting amplifier; and the electronic assembly comprises a printed circuit board and a microcontroller formed thereon, and the microcontroller connects with the laser driver and the control module respectively. The present invention can achieve a high integration that is beneficial to the high speed transmission, simplify the layout design of the PCB, and decrease the manufacturing cost. | 12-08-2011 |
| 20110299195 | Row bar and wafer - A row bar having a plurality of slider forming areas collocated and slider cutting areas formed between two adjacent slider forming areas respectively, the slider forming areas are eventually cut into individual sliders along the slider cutting areas respectively, each slider having a pole tip embedded therein and an air bearing surface pattern on an air bearing surface facing to a disk, and at least a regular measuring pattern with straight line is formed on one of the slider cutting areas, to serve as a frame of reference for measuring the position of the pole tip and the air bearing surface pattern. The present invention can improve the measuring accuracy, decrease the measuring error and, in turn, improve the performance of the slider. | 12-08-2011 |
| 20110298715 | Optical navigation apparatus - An optical navigation apparatus comprises a substrate with a sensor integrated circuit and an infrared source formed thereon; a sensor cover shielding the sensor integrated circuit and the infrared source; at least one visible light source formed outside the sensor cover and electrically connected with the substrate; a light guide located outside the sensor cover and covering the visible light source; and an outer housing covering the light guide and the substrate, and the outer housing comprises an infrared window and a side wall capable of guiding visible light towards and illuminating a region of the outer housing. In such an arrangement, the outer housing of the present invention is not only used as a casing for protection, but also served as light guide and distribution structure to reflect and re-distribute light sufficiently to achieve a uniform illuminated character shape. | 12-08-2011 |
| 20110297780 | Automatic winding device for cell core - An automatic winding device for cell core includes a mounting seat, a locking cap mounted on one end of the mounting seat, a winding assembly driving mechanism mounted on the other end of the mounting seat and a winding assembly. The winding assembly comprises two winding needles and two winding plates. One end of the winding needle is fixed to the winding driving mechanism and the other end thereof opposite to the locking cap. One end of the winding plate is fixed to the winding driving mechanism and the other end thereof opposite to the locking cap. Two winding plates are disposed on both sides of the pair of winding needles respectively and contact to the pair of winding needles separably. One side of one winding needle has a concave portion and one side of the other winding needle has a convex portion that fits into the concave portion separably. A first protrusion is formed on the end of each winding needle opposite to the locking cap and a second protrusion is formed on the end of each winding plate opposite to the locking cap. A groove and a ring groove are formed in the locking cap in sequence, the first protrusion of the winding needle is locked in the groove and the second protrusion of the winding needle is locked in the ring groove. | 12-08-2011 |
| 20110296673 | Row bar with smart sensor for forming sliders and method of manufacturing slider - A row bar with smart sensor for forming sliders, which comprises a row of slider forming portions, each slider forming portion comprising a slider to be cut from the row bar and a medial region adjacent the slider; each slider comprises a slider body and a magnetic writer disposed in the slider body, with the magnetic writer having a main pole which includes a pole face for being lapped, and all the main poles are arranged in a row; the row bar has at least one smart sensor disposed therein, with the smart sensor having at least three dummy poles, whose structure is identical to that of said main pole, arranged in the row of the main poles, there is a space between every two adjacent dummy poles of said smart sensor, and there is a offset in the direction vertical with the pole face between every two adjacent dummy poles of said smart sensor. The invention also discloses a method of manufacturing the slider. | 12-08-2011 |
| 20110266692 | LAYERED CHIP PACKAGE AND METHOD OF MANUFACTURING SAME - A layered chip package includes a main body and a plurality of through electrodes. The main body includes a plurality of layer portions stacked and a plurality of through holes that penetrate all the plurality of layer portions. The plurality of through electrodes are provided in the plurality of through holes of the main body and penetrate all the plurality of layer portions. Each of the plurality of layer portions includes a semiconductor chip. At least one of the plurality of layer portions includes wiring that electrically connects the semiconductor chip to the plurality of through electrodes. The wiring includes a plurality of conductors that make contact with a through electrode that is exposed in the wall faces of any one of the plurality of through holes and passes through the through hole. | 11-03-2011 |
| 20110249363 | MAGNETIC HEAD INCLUDING SENSOR - A magnetic head disposed in a slider, that is arranged at an interval from a magnetic disk includes a sensor disposed in a position that is opposed to the magnetic disk, a heat conductive film that is positioned on an air bearing surface opposed to the magnetic disk, and that is formed so as to overlap the sensor, of which a height in a direction perpendicular to the air bearing surface is more than a height of the sensor, and that transfers a temperature change of the air bearing surface to the sensor, and a pair of lead films electrically connected to the sensor and not electrically connected to the heat conductive film. | 10-13-2011 |
| 20110243511 | Universal serial bus connector - A USB connector comprises a USB connector body and an optical module including an optical transmitter and an optical receiver engaging with the USB connector body. The USB connector body comprises a metal shell having a first opening adapted for connecting with an external plug; a second opening communicating with the first opening and adapted for accommodating the optical module; and a locking device adapted for locking the optical module within the USB connector body. The present invention can serve as an active optical transceiver, and simplify the structure and reduce manufacturing cost, further reduce the loss of optical signals and, in turn improve the transmission performance. | 10-06-2011 |
| 20110242703 | Thermally assisted magnetic head, method of manufacturing the same, head gimbal assembly, and hard disk drive - A thermally assisted magnetic head includes a main magnetic pole layer, a near-field light generating layer having a generating end part generating near-field light arranged within a medium-opposing surface, and an optical waveguide guiding light to the near-field light generating layer. The thermally assisted magnetic head includes a base layer which a base groove part having a width gradually getting smaller along a depth direction and extending in an intersecting direction intersecting with the medium-opposing surface is formed. The near-field light generating layer has an in-groove generating layer formed inside of the base groove part. The in-groove generating layer is formed along an inner wall surface of the base groove part and has a thin-film like structure. | 10-06-2011 |
| 20110241707 | Method of measuring slider resistance of different types of row bar with a common tester - A method of measuring slider resistance of different types of row bar with a common tester comprises judging the type of the row bar, if the row bar is femto-type row bar, supplying a first voltage to the front pins, and supplying a second voltage that is unequal to the first voltage to the back pins, thereby obtaining resistances of the sliders; if the row bar is shunting-type row bar, supplying a third voltage to the front pins which contact the test pads, and supplying a fourth voltage that is unequal to the third voltage to the front pin that contacts the common test pad, thereby obtaining resistances of the sliders. The present invention can measure two different types of row bar with a same common tester, which can reduce the downtime of machine and the manpower, and prevent the probe card from being damaged without a frequent disassembly and switch. | 10-06-2011 |
| 20110241480 | Surface acoustic wave device - A surface acoustic wave device according to the present invention includes a piezoelectric monocrystal substrate | 10-06-2011 |
| 20110235214 | Magnetoresistive sensor, magnetic head, head gimbal assembly, and disk drive unit with the same - A MR sensor includes a first shielding layer, a second shielding layer, a MR element formed therebetween, and a pair of hard magnet layers respectively placed on two sides of the MR element. The MR element comprises an AFM layer formed on the first shielding layer, a pinned layer formed on the AFM layer and a free layer formed between the pinned layer and the second shielding layer. The free layer is funnel-shaped, which having a first edge facing the air bearing surface and a second edge opposite the first edge, and the first edge has a narrower width than that of the second edge. The structure of the MR sensor can improve MR height control performance, and improve the ESD performance and decrease the PCN and RTN and, in turn, get a more stable performance. The present invention also discloses a magnetic head, a HGA and a disk drive unit. | 09-29-2011 |
| 20110228426 | Suspension, head gimbal assembly and disk drive unit with the same - A suspension comprises a flexure and a plurality of electrical traces. The flexure has a leading portion and a tailing portion, and has a laminated structure comprising a substrate layer, a dielectric layer, and a grounding layer sandwiched therebetween. The electrical traces comprise at least one pair of write traces, each write trace has a bonding pad positioned on the leading portion, a terminal pad positioned on the tailing portion, and a write wire connecting the bonding pad and the terminal pad, the write wire has at least one portion being furcated into at least two sub wires. The present invention can lower the impedance and decrease the signal transmission loss, and widen the frequency bandwidth simultaneously. The invention also discloses a HGA and a disk drive unit. | 09-22-2011 |
| 20110221073 | Layered chip package with wiring on the side surfaces - A layered chip package has a main body including pairs of layer portions, and wiring disposed on a side surface of the main body. Each layer portion includes a semiconductor chip. The pairs of layer portions include specific pairs of layer portions. Each of the specific pairs of layer portions includes a first-type layer portion and a second-type layer portion. The first-type layer portion includes electrodes each connected to the semiconductor chip and each having an end face located at the side surface of the main body on which the wiring is disposed, whereas the second-type layer portion does not include such electrodes. The specific pairs of layer portions are provided in an even number. | 09-15-2011 |
| 20110220611 | Method of manufacturing perpendicular magnetic write head - A method of manufacturing a perpendicular magnetic recording head capable of easily and accurately forming a main magnetic-pole layer having a shape suitable for concentrating a magnetic flux is provided. A nonmagnetic layer having a recessed section (a first recessed section and a second recessed section) is formed, and then an additional nonmagnetic layer is formed on an inner surface of the recessed section. Then, a magnetic layer is formed in the recessed section formed with the additional nonmagnetic layer, and then the magnetic layer is cut to form an air bearing surface, so as to form the main magnetic-pole layer. | 09-15-2011 |
| 20110211275 | Method of determining flying height of magnetic head - For obtaining a flying height of a magnetic head from a magnetic disk, the magnetic head being placed in a slider arranged at an interval with the magnetic disk, an initial setting process and a flying height detecting process are performed. In the initial setting process, driving power to a heater is increased gradually, from a state where the heater arranged at a position in proximity to the magnetic head in the slider is not driven, until the magnetic head makes contact with the magnetic disk. Then, in each stage, an electrical resistance value of the sensor arranged at a position in proximity to the magnetic head in the slider, which is increased due to the heat from heater, and either an approach distance of the magnetic head toward the magnetic disk or the flying height of the magnetic head from the magnetic disk are acquired. Then, basic data is prepared by obtaining the relationship between a variation of the electrical resistance value of the sensor and the flying height of the magnetic head from the magnetic disk, which is obtained in each stage or which calculated from the approach distance in each stage. In the flying height detecting process, an electrical resistance value of the sensor is determined, and a variation of the electrical resistance value is calculated from the determined values. Then, the flying height of the magnetic head from the magnetic disk in the state where the electrical resistance value was determined is obtained based on the basic data obtained in the initial setting process, using the calculated variation of the electrical resistance value. | 09-01-2011 |
| 20110211274 | HEAD ASSEMBLY, MAGNETIC DISK DRIVE APPARATUS AND ROTATION MECHANISM - A head assembly includes a slider having a head element, a load beam, a fulcrum formed at a top end section of the load beam, a slider support plate for supporting the slider to freely turn around the fulcrum, at least one drive element for applying a turning force to the slider support plate in a plane thereof, a first linear link part having at both ends a first top end joint part mechanically connected to the slider support plate, and a first base end joint part mechanically connected to the load beam, and a second linear link part having at both ends a second top end joint part mechanically connected to the slider support plate, and a second base end joint part mechanically connected to the load beam. Both of an extended line of the first linear link part and an extended line of the second linear link part travel toward a position of the fulcrum and intersect with each other. | 09-01-2011 |
| 20110201137 | Method of manufacturing layered chip package - A method of manufacturing a layered chip package that includes a main body, and wiring disposed on a side surface of the main body. The main body includes a plurality of layer portions. The method includes fabricating a plurality of substructures, and completing the layered chip package by fabricating the main body using the plurality of substructures and by forming the wiring on the main body. Each substructure is fabricated through the steps of: fabricating a pre-substructure wafer including a plurality of pre-semiconductor-chip portions aligned; distinguishing between a normally functioning pre-semiconductor-chip portion and a malfunctioning pre-semiconductor-chip portion among the plurality of pre-semiconductor-chip portions included in the pre-substructure wafer; and forming electrodes connected to the normally functioning pre-semiconductor-chip portion and having respective end faces located in the side surface of the main body on which the wiring is disposed, without forming any electrode connected to the malfunctioning pre-semiconductor-chip portion. | 08-18-2011 |
| 20110198014 | ADHESIVE BONDING METHOD - The present invention provides an adhesive bonding method including: providing a first component and a second component to be bonded and an adhesive; positioning the adhesive between the first component and the second component with the adhesive contacting with the first component and the second component; providing at least one light concentrator; and providing a light source and making at least partial light beams of the light source pass through the light concentrator and the first component in order, and then irradiate on the adhesive to cure the adhesive so as to bond the first component and the second component. The adhesive bonding method of the instant invention can maintain the alignment precision between the components being bonded so as to optimize products' performances. | 08-18-2011 |
| 20110194209 | MAGNETIC RECORDING HEAD, HEAD GIMBAL ASSEMBLY, AND DISK DRIVE UNIT WITH THE SAME - A magnetic recording head includes a trailing surface and a plurality of bonding pads arranged on the trailing surface and in a row adapted for both bonding and testing. Each of the bonding pads has at least one side portion being coated with electrically conductive solder nonwettable coat to prevent short circuit between the adjacent bonding pads. The invention also discloses a head gimbal assembly with the magnetic recording head and a disk drive unit having such head gimbal assembly. | 08-11-2011 |
| 20110194208 | SLIDER, HEAD GIMBAL ASSEMBLY AND DISK DRIVE UNIT WITH THE SAME - A slider for a head gimbal assembly includes a trailing surface, a plurality of connection pads arranged on the trailing surface adapted for both bonding the slider to a suspension of the head gimbal assembly and testing the performance of the slider. At least a part of the connection pads each comprises a bonding portion and a testing portion electrically connected to the bonding portion and larger than the bonding portion, all the bonding portions and the rest part of the connection pads are arranged in a first row and the testing portions are arranged outside the first row. The slier of the present invention has a new pad layout to facilitate bonding of the connection pads and permit to provide additional pads thereon to connect the additional sensors therein for precise reading and writing, thereby improving the performance of the slider. The invention also discloses a head gimbal assembly and a disk drive unit including the same. | 08-11-2011 |
| 20110194186 | Method for manufacturing polymer miniature lens and collimator including the polymer miniature lens - A method for manufacturing a polymer miniature lens on a substrate with the lens forming pattern, and the liquid polymer is dispensed therein. The lens forming pattern having a periphery area and an interior area, most portion of the periphery area having a property of confining liquid polymer, while the interior area having at least one portion exposing the surface of the substrate; depositing liquid polymer onto the lens forming pattern; and curing the liquid polymer after the liquid polymer reaches equilibrium shape and is confined to the periphery area. The invention also discloses a collimator including the polymer miniature lens. | 08-11-2011 |
| 20110189822 | METHOD OF MANUFACTURING LAYERED CHIP PACKAGE - A layered chip package includes a main body and wiring. The main body includes a plurality of layer portions stacked. The wiring is disposed on at least one side surface of the main body. In the method of manufacturing the layered chip package, first, a plurality of substructures each of which includes an array of a plurality of preliminary layer portions are used to fabricate a layered substructure that includes a plurality of pre-separation main bodies arranged in rows. Next, the layered substructure is cut into a plurality of blocks each of which includes a row of a plurality of pre-separation main bodies, and the wiring is formed on the plurality of pre-separation main bodies included in each block simultaneously. The plurality of pre-separation main bodies are then separated from each other. Each of the plurality of blocks includes a row of three, four, or five pre-separation main bodies. | 08-04-2011 |
| 20110189820 | METHOD OF MANUFACTURING LAYERED CHIP PACKAGE - In a method of manufacturing a layered chip package, a layered substructure is fabricated and used to produce a plurality of layered chip packages. The layered substructure includes first to fourth substructures stacked, each of the substructures including an array of a plurality of preliminary layer portions. In the step of fabricating the layered substructure, initially fabricated are first to fourth pre-polishing substructures each having first and second surfaces. Next, the first and second pre-polishing substructures are bonded to each other with the first surfaces facing each other, and then the second surface of the second pre-polishing substructure is polished to form a first stack. Similarly, the third and fourth pre-polishing substructures are bonded to each other and the second surface of the third pre-polishing substructure is polished to form a second stack. Then, the first and second stacks are bonded to each other. | 08-04-2011 |
| 20110186985 | Semiconductor substrate, laminated chip package, semiconductor plate and method of manufacturing the same - A semiconductor substrate has a plurality of groove portions formed along scribe lines. The semiconductor substrate includes: a unit region in contact with at least any one of the plurality of groove portions; and a wiring electrode with a portion thereof arranged within the unit region. Further, the plurality of groove portions have a wide-port structure in which a wide width portion wider in width than a groove lower portion including a bottom portion is formed at an inlet port thereof. | 08-04-2011 |
| 20110182559 | Assembly of optical fiber and optical fiber holder with end portion of optical fiber housed in recess - The present invention is directed to an assembly of an optical fiber and an optical fiber holder for holding the optical fiber, the optical fiber having an end surface formed at an end portion thereof, the end surface being configured to perform light coupling with a light emitting element or with a light receiving element. The optical fiber holder comprises; a throughhole which extends through the optical fiber holder and a recess that is positioned on a surface of the optical fiber holder and that is provided with an opening of the throughhole. The optical fiber is inserted through the throughhole and an adhesive is filled in a gap between an inner wall of the throughhole and an outer periphery of the optical fiber, the adhesive being used for adhering the optical fiber to the optical fiber holder. The end portion, on which is formed the end surface of the optical fiber, protrudes from the opening and terminates within the recess. | 07-28-2011 |
| 20110180932 | METHOD OF MANUFACTURING LAYERED CHIP PACKAGE - A layered chip package includes a main body, and wiring including a plurality of wires disposed on a side surface of the main body. The main body includes a plurality of semiconductor chips stacked, and a plurality of electrodes that electrically connect the semiconductor chips to the wires. A method of manufacturing the layered chip package includes the steps of: fabricating a substructure that includes an array of a plurality of pre-separation main bodies and a plurality of holes for accommodating a plurality of preliminary wires, the holes being formed between two adjacent pre-separation main bodies; forming the preliminary wires in the plurality of holes by plating; and cutting the substructure so that the plurality of pre-separation main bodies are separated from each other and the preliminary wires are split into two sets of wires of two separate main bodies, whereby a plurality of layered chip packages are formed. | 07-28-2011 |
| 20110176239 | Head stack assembly and disk drive unit with the same - Disclosed is a head stack assembly, which comprises a pivot bearing assembly having a main body which comprising a first end surface and a second end surface, and a flange extended from the main body and located between the first and second end surfaces, the flange having a first interface adjacent the first end surface of the main body and a second interface opposite to the first interface; a drive arm mounted on the main body and secured on the first interface of the flange; and a fantail spacer mounted on the main body and secured on the second interface of the flange. | 07-21-2011 |
| 20110174608 | Method for forming a diamond-like carbon layer on air bearing surface of a slider - A method for forming a diamond-like carbon (DLC) layer on air bearing surface (ABS) of a slider, comprises steps of: providing sliders arranged in arrays, each slider having an ABS; forming a mixing layer in the ABS of the slider by depositing a first DLC layer on the ABS, the mixing layer consisting of the slider material and the first DLC layer material; removing the first DLC layer to make the mixing layer exposed; forming a second DLC layer on the mixing layer. | 07-21-2011 |
| 20110170216 | MAGNETIC HEAD FOR PERPENDICULAR MAGNETIC RECORDING - A magnetic layer for writing incorporates: a pole layer having an end face located in a medium facing surface; and an upper yoke layer. A first magnetic layer for flux concentration is connected to the pole layer at a location away from the medium facing surface, and passes a magnetic flux corresponding to a magnetic field generated by a first coil. A second magnetic layer for flux concentration is connected to the upper yoke layer at a location away from the medium facing surface, and passes a magnetic flux corresponding to a magnetic field generated by a second coil. A nonmagnetic layer is disposed between the pole layer and the upper yoke layer. The upper yoke layer is connected to the pole layer at a location closer to the medium facing surface than the nonmagnetic layer. | 07-14-2011 |
| 20110164333 | Thermally assisted magnetic head, method of manufacturing the same, head gimbal assembly, and hard disk drive - A thermally assisted magnetic head includes a main magnetic pole layer, a near-field light generating layer having a generating end part generating near-field light arranged within a medium-opposing surface, and an optical waveguide guiding light to the near-field light generating layer. The near-field light generating layer has a near-field light generating part in a triangle shape with the generating end part being one vertex, and is formed in a triangle pole shape. The optical waveguide is formed to be opposed to a ridge part of the near-field light generating layer via an interposed layer. The main magnetic pole layer is formed to be opposed to the generating end part via the interposed layer. The thermally assisted magnetic head further includes a heat radiating layer in contact with an opposite side of the near-field light generating layer from the optical waveguide. | 07-07-2011 |
| 20110146059 | Method of manufacturing head gimbal assembly - In a manufacturing method for a head gimbal assembly, before mounting a slider on a suspension, coating films each made of solder are formed on respective terminals of a plurality of leads to be connected to a plurality of electrode pads of the slider. After mounting the slider on the suspension, the coating films are heated with laser light to thereby melt the solder, with the respective terminals of the plurality of leads in contact with the corresponding electrode pads via the respective coating films, whereby the terminals are electrically and physically connected to the electrode pads. | 06-23-2011 |
| 20110115079 | Wafter and substructure for use in manufacturing electronic component packages - A wafer for electronic component packages is used for manufacturing a plurality of electronic component packages, each of the plurality of electronic component packages including: a base incorporating a plurality of external connecting terminals; and at least one electronic component chip bonded to the base and electrically connected to the plurality of external connecting terminals. The wafer has a plurality of sets of external connecting terminals corresponding to the plurality of electronic component packages, a retainer for retaining the plurality of sets of external connecting terminals, and a coupling portion for coupling the plurality of sets of external connecting terminals to one another. The wafer includes a plurality of pre-base portions that will each be subjected to bonding of the at least one electronic component chip thereto and will be subjected to separation from one another later so that each of them will thereby become the base. | 05-19-2011 |
| 20110096435 | Heat-assisted magnetic recording head with laser diode fixed to slider - A heat-assisted magnetic recording head includes a slider, an edge-emitting laser diode fixed to the slider, and an external mirror fixed to the laser diode. The laser diode has an emitting end face that includes an emission part for emitting laser light; a mounting surface that lies at an end in a direction perpendicular to the plane of an active layer and faces the slider; and a rear surface opposite to the mounting surface. The external mirror includes: a first to-be-fixed part disposed along the emitting end face; a second to-be-fixed part disposed along the rear surface; and a coupling part that couples the first and second to-be-fixed parts to each other. The first to-be-fixed part has a reflecting surface that reflects the laser light emitted from the emission part toward the waveguide. | 04-28-2011 |
| 20110095414 | Semiconductor substrate, laminated chip package, semiconductor plate and method of manufacturing the same - A semiconductor substrate has a plurality of groove portions formed along scribe lines. The semiconductor substrate includes: a device region in contact with at least any one of the plurality of groove portions and having a semiconductor device formed therein; a surface insulating layer formed to cover the device region and constituting a surface layer of the semiconductor substrate; and a wiring electrode connected to the semiconductor device and formed in a protruding shape rising above a surface of the surface insulating layer. The semiconductor substrate can be manufactured by forming a plurality of groove portions along scribe lines; applying an insulating material to a surface on a side where the plurality of groove portions are formed to form a surface insulating layer; and forming a wiring electrode connected to the semiconductor device and in a protruding shape rising above a surface of the surface insulating layer, after the formation of the surface insulating layer. | 04-28-2011 |
| 20110095289 | Laminated chips package, semiconductor substrate and method of manufacturing the laminated chips package - In a laminated chip package, a plurality of semiconductor plates each having a semiconductor device and a wiring electrode connected to the semiconductor device are laminated. On a side surface for wiring of the laminated chip package, an end face of an inner electrode for examination formed inside the side surface for wiring in the semiconductor plate is formed. The laminated chip package further has an outer electrode for examination connecting the end faces of the inner electrodes for examination along a lamination direction of the semiconductor plates, only for two adjacent semiconductor plates among the semiconductor plates. | 04-28-2011 |
| 20110090601 | Suspension with flexure tail and manufacturing method thereof, head stack assembly and disk drive unit with the same - A suspension for a head stack assembly, comprises a flexure with a suspension tongue, a flexure tail and a plurality of conductive traces extending between the suspension tongue and the flexure tail, each of said conductive traces having one end thereof terminated to an electrical pad formed on the suspension tongue for electrical connection to a slider and the other end thereof terminated to a connection pad formed on the flexure tail for both testing and bonding such that the flexure has no additional testing pads. The suspension with a flexure tail able to make the bonding and the dynamic performance testing on the pad area and thus reduce suspension length and increase flexure density for low cost. The invention also discloses a manufacturing method of the suspension and a HSA with such an suspension and a disk drive unit having such an HSA. | 04-21-2011 |
| 20110090600 | SUSPENSION, HEAD GIMBAL ASSEMBLY AND DISK DRIVE UNIT WITH THE SAME - A suspension for a head gimbal assembly comprises a flexure having a suspension tongue and a welding portion separating from the suspension tongue, and a load beam supporting the suspension tongue and having a portion welded to the welding portion of the flexure so that the load beam and the flexure are connected together. A plurality of bonding pads is formed on the suspension tongue for electrical connection to a slider. The suspension tongue has a leading portion and a leading edge limiter formed at the leading portion, and the leading edge limiter hooks on to the load beam. The suspension can improve the shockproof performance of the flexure of the suspension and, in turn, protect the structure of the suspension. The invention also discloses a head gimbal assembly and a disk drive unit including the same. | 04-21-2011 |
| 20110090599 | Suspension having a short flexure tail, head gimbal assembly and disk drive unit with the same - A suspension for a head gimbal assembly comprises a flexure having a flexure having a tail with a plurality of electrical traces and a plurality of bonding terminals adapted for connecting with a flexible printed circuit formed thereon. Each of the bonding terminals comprises a connecting pad and a hole formed at one end of the connecting pad for electrically and mechanically connecting the connecting pad to the flexible printed circuit by bonding material. And the connecting pad has a bonding portion adjacent to the hole and an exposed portion for testing. The invention also discloses a head gimbal assembly and a disk drive unit with the same. | 04-21-2011 |
| 20110086182 | Magnetic device, perpendicular magnetic recording head, magnetic recording system, method of forming magnetic layer pattern, and method of manufacturing perpendicular magnetic recording head - Provided is a method of manufacturing a perpendicular magnetic recording head which can enhance accuracy and simplify the manufacturing process. The method includes: forming a photoresist pattern having an opening part (the inclination of an inner wall); forming a non-magnetic layer (the inclination of another inner wall) so as to narrow the opening part by a dry film forming method such as ALD method; stacking a seed layer and a plating layer so as to bury the opening part provided with the non-magnetic layer; and forming a main magnetic pole layer (a front end portion having a bevel angle) by polishing the non-magnetic layer, the seed layer, and the plating layer by CMP method until the photoresist pattern is exposed. The final opening width (the forming width of the front end portion) is unsusceptible to variations, thus reducing the number of the steps of forming the main magnetic layer. | 04-14-2011 |
| 20110068456 | Layered chip package and method of manufacturing same - A layered chip package includes a plurality of layer portions that are stacked, each of the layer portions including a semiconductor chip. The plurality of layer portions include at least one first-type layer portion and at least one second-type layer portion. The semiconductor chip has a circuit, a plurality of electrode pads electrically connected to the circuit, and a plurality of through electrodes. In every vertically adjacent two of the layer portions, the plurality of through electrodes of the semiconductor chip of one of the two layer portions are electrically connected to the respective corresponding through electrodes of the semiconductor chip of the other of the two layer portions. The first-type layer portion includes a plurality of wires for electrically connecting the plurality of through electrodes to the respective corresponding electrode pads, whereas the second-type layer portion does not include the wires. | 03-24-2011 |
| 20110063754 | Perpendicular magnetic write head - A perpendicular magnetic write head in which unintended erasure of information at the time of non-writing can be suppressed while keeping the capability of writing is provided. The perpendicular magnetic write head includes a magnetic pole tip portion, a first yoke portion connected to the magnetic pole tip portion, having a width larger than that of the magnetic pole tip portion, and having a recess portion in a center region thereof, and a second yoke portion embedded in the recess portion. The magnetic pole tip portion and the first yoke portion are integrally formed with a vapor deposition method, and the second yoke portion is formed with a plating method. Since the saturation flux density of the magnetic pole tip portion formed with the vapor deposition method becomes higher than that of the yoke portion, a magnetic flux intake capacity of the magnetic pole tip portion is ensured. In a magnetic domain structure of the yoke portion most of which is formed with the plating method, since an easy magnetization axis becomes likely to be directed in a direction perpendicular to an emitting direction of a magnetic flux, residual flux becomes less likely to leak out of the main magnetic pole layer at the time of non-writing. | 03-17-2011 |
| 20110041322 | Method of manufacturing magnetic head for perpendicular magnetic recording including two side shields - A magnetic head includes a pole layer, first and second side shields, and an encasing layer having a pole groove that accommodates the pole layer and first and second side shield grooves that accommodate the first and second side shields. In a manufacturing method for the magnetic head, the pole groove and first and second initial side shield grooves are formed in a nonmagnetic layer using an etching mask layer having first to third openings. In the manufacturing method, a wall face of the first initial side shield groove that is closer to the pole groove and a wall face of the second initial side shield groove that is closer to the pole groove are etched by dry etching to thereby complete the first and second side shield grooves. | 02-24-2011 |
| 20110019310 | Head gimbal assembly, suspension for the head gimbal assembly, and disk drive unit with the same - A HGA comprises a slider and a suspension with a flexure having a tongue region for supporting the slider. A read/write transducer and a piezoelectric element are formed oppositely. The connecting points of the curve beams and the inner tongue of the tongue region are in mirror positions to a center point of the inner tongue, and the connecting points of each curve beam are located at opposite sides of a center axis of the flexure. The slider has multiple electrical pads electrically connecting with the read/write transducer. The inner tongue has multiple electrical pads. The flexure has multiple inner leads electrically connected with the electrical pads of the inner tongue formed on the curve beams. The structure of the HGA prevents the read/write transducer from damaged and cause the manufacture of the HGA simpler. The present invention also discloses a suspension and a disk drive unit. | 01-27-2011 |
| 20100328820 | Dimple forming apparatus and dimple forming method - A dimple forming apparatus for forming dimple on a workpiece at a desired position comprises a base mould with a concave surface, a heating unit and a forming pin with a spherical surface. The base mould is configured to be positioned below the workpiece. The heating unit is configured to heat the desired position of the workpiece for enhancing tractility of the desired position of the workpiece, and the forming pin is configured to be positioned above workpiece with the spherical surface of the forming pin aiming toward the desired position of the workpiece heated by the heating unit. The heating unit successfully enhances the tractility of desired position of the workpiece before the desired position of the workpiece is punched by the forming pin, and produces low stress at the junction of the dimple formed by the forming pin punching and the workpiece of the workpiece. The present invention also discloses a dimple forming method, a head gimbal assembly and a method for manufacturing a head gimbal assembly. | 12-30-2010 |
| 20100315741 | Perpendicular magnetic recording head - A perpendicular magnetic write head capable of suppressing damage and corrosion of a magnetic pole to secure a stable writing performance is provided. | 12-16-2010 |
| 20100302685 | Magnetic head slider having ultra thin base layer with group 6A element and protective layer - A magnetic head slider according to the present invention comprises: a slider body including either a write head element or a read head element or both the write head element and the read head element; a seed layer provided on an air bearing surface of the slider body, the seed layer covering either the write head element or the read head element or both the write head element and the read head element, the seed layer having a film thickness that is less than 1 nm; and a protective film formed of diamond-like carbon, the protective film covering the seed layer. The seed layer is mainly formed of silicon and contains a 6A group element in a proportion of 2 atomic fractions or more and 30 atomic fractions or less. | 12-02-2010 |
| 20100302683 | Magnetic head slider having ultra thin base layer with group 6aelement and protective layer - A magnetic head slider according to the present invention comprises: a slider body including either a write head element or a read head element or both the write head element and the read head element; a seed layer provided on an air bearing surface of the slider body, the seed layer covering either the write head element or the read head element or both the write head element and the read head element, the seed layer having a film thickness that is less than 1 nm; and a protective film formed of diamond-like carbon, the protective film covering the seed layer. The seed layer is mainly formed of silicon and contains a 6A group element in a proportion of 2 atomic fractions or more and 30 atomic fractions or less. | 12-02-2010 |
| 20100302681 | Perpendicular magnetic recording head and method of manufacturing the same - A method of manufacturing a perpendicular magnetic write head capable of precisely narrowing a side gap is provided. A tip portion having a cross sectional geometry of an inverted trapezoid is formed in an opening portion of a non-magnetic layer and thereafter, the non-magnetic layer is etched with the tip portion as a mask. Thereby, a portion adjacent to the tip portion in a writing track width direction remains and an outermost edge portion of the tip portion in that direction is located on a plane which coincides with an etching face (side face) of the non-magnetic layer. When a gap layer is formed with a vapor phase growth such as a sputtering method to cover the side face of the non-magnetic layer and thereafter a side shield layer is formed adjacently to the tip portion therethrough, a thickness of the gap layer becomes extremely thin and is reproduced precisely. Therefore, the side gap is narrowed with high precision. | 12-02-2010 |
| 20100301835 | Current sensor - A current sensor includes, a current-measured wiring including parallel wiring sections in which portions of the same wiring are arranged in parallel such that electric current to be measured flows therein in opposite directions each other; a magnetism detection unit which is arranged between parallel wirings located in the parallel wiring sections and detects a magnetic field in a direction perpendicular to a plane formed by the parallel wirings; a current detection unit which detects electric current flowing in the current-measured wiring, based on the magnetic field detected by the magnetism detection unit; and a magnetic core surrounding the parallel wiring sections so as to intensify the magnetic field generated around the parallel wirings located in the parallel wiring sections when electric current flows in the wirings. The magnetic core has a pair of plates facing each other over a plane formed by the parallel wirings, the pair of plates having flat and parallel inner faces, and the magnetism detection unit is arranged between the pair of plates of the magnetic core. | 12-02-2010 |
| 20100301705 | PIEZOELECTRIC ACTUATOR AND METHOD OF MANUFACTURING THE SAME - A piezoelectric actuator includes a supporting substrate, a main body having a first piezoelectric laminate, a second piezoelectric laminate, and a displacement portion, and a first elastic layer. The first elastic layer is fixed to the main body so as to connect a lower surface of the first piezoelectric laminate, a lower surface of the second piezoelectric laminate, a side surface of the first piezoelectric laminate, and a side surface of the second piezoelectric laminate. A first region to fourth region of the first elastic layer is fixed to the principal surface of the supporting substrate by a first to fourth bonding portions. A non-bonding surface is not fixed to the principal surface of the supporting substrate. | 12-02-2010 |
| 20100291294 | Method of fabricating magnetic head slider including partial removal step of protecting film - The method of fabricating a magnetic head slider includes steps of: forming a first protective film on an air bearing surface of a magnetic head slider on which either a recording element or a reproduction element is formed or on which both a recording element and a reproduction element are formed; removing a portion of the first protective film to reduce the thickness of the first protective film and forming a second protective film over the first protective film that has been reduced in thickness; and forming an uneven portion for controlling the flying characteristics of the magnetic head slider on the air bearing surface of the magnetic head slider; wherein the formation of the uneven portion is carried out after the first protective film has been formed and before the second protective film is formed, or after the second protective film has been formed. | 11-18-2010 |
| 20100290159 | Common tray for head gimbal assembly and common tray assembly with the same - A common tray for HGA comprises a frame, a first inner bar, and a second inner bar parallel to and spaced from the first inner bar. Ends of the first and second inner bars connect to the opposite edges of the frame. A plurality of locating pillars and a plurality pairs of first bumps are uniformly-spaced formed on the first inner bar respectively. The first inner bar has portions between each said pair of first bumps recessed for forming spaces under the HGA. A plurality of second bumps are uniformly-spaced formed on the second inner bar for withstanding an edge of the base plate. The present common tray can replace five kinds of trays traditionally used in the HGA manufacturing process, and thus reduce the load/unload operations as well as the no-value stations and operators, thereby the productive efficiency is improved, and manufacturing cost is reduced. | 11-18-2010 |
| 20100232069 | METHOD FOR MANUFACTURING HEAD GIMBAL ASSEMBLY, METHOD FOR MANUFACTURING HARD DISK DRIVE, HEAD GIMBAL ASSEMBLY AND HARD DISK DRIVE - A method for manufacturing an head gimbal assembly (HGA) according to the present invention is comprised of: a step for preparing a thin film piezoelectric actuator including a first piezoelectric laminate having a first piezoelectric layer, and a second piezoelectric laminate having a second piezoelectric layer; a step for preparing a suspension; a fixing step for fixing the thin film piezoelectric actuator to the suspension; a first repolarization treatment step for performing repolarization treatment to the first piezoelectric layer after the fixing step; and a second repolarization treatment step for performing repolarization treatment to the second piezoelectric layer after the fixing step. | 09-16-2010 |
| 20100226611 | Optical module - Provided is an optical module which includes: an optical fiber; and a holder which holds an end-face side of the optical fiber and also carries a lens for condensing light to the end face of the optical fiber. The holder includes a loading face for loading a side-face side of the optical fiber and an abutting face to which the end face of the optical fiber is abutted so as to locate the end face of the optical fiber at a position where the light is condensed by the lens, and an upper area of the loading face is opened so that the optical fiber can be moved and loaded from the above the loading face. | 09-09-2010 |
| 20100200977 | Layered chip package and method of manufacturing same - A layered chip package has a main body including a plurality of pairs of layer portions, and wiring disposed on a side surface of the main body. Each layer portion includes a semiconductor chip. The plurality of pairs of layer portions include at least one specific pair of layer portions consisting of a first-type layer portion and a second-type layer portion. The first-type layer portion includes a plurality of electrodes each connected to the semiconductor chip and each having an end face located at the side surface of the main body on which the wiring is disposed, whereas the second-type layer portion does not include such electrodes. A layered substructure formed of a stack of two substructures each of which includes a plurality of preliminary layer portions aligned is used to fabricate a stack of a predetermined two or greater number of pairs of layer portions, and the main body is fabricated by stacking an additional first-type layer portion together with the stack, the number of the additional first-type layer portion being equal to the number of the specific pair(s) of layer portions included in the stack. | 08-12-2010 |
| 20100200959 | SEMICONDUCTOR SUBSTRATE, LAMINATED CHIP PACKAGE, SEMICONDUCTOR PLATE AND METHOD OF MANUFACTURING THE SAME - A semiconductor substrate has a plurality of groove portions formed along scribe lines. The semiconductor substrate includes: insulating layers formed in the plurality of groove portions; a rectangular unit region in contact with at least any one of the plurality of groove portions; and a wiring electrode including an extended terminal portion extended from the unit region to the inside of the groove portion. The semiconductor substrate is manufactured by forming a plurality of groove portions along scribe lines; embedding an insulating material in the plurality of groove portions and planarizing a surface to form insulating layers; and forming a wiring electrode including an extended terminal portion extended from a rectangular unit region in contact with at least any one of the plurality of groove portions to the inside of the groove portion. | 08-12-2010 |
| 20100200147 | Adhesive bonding method - The present invention provides an adhesive bonding method including: providing a first component and a second component to be bonded and an adhesive; positioning the adhesive between the first component and the second component with the adhesive contacting with the first component and the second component; providing at least one light concentrator; and providing a light source and making at least partial light beams of the light source pass through the light concentrator and the first component in order, and then irradiate on the adhesive to cure the adhesive so as to bond the first component and the second component. The adhesive bonding method of the instant invention can maintain the alignment precision between the components being bonded so as to optimize products' performances. The invention also provides a plate installing device with a light concentrator, which can be installed by the adhesive bonding method above mentioned. | 08-12-2010 |
| 20100195264 | CERAMIC CAPACITOR AND METHOD OF MANUFACTURING SAME - In a ceramic capacitor according to the present invention, an interdiginated pair of internal electrodes are arranged, on a substrate, perpendicular to a surface of the substrate, and a ceramic dielectric member is filled into a gap between this pair of internal electrodes. For this reason, the dimensions of the internal electrodes do not substantially change before and/or after the formation of the ceramic dielectric member, whereby the dimensions formed at the time of internal electrode can be maintained. According to this ceramic capacitor, since the internal electrode dimensions can be easily controlled like this, dimensional control of internal electrode spacing can also be easily carried out. | 08-05-2010 |
| 20100195262 | CERAMIC CAPACITOR AND METHOD OF MANUFACTURING SAME - In a ceramic capacitor according to the present invention, the electrode strips of an internal electrode and the dielectric strips of a ceramic dielectric member are arranged perpendicularly to the surface of a substrate, and as such, the plurality of electrode strips and the plurality of dielectric strips are arranged alternately along a parallel direction relative to the substrate surface. That is, the electrode strips and the dielectric strips are multi-layered along a parallel direction relative to the substrate surface, thereby facilitating the realization of multi-layering in the ceramic capacitor by a known patterning technology. | 08-05-2010 |
| 20100192343 | METHOD OF MANUFACTURING CERAMIC CAPACITOR - In a method of manufacturing ceramic capacitor according to the present invention, a pair of interdigitated internal electrodes are arranged perpendicularly to the surface of the substrate, subsequent to which the respective end faces of this pair of internal electrodes are exposed, and a pair of external electrodes are formed at these exposed end faces. In this method of manufacturing ceramic capacitor, formation of the external electrodes on the end faces of the respective internal electrodes, with these internal electrodes being interdigitately integrally-formed and the end faces thereof being exposed, it possible to reliably and easily form the external electrodes. | 08-05-2010 |
| 20100182003 | MAGNETIC FILM SENSOR AND METHOD OF MANUFACTURING THE SAME - A magnetic film sensor comprises a magnetic film for generating a magnetostriction, and a magnetostrictive structure for generating a magnetostriction in the magnetic film. The magnetostrictive structure is constructed so as to generate a magnetostriction by curving the magnetic film, for example. The magnetostrictive structure is obtained, for example, by providing a depressed insulating layer having a surface formed with a depression and forming the magnetic film across the depression. | 07-22-2010 |
| 20100154198 | Sensing unit and method of making same - In a sensing unit according to the present invention, a spring portion having a support portion and a movable portion is conductive. A signal of a sensor portion provided on the movable portion of the spring portion is transmitted via the spring portion. Hence, the sensing unit according to the present invention has a simple constitution with a small number of components, and a wire does not necessarily have to be provided for each sensor portion. As a result, a reduction in manufacturing cost, simplification of the manufacturing process, and so on are achieved. | 06-24-2010 |
| 20100147789 | METHOD FOR MANUFACTURING PIEZOELECTRIC ELEMENT - A manufacturing method of the present invention comprises the step of epitaxially growing a PZT layer on a first electrode layer, and the step of processing the PZT layer to a desired shape using an etching solution after the growing step. The etching solution contains at least one acid from among hydrochloric acid and nitric acid in a concentration C | 06-17-2010 |
| 20100118438 | THIN-FILM MAGNETIC HEAD, METHOD OF MANUFACTURING THE SAME, HEAD GIMBAL ASSEMBLY AND HARD DISK DRIVE - A thin-film magnetic head is manufactured as follows. First, a base insulating layer having a magnetic pole forming depression sunken into a form corresponding to the main magnetic pole layer is formed, a stop film for CMP is formed such as to fill the magnetic pole forming depression, and then a magnetic layer is formed on the stop film. Next, the magnetic layer is separated by forming a separation groove substantially surrounding the magnetic pole forming depression on the outside thereof, and thus separated magnetic layer is formed with a cover insulating film adapted to cover the whole upper face. The surface is polished by CMP until the stop film is exposed, so that the part of magnetic layer remaining on the inside of the magnetic pole forming depression is used as the main magnetic pole layer. Further, a recording gap layer, a write shield layer, and a thin-film coil are formed. | 05-13-2010 |
| 20100109137 | Layered chip package with heat sink - A layered chip package includes: a plurality of layer portions stacked, each of the layer portions including a semiconductor chip; and a heat sink. Each of the plurality of layer portions has a top surface, a bottom surface, and four side surfaces. The heat sink has at least one first portion, and a second portion coupled to the at least one first portion. The at least one first portion is adjacent to the top surface or the bottom surface of at least one of the layer portions. The second portion is adjacent to one of the side surfaces of each of at least two of the plurality of layer portions. | 05-06-2010 |
| 20100097724 | HEAD GIMBAL ASSEMBLY FOR HEAT-ASSISTED MAGNETIC RECORDING - Provided is an HGA with a radiation structure that can effectively get away the heat generated from a light source. The HGA comprises a suspension and a head comprising a slider and a light source unit. The suspension comprises an opening, and the light source unit projects through the opening to the opposite side to the slider in relation to the suspension. Further, the first and second pads are provided on the upper and lower surfaces of the suspension, respectively, the end surface opposite to the source-installation surface of the light source is connected to the first pad by the first connection member, and an electrode of the head part is connected to the second pad by the second connection member. Thus, heat flow paths can be provided from the light source to the opposed-to-medium surface to allow effective radiation of the heat generated from the light source. | 04-22-2010 |
| 20100097723 | THIN-FILM PIEZOELECTRIC DEVICE, PRODUCTION METHOD THEREOF, HEAD GIMBALS ASSEMBLY USING THE THIN-FILM PIEZOELECTRIC DEVICE, AND HARD DISK DRIVE USING THE HEAD GIMBALS ASSEMBLY - A method includes a step of stacking a first electrode layer, a piezoelectric layer, and a second electrode layer on a first substrate to form a first laminate; a step of stacking a support layer on a second substrate to form a second laminate; a step of bonding the first and second laminates through an adhesive layer to form a third laminate; a step of removing the first substrate from the third laminate; a step of processing the third laminate in a desired shape; and a step of removing the second substrate. A Young's modulus of the adhesive layer is smaller than a Young's modulus of the piezoelectric layer. Respective Young's moduli of the second electrode layer and the support layer are larger than the Young's modulus of the adhesive layer. The third laminate has no other piezoelectric layer except for the aforementioned piezoelectric layer. | 04-22-2010 |
| 20100044879 | Layered chip package and method of manufacturing same - A layered chip package includes a main body including a plurality of layer portions, and wiring disposed on a side surface of the main body. The plurality of layer portions include at least one layer portion of a first type and at least one layer portion of a second type. The layer portions of the first and second types each include a semiconductor chip. The layer portion of the first type further includes a plurality of electrodes each connected to the semiconductor chip and each having an end face located at the side surface of the main body on which the wiring is disposed, whereas the layer portion of the second type does not include any electrode connected to the semiconductor chip and having an end face located at the side surface of the main body on which the wiring is disposed. The wiring is connected to the end face of each of the plurality of electrodes. | 02-25-2010 |
| 20100003621 | Etching method for forming a multi-step surface on a substrate - An etching method for forming a multi-step surface on a substrate includes: (1) coating a first photo-resist layer on a predetermined surface of the substrate; (2) coating a second photo-resist layer on the first photo-resist layer, the second photo-resist layer having a characterization opposite to that of the first photo-resist layer; (3) exposing the second photo-resist layer through a first mask so as to form a first removal region; (4) developing the second photo-resist layer to remove the first removal region; (5) exposing the first photo-resist layer through a second mask so as to form a second removal region; (6) developing the first photo-resist layer to remove the second removal region; and (7) etching the predetermined surface of the substrate and the multi-step pattern to form a multi-step surface on the substrate. The present invention also discloses an etching method for forming features on an ABS of a slider. | 01-07-2010 |
| 20100000433 | Method for bonding slider row bars for photolithography process and method for manufacturing sliders - A method for bonding slider row bars for photolithography process includes steps of: (1) forming a holding device having a sticky surface; (2) providing a plurality of slider row bars each of which has a first surface for forming air bearing surface and a second surface opposite to the first surface, and attaching the slider row bars on the holding device with the first surfaces of the slider row bars facing to the sticky surface; (3) heating the holding device with the slider row bars attached thereon and pressing the second surfaces of the slider row bars to push the slider row bars into the sticky surface; (4) bonding the slider row bars together by an encapsulating glue to form a slider row bar assembly; (5) providing a carrier and bonding the carrier to the second surfaces of the slider row bars; and (6) removing the holding device. The invention also discloses a method for manufacturing sliders. | 01-07-2010 |
| 20090316306 | Thin film piezoelectric element and its manufacturing method, head gimbal assembly and disk drive unit with the same - A thin film piezoelectric element includes a piezoelectric thin film layer, a seed layer and an elastic substrate layer. The piezoelectric thin film layer is a laminated structure comprising a first electrode layer, a second electrode layer and a piezoelectric layer sandwiched between the first electrode layer and the second electrode layer. The seed layer is formed on the second electrode layer, and the elastic substrate layer is formed on the seed layer. The thin film piezoelectric element is a single layer structure and has an elastic substrate layer for supporting the single layer structure, thereby it has enough stiffness and flexibility to afford facilities for manufacture and assembly and to avoid film peeling and deformation, ultimately increasing the production efficiency and lowering the cost. The invention also discloses a method for manufacturing the thin film piezoelectric element, a head gimal assembly and a disk drive unit with the same. | 12-24-2009 |
| 20090296275 | THIN-FILM MAGNETIC HEAD, METHOD OF MANUFACTURING THE SAME, HEAD GIMBAL ASSEMBLY, AND HARD DISK DRIVE - A thin-film magnetic head is constructed such that a main magnetic pole layer having a magnetic pole end face on a side of a medium-opposing surface opposing a recording medium, a write shield layer opposing the main magnetic pole layer on the medium-opposing surface side, a gap layer formed between the main magnetic pole layer and write shield layer, and a thin-film coil wound about the write shield layer or main magnetic pole layer are laminated on a substrate. This thin-film magnetic head has an equidistant two-stage structure in which a first turn part of a first conductor layer and a second turn part of a second conductor layer overlap vertically along the medium-opposing surface while having the same front distance from respective front side faces closer to the medium-opposing surface to the medium-opposing surface. | 12-03-2009 |
| 20090290271 | Multi-chip module package including external and internal electrostatic discharge protection circuits, and/or method of making the same - Certain example embodiments disclosed herein relate to multi-chip module (MCM) packages that include external and internal electrostatic discharge (ESD) protection circuits, and/or methods of making the same. In certain example embodiments, ESD protection circuits are located under the IO pads in the MCM package, the size of the internal dies' ESD circuits are reduced (e.g., by making them as small as possible in certain example implementations), and high-immunity ESD circuits are provided to the IO pads where they are exposed to the external environment. The external ESD protection circuits may provide a higher level of voltage protection than the internal ESD protection circuits. Thus, the external ESD protection circuits may provide shock protection from human body model shocks, whereas the internal ESD protection circuits may provide protection from machine or assembly model shocks. | 11-26-2009 |
| 20090290263 | Piezoelectric element and manufacturing method thereof, head gimbal assembly, and disk drive device with the same - A piezoelectric element comprises a first laminated structure body and a second laminated structure body. Side surfaces of the first and the second laminated structure bodies that are parallel to a laminating direction both have at least a portion etched to form a recess so that a step distance is formed between sides of the two adjacent electrode layers that are parallel to the laminating direction. The design of the step distance of the present invention increases insulation resistance between the two adjacent electrode layers on the opposite surfaces of the piezoelectric layer, lowers reject rate, and reduce manufacture cost. The first and the second laminated structure bodies are symmetrically laminated and bonded together, thus optimizing force balancing performance. The recess of the first and second laminated structure body may be filled with insulation resin, which also increases insulation resistance between the two adjacent electrode layers of the piezoelectric layer. The present invention also discloses a method of manufacturing a PZT element, a HGA with the PZT element and a disk drive unit having such HGA. | 11-26-2009 |
| 20090290246 | Method for testing performance of a magnetic head slider - A method for testing performance of a magnetic head slider includes the steps of: (1) rotating the disk and positioning the slider over the rotating disk at an initial fly-height; (2) exciting the fly-height actuator to make the slider touch the disk and recording a touch down spacing of the read head of the slider; (3) backing off the slider at a predetermined backoff amount from the disk; (4) testing dynamic performance of the slider to obtain a reference value which is related to the spacing between the disk and the slider; (5) varying the initial fly-height of the slider; (6) repeating the steps (2) to (4) with the backoff amount fixed; and (7) calculating a dynamic fly-height gamma ratio based at least in part on the recorded touch down spacing and the obtained reference values. | 11-26-2009 |
| 20090284871 | Head gimbal assembly and manufacturing method thereof, and disk drive device with the same - A HGA includes a suspension, a seed layer formed on a PZT holding region of a flexure of the suspension and a piezoelectric element deposited on the seed layer. The piezoelectric element is electrically connected with the suspension to form a PZT micro-actuator. The present invention simultaneously conducts the manufacture, mechanical assembly and electrical connection of the piezoelectric element and suspension, thus the present invention has simple operation process and short process time, high manufacture yield, sound mechanical, dynamic and static performance. In addition, the present invention firstly forms the seed layer on the flexure and secondly forms the piezoelectric element on the seed layer, wherein the seed layer is metallic material, metal oxide, non-metallic material, or inorganic salt, the seed layer enables to easily control the operation and assists to improve the performance of the HGA. Besides, the electrical connection between the piezoelectric element and the suspension could be performed by sputtering process, printing process, or plating process, thus the present invention has a less difficulty to operate and sound connection reliability. The present invention also discloses a method for manufacturing the HGA and a disk drive unit. | 11-19-2009 |
| 20090284254 | Magnetic sensor - A magnetic sensor capable of detecting a magnetic field with high sensitivity is provided. The magnetic sensor includes a bridge circuit having a plurality of magneto resistive effect elements connected with each other, and is capable of detecting a differential voltage between predetermined connecting points. The magneto resistive effect elements output resistance values which vary in accordance with a direction of a magnetic field to be input, and are arranged such that fixed magnetization directions of all magneto resistive effect elements are in the same direction. Further, a magnetic body which changes the direction of the magnetic field to be input to the magneto resistive effect elements is also provided in the vicinity of the bridge circuit. | 11-19-2009 |
| 20090279207 | THIN-FILM MAGNETIC HEAD, METHOD OF MANUFACTURING THE SAME, HEAD GIMBAL ASSEMBLY, AND HARD DISK DRIVE - A thin-film magnetic head is constructed such that a main magnetic pole layer having a magnetic pole end face on a side of a medium-opposing surface opposing a recording medium, a write shield layer opposing the main magnetic pole layer on the medium-opposing surface side, a gap layer formed between the main magnetic pole layer and write shield layer, and a thin-film coil wound about the write shield layer or main magnetic pole layer are laminated on a substrate. This thin-film coil has a plurality of turn parts arranged at respective positions having different distances from the medium-opposing surface, while a non-expandable part made of an insulating material having a coefficient of thermal expansion smaller than that of a photosensitive resin is formed between the turn parts. | 11-12-2009 |
| 20090277591 | Auxiliary fixture for debonding sliders and method for manufacturing sliders using the same - An auxiliary fixture for debonding sliders from an exposure jig and receiving the sliders includes a debonding tray. A top surface of the debonding tray forms a plurality of slider pockets arranged in an array. Every two adjacent slider pockets in every column of the array are separated by an interval wall such that every interval wall corresponds to one slider pocket. One side of each interval wall that forms an inner wall of the corresponding slider pocket is an incline such that the interval wall has a structure tapering from the bottom up. The inclines of the interval walls in the same column of the array incline to the same side and the inclines of the interval walls in two adjacent columns of the array incline to opposite sides such that every two adjacent interval walls in every row of the array form side walls of each other's slider pockets. The present invention also discloses a method for manufacturing sliders with the auxiliary fixture. | 11-12-2009 |
| 20090273863 | Thin-film magnetic head for perpendicular magnetic recording and method of making the same - A perpendicular recording thin-film magnetic head comprises a main magnetic pole having a tip main magnetic pole part extending in a height direction from a medium-opposing surface and a base main magnetic pole part connected to the tip main magnetic pole part on a side opposite from the medium-opposing surface side and wider than the tip main magnetic pole part in a track width direction; a return yoke extending in the height direction from the medium-opposing surface and magnetically coupling with the base main magnetic pole part at a position distanced from the medium-opposing surface in the height direction, while opposing the tip main magnetic pole part through a write gap layer in a bit length direction in the medium-opposing surface; and a main magnetic pole adjacent magnetic shield layer extending along at least part of side faces of the main magnetic pole other than the medium-opposing surface as seen in a laminating direction, while holding a nonmagnetic layer between the main magnetic pole and the main magnetic pole adjacent magnetic shield layer. | 11-05-2009 |
| 20090273855 | Method for measuring pole width of a slider of a disk drive device - A method for measuring pole width of a slider of a disk drive includes steps of: getting an original image of the pole surface; calculating the light intensity distribution profile of the original image and determining maximum and minimum light intensity data points of the profile; setting average of the maximum and minimum light intensity data points as a threshold; carrying out quadratic differentiation of the profile to obtain a quadratic differential asymptote; determining cross points between the quadratic differential asymptote and the threshold; calculating the distance between the cross points to obtain an initial pole width; and performing data compensation to the initial pole width to obtain a compensated pole width. The method may also measure the distance between edges of other micro-objects. | 11-05-2009 |
| 20090261061 | Method for preventing fencing during process of forming an air-bearing surface on a slider substrate - The invention provides a method for preventing fencing during process of forming an ABS on a slider substrate includes the steps of: (a) providing a slider substrate having a photo-resist covered thereon, the photo-resist having a plurality of trenches developed thereon, the plurality of trenches collectively defining an air bearing surface pattern, the plurality of trench each having at least a non-vertical sidewall, the at least non-vertical sidewall including a zigzag-shaped edge adjoining the slider substrate; (b) etching the photo-resist by oxygen ions, such that the zigzag-shaped edge is trimmed to be a straight edge and the at least non-vertical sidewall is trimmed to be a vertical sidewall; and(c) etching the slider substrate exposed from the trenches such that a fencing-free air-bearing surface is formed on the slider substrate. | 10-22-2009 |
| 20090207884 | METHOD OF MEASURING TEMPERATURE OF TUNNEL MAGNETORESISTIVE EFFECT ELEMENT - A method of measuring temperature of a TMR element includes a step of obtaining in advance a temperature coefficient of element resistance of a discrete TMR element that is not mounted on an apparatus, by measuring temperature versus element resistance value characteristic of the discrete TMR element in a state that a breakdown voltage is intentionally applied to the discrete TMR element and a tunnel barrier layer of the discrete TMR element is brought into a stable conductive state, a step of bringing a tunnel barrier layer of a TMR element actually mounted on the apparatus into a stable conductive state by intentionally applying the breakdown voltage to the mounted TMR element having the same structure as that of the discrete TMR element whose temperature coefficient has been measured, a step of measuring an element resistance value of the mounted TMR element with the tunnel barrier layer that has been brought into a stable conductive state, and a step of obtaining a temperature corresponding to the measured element resistance value from the previously measured temperature coefficient of element resistance. | 08-20-2009 |
| 20090207529 | Flexible printed cable, head stack assembly with the same and manufacturing method thereof - A HSA includes a plurality of HGAs and an FPC. The FPC includes a connector for connecting with a control system, a voltage trace and a ground trace. A common voltage end of the voltage trace has a plurality of first voltage pads and a plurality of second voltage pads arranged adjacent to the corresponding first voltage pads respectively and electrically isolated from the respective first voltage pads. Each of the second voltage pads connects with the micro-actuator of the corresponding HGA. A common ground end of the ground trace has a plurality of micro-actuator ground pads, each of which connects with a micro-actuator of the corresponding HGA. The second voltage pads and the corresponding first voltage pads are connected with each other after the micro-actuator are tested. The invention also discloses a manufacturing method of the HSA. | 08-20-2009 |
| 20090195938 | Piezoelectric micro-actuator, head gimbal assembly and its assembling method, and disk drive device with the same - A PZT micro-actuator for a head gimbal assembly includes a pair of separate PZT elements and each PZT element has a body and a plurality of electrical pads. The body has at least two electrode-piezoelectric combination layers laminated together. The at least two electrode-piezoelectric combination layers are physically connected with but electrically isolated from each other. Each electrode-piezoelectric combination layer has at least two of the electrical pads thereon. The electrical pads extend out from the body of the corresponding PZT element. All the electrical pads of each PZT element are offset a predetermined distance therebetween to be electrically isolated. The present invention also discloses a head gimbal assembly (HGA) with the PZT micro-actuator, an assembling method for the head gimbal assembly and a disk drive unit having such HGA. | 08-06-2009 |
| 20090195919 | METHOD OF FABRICATING A SUSPENSION - In a method of fabricating a suspension, a suspension has first and second opposing surfaces and includes a flexure, a load beam, a mounting arm, and traces. The flexure is coupled to a proximal end of the load beam, and the mounting arm is coupled to a distal end of the load beam. The traces are coupled to the flexure. A suspension property to be altered is identified. A value of the unaltered suspension property is measured. An altered value of the suspension property is determined. The flexure, the load beam, or the mounting arm of the suspension, or a combination thereof, is coated with at least one layer of at least one film to alter the identified suspension property from the measured value to the predetermined altered value. | 08-06-2009 |
| 20090195243 | TILT ANGLE SENSOR AND DETECTION-TARGET DEVICE COMPRISING THE SAME - To provide a tilt angle sensor that is capable of detecting acceleration, a tilt angle, and the like of a device to which the tilt sensor angle is mounted, and also capable of reducing the size and the cost with a simple structure. The tilt angle sensor comprises: a spring member having a fixed end a free end that has a flexibility to be bent at least in one direction; a magnetic field generating device for generating a magnetic field, which is mounted at the free end of the spring member; a magnetic field detecting device provided by facing the magnetic field generating device for detecting a direction of the magnetic field generated by the magnetic field generating device; and a damping device for giving a damping force to a bending action of the spring member. | 08-06-2009 |
| 20090154023 | Electromagnetic damping locking apparatus for the disk drive unit - An electromagnetic damping apparatus for locking an actuator for a head stack assembly including at least one read/write head thereon is provided. In certain example embodiments, the electromagnetic damping apparatus may comprise a magnetic element and a metal element that cooperate in response to an electromagnetic field created by a current (e.g. an eddy current) to lock the actuator in a predetermined position. One of said magnetic element and said metal element may be fixed, and the other one may be movable by said actuator. The damping apparatus may be operable to selectively apply the current to lock the actuator by preventing the magnetic element and the metal element from moving apart. Certain electromagnetic damping apparatuses may be used with a disk drive device. | 06-18-2009 |
| 20090154020 | Method of manufacturing magnetic head slider - A method of manufacturing a highly reliable magnetic head slider, with a simplified manufacturing process which provides reduction in manufacturing time and costs, is provided. The manufacturing method includes a multi-layer forming step for forming a magnetic head section in a multi-layered manner, the magnetic head section including a read element and/or a write element and a magnetic shield for magnetically shielding the read element and/or the write element, and the magnetic head slider is manufactured by being cut off from a multi-layered body having the magnetic head section. The manufacturing method further includes, after the multi-layer forming step, a shield end removing step for removing end portions in a width direction of the magnetic shield located on the flying surface side of the magnetic head slider. | 06-18-2009 |
| 20090154007 | Altitude sensing systems for flying height adjustment - An altitude sensor includes a support frame and a sensor unit mounted in the support frame. The support frame has an upper shield and a lower shield. The sensor unit includes a beam and a damper. The damper is configured to move up and down in response to the air flow, which drives the beam to move up and down accordingly. Distances from the damper to the upper shield and the lower shield are less than those from the beam to upper shield and the lower shield. The altitude sensor possesses super specific properties such as unlimited sensitivity to flying height because of no size constraints and unchanged sensitivity under a changing environment, a selfprotective mechanism to resist deformation in case of an accident, easy manufacture process as well as low production cost. The present invention also discloses an altitude sensor for use in a disk drive device and a disk drive device with the altitude sensor. | 06-18-2009 |
| 20090141401 | ELECTRICAL CONNECTION BETWEEN A SUSPENSION FLEXURE CABLE AND A HEAD STACK ASSEMBLY FLEXIBLE CIRCUIT - A method and apparatus for electrically coupling a slider to a controller circuit are disclosed. In one embodiment, a pre-amplifier with an integrated electrical connector (I-connector) may be connected via an electrical trace to a slider and via a head stack assembly flexible circuit to a control circuit. The pre-amplifier may have two parallel series of spring probe claws, two parallel series of contact pegs, two slots, or a slot and a rotary cam. | 06-04-2009 |
| 20090135525 | Suspension, head gimbal assembly, and disk drive unit with the same - A suspension includes a flexure, a load beam, and a deformation-resistant plate positioned between the flexure and the load beam. The deformation-resistant plate has a holding plate portion for holding a slider through the flexure and a pair of beam portions. The beam portions each have a bent portion bent in a direction approximately perpendicular to the holding plate portion such that the deformation-resistant plate is configured into a three-dimensional structure. The three-dimensional structure of the deformation-resistant plate advantageously resists structural deformation, thus further enables the suspension to possess stable pitch and roll stiffness as well as small yaw stiffness. This not only assists the suspension to have good static performance and improved shock performance, but also assists the slider to rotate easily and to have desirable displacement when the micro-actuator is excited. The present invention also discloses a HGA with the suspension and a drive unit with such HGA. | 05-28-2009 |
| 20090135521 | Protective film forming method - To provide a high-quality protection target by forming a protective film that is thin and excellent in corrosion resistance. Provided is a protective film forming method for forming a protective film at least on a surface of a protection target. The method comprises: a base film forming step for forming a base film on the surface of the protection target; and a DLC film forming step for forming a diamond-like carbon film on the base film. The base film forming step forms the base film on the surface of the protection target for a plurality of times by repeating a process of depositing the base film in a prescribed thickness and eliminating a part of or a whole part of the base film. Further, the method comprises, before the DLC film forming step, an insulating layer forming step for forming an insulating layer on the surface of the base film on which the diamond-like carbon film is to be formed. | 05-28-2009 |
| 20090135512 | ELECTRICAL CURRENT AS PROBE FOR MODULATION AT HEAD-DISK INTERFACE - A system and method for measuring the modulation between a magnetic head and a magnetic storage medium, such as a disk, is disclosed. A magnetic read/write head is positioned above a magnetic storage medium at a given flying height. The magnetic read/write head reads a signal from the magnetic storage medium. A tester measures an alternating electric current between the magnetic read/write head through the slider and the magnetic storage medium. A computer may then calculate the modulation by the magnetic read/write head based on the alternating electric current. A DC voltage to the head may be applied to lower the flying height of the magnetic head. | 05-28-2009 |
| 20090119907 | Method for assembling a disk drive using a shipping comb - The invention discloses a method for assembling a disk drive including steps that providing a head stack assembly (HSA), providing a shipping comb for assembling the disk drive, inserting a comb pin of the shipping comb into a locating holes in a HSA to assemble the shipping comb with the HSA together, positioning the HSA and shipping comb on a base cover of the disk drive, installing the HSA on the base cover via a bearing device thereof, rotating the assembled HSA and shipping comb to park the HSA on the ramp and aligning the comb pin with the securing hole, pushing the comb pin into a securing hole to lock the HSA in the base cover, assembling a latch device and a top voice coil magnet on the base cover, rotating out the shipping comb to a position where the shipping comb is not interfered with the disk drive. | 05-14-2009 |
| 20090116149 | Magnetic head slider manufacturing method - To provide a manufacturing method which can adjust the lengths of a recording element and a reproducing element for enabling manufacture of high-quality magnetic head sliders. The manufacturing method comprises: a stacked-layer forming step which stacks magnetic heads on a substrate; a lapping step which cuts out a bar block having a plurality of connected magnetic head sliders, and polishes a flying surface; and a slider cutting step which cuts out individual magnetic head sliders from the bar block. The stacked-layer forming step forms a reproducing-element polish amount detecting sensor on a same layer as that of the reproducing element, and forms a recording-element polish amount detecting sensor on a same layer as that of the recording element. The lapping step carries out polishing based on each output value of the reproducing-element polish amount detecting sensor and the recording-element polish amount detecting sensor. | 05-07-2009 |
| 20090086612 | OPTICAL PICKUP HEAD AND OPTICAL RECORDING AND REPLAYING DEVICE - Optical pickup head comprises two semiconductor lasers for irradiating first to third optical beams, light receiving element for converting an optical signal into an electrical signal, and object lens unit. Object lens unit includes first object lens (object lens for CD, DVD, and HD-DVD) and second object lens (object lens for Blu-ray Disc) having a numerical aperture different from first object lens. First object lens and second object lens are moved in a tangential direction or in a radial direction of recording medium, so that first object lens and second object lens can be selectively arranged opposite to a position to be irradiated with the optical beam of recording medium. | 04-02-2009 |
| 20090081481 | Magnetic head and method of manufacturing the same - A plurality of magnetic heads are formed on a substrate, each of the magnetic head includes a reproducing element to read magnetic information, a recording element to write magnetic information, a reproducing element marker formed on the same plane as that on which the reproducing element is formed, and a recording element marker formed on the same plane as that on which the recording element is formed. The substrate is cut to form a bar including a plurality of the magnetic heads. The bar is held, the reproducing element marker and the recording element marker in the held bar are optically sensed, and positions of the reproducing element marker and the recording element marker are determined. A posture of the held bar is adjusted based on the positions of the reproducing element marker and the recording element marker. The bar with the posture adjusted is polished and then the polished bar is cut into individual magnetic heads. | 03-26-2009 |
| 20090080307 | Method of manufacturing optical head including the step of adjusting parallelism of light beam - A method for manufacturing an optical head having a laser beam emitting device that emits a light beam of a predetermined wavelength, an objective lens that focuses the light beam on an optical recording medium and a parallelism adjusting lens that is disposed on an optical path between the laser beam emitting device and the objective lens, wherein the parallelism adjusting lens is configured to change parallelism of the laser beam, is disclosed. The method comprise the step of adjusting the parallelism of the light beam that has passed through the parallelism adjusting lens by adjusting a distance between the laser beam emitting device and the parallelism adjusting lens while causing the laser beam emitting device to emit the light beam and causing the light beam to pass through the parallelism adjusting lens. | 03-26-2009 |
| 20090080114 | Head gimbal assembly, flexible printed cable, head stack assembly, and disk drive unit with the same - A head gimbal assembly comprises a micro-actuator and a suspension. The suspension provides a single channel electrically connecting a bonding terminal of the suspension with the micro-actuator for controlling the movement of the micro-actuator. Thus the head gimbal assembly has a simple layout of a single channel to control the micro-actuator. The present invention also discloses a head gimbal assembly avoiding the occurrence of cross-talk, a flexible printed cable utilizing a common voltage lead to reduce its size, a head stack assembly with alternately arranged and stacked head gimbal assemblies which reduces or even prevents suspension and arm vibration resonance as well as avoids sliders from off-track and out of TMR budget, and a disk drive unit with such head stack assembly. | 03-26-2009 |
| 20090080111 | Bonded structure and method of making the same, head gimbal assembly, head stack assembly and disk drive unit using the same - The present bonded structure uses metal ball to bond or weld the respective bonding surfaces of electrical pads which are arranged to face the same direction. The structure can be controlled visually and thus enables a high connection quality of no short circuit. In addition, the bonding operation of the bonded structure is carried out without using pressure, thus it will not damage surroundings of the electrical components. Accordingly, the manufacture yield is significantly improved and the cost is prominently reduced. The present invention also discloses a bonding method and a head gimbal assembly and a head stack assembly and a drive unit using the bonded structure. | 03-26-2009 |
| 20090074949 | MEASURING AND NEUTRALIZING THE ELECTRICAL CHARGE AT THE INTERFACE OF A MAGNETIC HEAD AND MEDIA - A system and method for measuring and neutralizing the electrical charge at the interface of a magnetic head and a magnetic storage medium, such as a disk, is disclosed. A surface treatment material is applied to the magnetic head. The surface treatment material matches the medium surface material on the surface of the magnetic storage medium. The surface treatment material on the magnetic read/write head may be a fluorinated carbon, such as a Fomblin Z-derivative, perfluoro alkyl trichlorosilane, a FC-722, or a fluorinated polymer. The surface treatment material can be applied to the magnetic head by a vapor deposition process or by a liquid immersion process. The charge on the head-disk interface can be measured by applying varying external charges to the head while reading a signal previously written to the disk. | 03-19-2009 |
| 20090073611 | Suspension for mounting slider, head gimbal assembly and disk drive unit with the same - A suspension for a HGA includes a flexure having a suspension tongue with electrical pads adapted for mounting a slider thereon. The suspension tongue has some portions etched with left portions therebetween forming into at least one hinge or spring mechanism for releasing thermal deformation of the suspension tongue and suppressing thermal crown change of the slider. The etched portions have an H-shaped, an M-shaped, an X-shaped, or a stairway configuration, or the like. The invention also discloses a HGA with the suspension and a disk drive unit having such suspension. | 03-19-2009 |
| 20090056121 | Method of manufacturing electronic component package - An electronic component package includes: a main body including a plurality of layer portions that are stacked and that have their respective side surfaces, the main body having a side surface including the side surfaces of the layer portions; and wiring disposed on the side surface of the main body. Each of the layer portions has at least one electronic component chip and a plurality of electrodes disposed on the side surface of the layer portion. A method of manufacturing the electronic component package includes the steps of fabricating a main body aggregate including a plurality of pre-main-body portions each of which is to become the main body later, the pre-main-body portions being arranged in one direction orthogonal to the direction of stacking of the plurality of layer portions; forming the wiring for each of the pre-main-body portions of the main body aggregate; and cutting the main body aggregate after the formation of the wiring so as to separate the plurality of pre-main-body portions from each other so that each of them becomes the main body and a plurality of electronic component packages are thereby formed. | 03-05-2009 |
| 20090052094 | Magnetic head for perpendicular magnetic recording and method of manufacturing the same, the magnetic head including pole layer and two shields sandwiching the pole layer - A magnetic head includes a pole layer, a first and a second shield disposed to sandwich the pole layer, and a nonmagnetic layer disposed around the first shield. The pole layer includes a first portion having an end face located in a medium facing surface, and a second portion that is located farther from the medium facing surface than is the first portion. The second portion is greater in thickness than the first portion. A bottom surface of the second portion is located closer to a substrate than is a bottom surface of the first portion. The first shield has a first top surface portion opposed to the bottom surface of the first portion with the first gap layer in between. The nonmagnetic layer has a second top surface portion opposed to the bottom surface of the second portion with the first gap layer in between. A difference in level is formed between the first and the second top surface portion such that the second top surface portion is located closer to the substrate than is the first top surface portion. | 02-26-2009 |
| 20090046392 | Voice coil motor and hard disk drive with the same - A voice coil motor for a hard disk drive includes an inner core having an inner surface, an outer plate having an inner surface, a permanent magnet, and a coil of wire. The outer plate is positioned in spaced relation to the inner core such that a gap is defined between the inner surfaces of the inner core and the outer plate. The permanent magnet is located in the gap and attached to the inner surface of the outer plate. The coil of wire wraps around the inner core to form a solenoid coil. With such structure, the stiffness of the coil is increased. The invention also discloses a disk drive with such VCM in which the coil is directly bonded to the E-block of the hard disk drive. Therefore heat conduction of the hard disk drive is improved. | 02-19-2009 |
| 20090046391 | ELECTRICAL CONNECTION BETWEEN A SUSPENSION FLEXURE CABLE AND A HEAD STACK ASSEMBLY FLEXIBLE CIRCUIT - A method and apparatus for electrically coupling a slider to a controller circuit are disclosed. In one embodiment, a pre-amplifier with an integrated electrical connector (I-connector) may be connected via an electrical trace to a slider and via a head stack assembly flexible circuit to a control circuit. The pre-amplifier may have two parallel series of spring probe claws, two parallel series of contact pegs, two slots, or a slot and a rotary cam. | 02-19-2009 |
| 20090045809 | Magnetic sensor and manufacturing method of the same - To provide a magnetic sensor that can be reduced in size and cost. Provided is a magnetic sensor which comprises: a magnetic field detection chip having a magnetic field detection element for detecting a magnetic field and an output terminal for outputting an output signal from the magnetic field detection element; and a substrate that has the magnetic field detection chip mounted thereon, and has a connection terminal for being connected to the output terminal of the magnetic field detection chip that is formed on a mount face of the substrate. An output-terminal formed face of the magnetic field detection chip is arranged not to be in parallel to the mount face of the substrate. More specifically, the output-terminal formed face of the magnetic field detection chip is arranged almost vertical to the mount face of the substrate. | 02-19-2009 |
| 20090045162 | THIN FILM MAGNETIC HEAD AND MANUFACTURING METHOD THEREOF - A thin film magnetic head has a configuration in which a main magnetic pole film having a magnetic pole end portion on a medium opposing surface (ABS) side facing a magnetic disk, a write shield film facing the magnetic pole end portion so as to form a recording gap film on the medium opposing surface side, and a thin film coil wound around at least a part of the write shield film are laminated. Further, the thin film magnetic head has an upper yoke magnetic pole film whose size is larger than that of the main magnetic pole film at a part more distant from the ABS than the recording gap film, and this upper yoke magnetic pole film is bonded to the side of the main magnetic pole film close to the thin film coil. In the upper yoke magnetic pole film, an end portion on the ABS side is retracted in a direction apart from the ABS in accordance with an increase in film thickness which is measured from the surface of the main magnetic pole film. | 02-19-2009 |
| 20090040655 | Thin-film magnetic head structure, method of manufacturing the same, and thin-film magnetic head - A method of manufacturing a thin-film magnetic head structure comprises the steps of preparing an insulating layer | 02-12-2009 |
| 20090034127 | SUSPENSION WITH LOCALLY STRENGTHENED INTEGRATED TRACE CONNECTIONS - A head gimbal assembly may comprise a slider, a micro-actuator attached to the slider, a flexure to mount the slider and the micro-actuator, and a suspension comprising a support region, a main portion, and a moving portion, wherein the flexure comprises a plurality of trace sets to electrically couple the micro-actuator and the slider, and wherein the plurality of trace sets are laminated generally parallel to each other. | 02-05-2009 |
| 20090027808 | Performance test method of head gimbal assembly with precise positioning micro-actuator - A method of testing a performance of a HGA including a magnetic head and a micro-actuator for precisely positioning the magnetic head with respect to a magnetic medium is disclosed. The key of the method is to obtain three track center values under conditions of no driving the micro-actuator, driving the micro-actuator in a positive direction using an operating DC voltage, and driving the micro-actuator in a negative direction using the operating DC voltage respectively, and finally do calculation of the three track center values, thus successfully obtains the displacement performance of the micro-actuator in a simple way. The method is capable of testing the HGA's performance under lower operating voltage by moving the slider by a predetermined distance toward an off-track direction, which accordingly assists to identify three track center values and thereby ensures the method an accurate measurement. | 01-29-2009 |
| 20090027807 | Head gimbal assembly having balanced weight, disk drive unit with the same and manufacturing method thereof - A HGA includes a load beam having a dimple formed thereon; a flexure including a suspension tongue and a support plate connected with the suspension tongue; and a slider having a leading edge and trailing edge opposite to the leading edge. The slider is mounted on the flexure such that the slider is supported by the dimple at the center of the slider. The leading edge is attached on the suspension tongue and trailing edge is attached on the support plate. A weight-balance structure is formed on the suspension tongue of the flexure to balance the weight of the HGA between a portion from the trailing edge to the slider center and another portion from the leading edge to the slider center. The invention also discloses various methods of manufacturing HGA with the balanced weight. | 01-29-2009 |
| 20090026603 | Electronic component package and method of manufacturing same - An electronic component package includes: a base having a top surface and a side surface; and a plurality of layer portions stacked on the top surface of the base, each of the layer portions including at least one electronic component chip. The base includes a plurality of external connecting terminals, and a retainer for retaining the plurality of external connecting terminals. Each of the external connecting terminals has an end face located at the side surface of the base. At least one of a plurality of electronic component chips that the plurality of layer portions include is electrically connected to at least one of the external connecting terminals. | 01-29-2009 |
| 20090015968 | Voice coil motor and disk drive unit with the same - A voice coil motor for a disk drive includes a permanent magnet, a voice coil adapted to move in an arc proximate to the permanent magnet, a top plate positioned above the voice coil, and a bottom plate positioned below the voice coil. The permanent magnet has two halves that are magnetized in opposite direction. The two halves of the magnet are split into a right half magnet portion and a left half magnet portion. The right half magnet portion and the left half magnet portion are attached to the top plate and the bottom plate respectively at opposite sides of the voice coil motor. The invention also discloses a disk drive unit with such VCM. | 01-15-2009 |
| 20090009911 | Suspension With Locally Strengthened Gimbal - An apparatus with a head gimbal assembly designed to reduce movement and rotation of components of the head gimbal assembly structure is disclosed. One embodiment head gimbal assembly may comprise a flexure including a ramp limiter, a suspension assembly further comprising a suspension tongue, a slider further comprising a magnetic head; and a load beam further comprising a lift tab; and a ramp further comprising a step to engage and support the ramp limiter and support and constrain the movement of the slider. In certain embodiments, the flexure may further comprise a flexure rail located at its end to reduce movement and rotation of the suspension tongue. | 01-08-2009 |
| 20090000093 | Capacitor and method of manufacturing the same and capacitor unit - The present invention has a configuration which allows manufacturing a capacitor comprising a first electrode layer, conductive first convex sections layered on a surface of the first electrode layer, a first dielectric layer formed on a surface of the first convex sections and a surface of the first electrode layer, and a second electrode layer formed so as to be superimposed on the first convex sections and the first electrode layer via the first dielectric layer. | 01-01-2009 |
| 20080316637 | NON-CONTACT MEASUREMENT OF SLIDER FLY HEIGHT BY ELECTROSTATIC FORCE - In a system and method for a non-contact measurement of the fly height of a slider above a magnetic data storage medium using electrostatic force, a slider with a read/write head flies over a magnetic data storage medium. A series of distinct voltages are applied between the slider and the magnetic data storage medium, and corresponding read-back signals are recorded. Using the recorded read-back signals, coefficients for an empirical curve-fit equation are calculated. The coefficients are normalized and converted into a fly height measurement. | 12-25-2008 |
| 20080314146 | Sensing unit and method of making same - In a sensing unit according to the present invention, a movable portion of a spring portion is supported floatably above a recessed portion formed in a substrate. Thus, the movable portion is capable of oscillating in any direction parallel to the substrate surface. Moreover, the movable portion is capable of oscillating in the thickness direction of the substrate such that the amplitude of a center side end portion thereof reaches a maximum. A sensor portion is provided on the movable portion. As a result, the sensing unit according to the present invention has a higher degree of freedom in terms of the measurement direction than a conventional sensing unit that oscillates in only one direction. | 12-25-2008 |
| 20080313882 | Sensing unit and method of making same - In a sensing unit according to the present invention, a spring portion having a support portion and a movable portion is conductive. A signal of a sensor portion provided on the movable portion of the spring portion is transmitted via the spring portion. Hence, the sensing unit according to the present invention has a simple constitution with a small number of components, and a wire does not necessarily have to be provided for each sensor portion. As a result, a reduction in manufacturing cost, simplification of the manufacturing process, and so on are achieved. | 12-25-2008 |
| 20080304181 | METHOD AND APPARATUS FOR PROVIDING AN AIR BEARING WITH HIGHER FLYING HEIGHT FOR LOWER ROTATING SPEED DRIVES - A method and apparatus for improving flying height stability at lower speeds is achieved by an ABS with a channel and pocket. The channel and pocket are configured to achieve a desired flying height profile. | 12-11-2008 |
| 20080298214 | Objective lens actuator utilizing piezoelectric elements - An objective lens actuator includes a lens holder for holding an objective lens, a holder support member for holding the lens holder movably along a direction of an optical axis of the objective lens and rotatably about a rotation axis that is parallel to the direction of the optical axis, and a base for holding the holder support member. A gap is provided between the holder support member and the base, the gap extending around a junction which connects the holder support member with the base, wherein a plurality of piezoelectric elements are inserted in the gap. | 12-04-2008 |
| 20080297953 | Magnetic head for perpendicular magnetic recording with a shield and method of manufacturing same - A magnetic head includes: a coil; a pole layer; a shield having an end face located in a medium facing surface forward of an end face of the pole layer along a direction of travel of a recording medium; a gap layer between the shield and the pole layer; and a substrate on which the foregoing elements are stacked. The top surface of the pole layer includes: first and second portions with a difference in height therebetween; and a third portion connecting the first and second portions to each other. The first portion has an edge located in the medium facing surface, and the second portion is located farther from the medium facing surface and from the substrate than the first portion. The magnetic head further includes a nonmagnetic layer disposed between the second portion and the gap layer. The nonmagnetic layer has a surface touching the second portion, the surface having an edge located at the boundary between the second and third portions. The nonmagnetic layer has a thickness equal to or greater than the difference in height between the first and second portions. | 12-04-2008 |
| 20080297948 | Suspension, head gimbal assembly and manufacturing method thereof, and disk drive unit with the same - A suspension for a HGA includes a flexure having a tongue region and an out trigger. The out trigger has a pair of rigid beams and a pair of spring beams. The pair of spring beams enables the flexure to possess favorable flexibility and assists a slider to have enough displacement. The pair of rigid beams provides the flexure enough stiffness which not only successfully prevents the HGA with the out trigger from suspension deformation and dimple separation, but also assists to improve shock performance of the HGA. Furthermore, such configuration of the suspension provides the slider a good static performance and thus improves dynamic performance of the HGA. The present invention also discloses a HGA with the suspension, a manufacturing method of the HGA, and a drive unit with such HGA. | 12-04-2008 |
| 20080295621 | METHOD AND MECHANISM OF THE SUSPENSION RESONANCE OPTIMIZATION FOR THE HARD DISK DRIVER - A system and method are disclosed for using a test slider to test the resonance performance of a head gimbal assembly. The test slider has a two-stripe air-bearing surface to allow the test slider to glide above a surface and a block with a mass equal to the combined mass of the electrical slider and the micro-actuator. The leading edge of the slider is tapered and has a main air groove to facilitate gliding. A back step on the side of the test slider opposite the air bearing surface maintains a parallel gap between the slider and the suspension tongue of the head gimbal assembly. | 12-04-2008 |
| 20080295328 | Method of manufacturing electronic component package - In a method of manufacturing an electronic component package, first, a plurality of sets of external connecting terminals corresponding to a plurality of electronic component packages are formed by plating on a top surface of a substrate to thereby fabricate a wafer. The wafer includes a plurality of pre-base portions that will be separated from one another later to become bases of the respective electronic component packages. Next, at least one electronic component chip is bonded to each of the pre-base portions of the wafer. Next, electrodes of the electronic component chip are connected to the external connecting terminals. Next, the electronic component chip is sealed. Next, the wafer is cut so that the pre-base portions are separated from one another and the plurality of bases are thereby formed. | 12-04-2008 |
| 20080291579 | METHOD FOR TESTING NOISE OF THIN-FILM MAGNETIC HEAD, AND MAGNETIC DISK DRIVE APPARATUS WITH NOISE TESTING FUNCTION - A noise-testing method for a thin-film magnetic head with an MR read head element and a heating unit capable of applying a heat and a stress to the MR read head element, includes a step of applying alternately and discontinuously with each other an electrical power having a first level and an electrical power having a second level higher than the first level to the heating unit, and a step of evaluating the thin-film magnetic head by measuring a noise output or noise outputs obtained from the MR read head element when the electrical power or the electrical powers are applied to the heating unit. | 11-27-2008 |
| 20080291563 | Torsion compensation coil for voice coil motor of disk drive device, and method of making the same - Certain example embodiments relate to torsion compensation coils that cooperate with primary coils in voice coil motors of disk drive devices, and methods of making the same. In certain example embodiments, a voice coil motor is provided which may include a single external magnet. A primary coil may be located above the external magnet, with the primary coil being capable of receiving a first current. At least one torsion compensation coil may be connected to the primary coil. The at least one torsion compensation coil may be capable of receiving a second current. The at least one torsion compensation coil may be configured to reduce torsion and/or bending forces introduced by the first current passing through primary coil and/or magnetic field leakage from the external magnet. | 11-27-2008 |
| 20080280029 | Surface treatment method for solder joint - A surface treatment method for solder joint employs alkali buffer solution dipping the solder joint and the alkali buffer solution reacts with the solder joint thus yielding a passive layer. As the resultant passive layer forms on the surface of the solder joint, thereby prevents further corrosion and dissolution during aqueous cleaning or water dipping thereafter. In addition, the passive layer ensures a good appearance with maximum protection of the solder joint and also provides a sound reliability and a high testability of a finished electronic product equipped with the solder joint. | 11-13-2008 |
| 20080273273 | Thin-film magnetic head including two magnetic layers and flat spiral coil, and method of manufacturing same - A thin-film magnetic head includes a first magnetic layer, a flat, spiral-shaped coil, a toroidal-shaped insulating layer covering the coil, and a second magnetic layer touching the insulating layer and disposed to sandwich part of the coil between itself and the first magnetic layer. The second magnetic layer has a recessed portion that enters a space inside the insulating layer. In the recessed portion, the bottom surface of the second magnetic layer includes a first flat portion a part of which touches the top surface of the first magnetic layer, while the top surface of the second magnetic layer includes a second flat portion located in the space and substantially parallel to the first flat portion. In a cross section that divides each of the first and second magnetic layers into two equal portions, the second flat portion is 0.3 to 6 μm in length, and a distance from an edge of the interface between the top surface of the first magnetic layer and the first flat portion closer to the medium facing surface to an edge of the top surface of the first magnetic layer farther from the medium facing surface is 0.35 to 0.95 times the length of the first flat portion. | 11-06-2008 |
| 20080273267 | Slider with improved structure for adjusting flying height thereof and hard disk drive with the same - A slider has a slider substrate, a read sensor, a top shield and a bottom shield sandwiching the read sensor, and a write shield. The slider substrate is electrically connected to a substrate electrical connection which is adapted to provide a flying height control voltage to the slider substrate for realizing EFH control so that the bottom shield and the write shield both are electrically connected to a ground electrical connection to eliminate pits on shields of the slider as well as reduce electrostatic discharge (ESD) damage and noise during EFH operation. The slider also employs a bottom plate, a heater and a shunting circuit with shunting resistances to optimum reading and/or writing performance by further better preventing noise, cross-talk and ESD. The present invention also discloses a hard disk drive with the slider for adjusting the slider's flying height. | 11-06-2008 |
| 20080266714 | Suspension and fabricating method thereof, head gimbal assembly and disk drive device - A suspension for supporting a head slider has a flexure, several trace patterns positioned on the flexure, front flexure-bonding pads disposed on the flexure at a position corresponding to a leading edge of the head slider and connected to the trace patterns, and rear flexure-bonding pads disposed on the flexure at a position corresponding to a trailing edge of the head slider and connected to the trace patterns. The front and the rear flexure-bonding pads and the trace patterns are integrally formed and disposed on the flexure at the same time, so the fabricating process is simplified and there is no alignment problem for bonding location. This can ensure the connection strength and position between the head slider and the suspension changeless and, in turns, ensure a good attitude of the head slider. The invention also discloses a HGA and a disk drive device with such suspension, and a fabricating method for the suspension. | 10-30-2008 |
| 20080266713 | Suspension, head gimbal assembly and manufacturing method thereof, and disk drive unit with the same - A suspension for a HGA includes a suspension flexure and an out trigger. The suspension flexure has a tongue region having a first flexure part in a tip portion thereof for mounting a trailing edge of a slider and a PZT mounting region for mounting PZT elements. One end of the out trigger is connected to the suspension flexure, and the other end of the out trigger has a trigger support portion which extends above the tongue region so as to support the leading edge of the slider. The structure of the out trigger is capable of stiffening the tongue region of the suspension flexure and, in turns, avoiding the deformation problem and the dimple separation problem during the manufacturing process or in vibration or shock events. The invention also discloses a HGA with the suspension, manufacturing methods of the HGA and a disk drive unit having such HGA. | 10-30-2008 |
| 20080253034 | Perpendicular magnetic write head, method of manufacturing the same, and magnetic write system - The present invention is directed to providing a perpendicular magnetic write head which can suppress unintended erasure of information written on a write medium at a non-writing time by optimizing a magnetic domain structure of main component elements that are engaged in writing operation. In the perpendicular magnetic write head, an auxiliary magnetic pole layer is disposed on a trailing or leading side of a main magnetic pole layer, the auxiliary magnetic pole layer being recessed from the main magnetic pole layer. When the main magnetic pole layer has a tensile stress as its internal stress, a nonmagnetic layer disposed in a layer same as the auxiliary magnetic pole layer and in an area in front of the auxiliary magnetic pole layer, also has a tensile stress as its internal stress. | 10-16-2008 |
| 20080253032 | Thin film magnetic head, head gimbal assembly, head arm assembly, magnetic disk device and method of forming thin film magnetic head - A thin film magnetic head is provided, in which thermal protrusion can be suppressed. The thin film magnetic head includes a main magnetic pole layer which conducts a magnetic flux into the recording medium so that the recording medium is magnetized in a direction perpendicular to a surface of the recording medium, a first return yoke layer provided in a trailing side of the main magnetic pole layer, and has a recess in a top surface, a second return yoke layer provided so as to fill at least the recess of the first return yoke layer, and a thermal expansion suppression layer provided in a trailing side of the second return yoke layer. Thus, since the thermal expansion suppression layer can be provided on a surface having no recess, a possibility of a crack in the thermal expansion suppression layer can be eliminated. | 10-16-2008 |
| 20080253025 | METHOD AND APPARATUS FOR PROVIDING AN ADDITIONAL GROUND PAD AND ELECTRIC AL CONNECTION FOR GROUNDING A MAGNETIC RECORDING HEAD - Method and apparatus are presented for electrically coupling a slider to ground. In one embodiment, a bonding pad is provided on a side of the slider body separate from the bonding pad(s) used for read/write signals. This separate bonding pad is electrically coupled within the slider body to components that are to be coupled to ground. A separate conductor provided on the suspension (e.g., a trace, a flex circuit, etc.) may be electrically coupled to the separate bonding pad via gold ball bonding. The conductor is also coupled to ground in the hard-disk drive device (e.g., via the preamplifier). The use of the separated bonding pad and trace may negate the need to use a conductive adhesive to electrically ground the slider via its attachment to the tongue of a slider. | 10-16-2008 |
| 20080251099 | METHOD FOR REMOVING SMEAR AND MAGNETIC RECORDING/REPRODUCING APPARATUS WITH FUNCTION OF REMOVING SMEAR - Provided is a smear-removing method that can remove smear of a manufactured thin-film magnetic head. The method is performed to a thin-film magnetic head including an MR effect element for reading data having two electrode layers sandwiching an MR effect multilayer as a magneto-sensitive portion therebetween. The method comprises the step of applying a stress voltage less than a breaking voltage of the MR effect element between the two electrode layers to burn off smear. In the method, it is preferable that the stress voltage is applied while an electric resistance or an output voltage of the MR effect element is measured, and the stress voltage is increased until the value of the electric resistance or the output voltage reaches an upper limit specified value specified from a value of an electric resistance or an output voltage in a normal case where smear is not present. | 10-16-2008 |
| 20080247088 | Micro-actuator having at least one segmented flexible side arm, and method of making the same - Certain example embodiments described herein relate to a micro-actuator for use with an HGA and/or disk drive device. A substantially U-shaped frame may include a cavity capable of receiving a slider. The frame may include two segmented, flexible side arms and a bottom support arm at least partially defining the cavity. Each segmented side arm may have a PZT element mounted on an outer surface thereof facing away from the cavity, and each may include a lower portion proximate to the bottom support arm and an upper portion disposed at an end opposing the bottom support arm. The lower portion and the upper portion may be at least partially separated by a gap. Accordingly, micro-actuators having better resonance and servo performance, reduced difficulties associated with the slider/micro-actuator mounting process, and/or better shock performance may be provided. | 10-09-2008 |
| 20080247087 | Magnetic head for perpendicular magnetic recording and method of manufacturing same, the magnetic head incuding pole layer and two shields sandwiching the pole layer - A magnetic head incorporates: a medium facing surface; a coil; a pole layer; first and second shields disposed to sandwich the pole layer therebetween; a first gap layer disposed between the first shield and the pole layer; a second gap layer disposed between the second shield and the pole layer; and a substrate. The first shield is located closer to the substrate than the second shield. The first shield has a first layer and a second layer disposed between the first layer and the first gap layer. | 10-09-2008 |
| 20080247078 | Altitude sensing systems and methods for fly height adjustment - Altitude sensing systems and/or methods for fly height adjustment in disk drive devices are provided. In certain example embodiments, a PZT-type pressure and/or altitude sensor may be located on the side of the disk drive proximate to the disk edge. When the disk rotates, the air flow generated by the disk will deform the PZT element of the sensor. The PZT element will generate a voltage in response to this deformation. Calibrations may be performed to compensate for altitude changes (e.g. the air inside of the disk drive will become thin and the air resistance will be reduced at higher altitudes). Also, the output sensitivity of the PZT element may change with the altitude change. After the altitude is sensed by the PZT element in the sensor, the servo motor may use this signal to calculate and/or adjust the dynamic fly height (DFH) and/or fly height of the read/write head. | 10-09-2008 |
| 20080242203 | Apparatus and method for lapping slider using floating lapping head - An apparatus for lapping a slider comprises a lapping head for supporting elements while pressing the elements against a rotating lapping plate, the elements that are to be formed into sliders, a holding mechanism for supporting the lapping head, the holding mechanism having a first engaging member that extends in a vertical direction, a base for supporting the holding mechanism, the base having a second engaging member that extends in the vertical direction, wherein the second engaging member is engaged with the first engaging member to form an internal space therebetween, and a decompressing mechanism for decompressing the internal space. The holding mechanism is subjected to vertically upward force from the decompressed internal space in order to be movably supported by the base in the vertical direction. | 10-02-2008 |
| 20080239583 | Thin film magnetic head, head gimbal assembly, head arm assembly, magnetic disk device and method of forming thin film magnetic head - The thin film magnetic head includes a main magnetic pole layer conducting a magnetic flux to the recording medium so that the recording medium an be magnetized in a direction orthogonal to a surface thereof; a return yoke layer disposed on a trailing side of the main magnetic pole layer; an intermediate protective layer partially disposed on a magnetic shield layer; and a thermal expansion suppressing layer having an edge located on the intermediate protective layer and being in contact with the return yoke layer in an area where the intermediate protective layer is not formed. If the thin film magnetic head is affected by ambient temperature environment, the thermal expansion suppressing layer suppresses the shift of the main magnetic pole layer and the return yoke layer toward the air bearing surface. This suppresses thermal protrusion from occurring on the thin film magnetic head due to ambient temperature environment. | 10-02-2008 |
| 20080239580 | Magnetic head for perpendicular magnetic recording and method of manufacturing same, the magnetic head including pole layer and two shields that sandwich the pole layer - A magnetic head incorporates: a medium facing surface; a coil; a pole layer; first and second shields disposed to sandwich the pole layer therebetween; a first gap layer disposed between the first shield and the pole layer; a second gap layer disposed between the second shield and the pole layer; and a substrate. The first shield is located closer to the substrate than the second shield. The magnetic head further incorporates an antireflection film disposed between the first shield and the first gap layer or between the first gap layer and the pole layer. The pole layer is formed by frame plating. | 10-02-2008 |
| 20080239577 | BALANCED HGA FOR IMPROVED SEEKING PERFORMANCE - In a balanced head gimbal assembly for improved seeking performance, a slider having a magnetic head with a set of read elements to read data and a set of write elements to write data, an air-bearing surface, and a non-air-bearing surface is coupled to a suspension. The suspension includes a loadbeam, a flexure, and a balancing weight. The loadbeam is coupled to an actuator arm. The flexure, coupled to the loadbeam, has a window through which a dimple, coupled to the loadbeam, contacts a dimple contact point. The balancing weight, coupled to the flexure, has a configuration which permits alignment of a center of mass of the head gimbal assembly with the dimple contact point. | 10-02-2008 |
| 20080239572 | SUSPENSION WITH BI-LAYER FLEXURE BASE - A flexure with improved temperature sensitivity is disclosed. An embodiment of the present invention includes a bi-layered flexure that raises or lowers a read/write element a distance that is approximately equal to the distance of protrusion and retraction at varying temperatures. | 10-02-2008 |
| 20080237313 | SOLDERING METHOD AND APPARATUS - To improve the quality of the products that are manufactured by soldering, through enabling highly reliable soldering while suppressing damages to the bonding targets caused due to the soldering. Provided is a soldering method for bonding each of bonding pads formed in respective bonding targets with solder. The method comprises: a bonding target placing step for placing each of bonding targets to a bonding position; a soldering step for placing solder between each of the bonding pads formed in each of the bonding targets, and for performing soldering by irradiating a heating beam to the solder; and a bonding target heating step for heating at least one of the bonding targets, which is executed before the soldering step and/or simultaneously with the soldering step. | 10-02-2008 |
| 20080237158 | Cleaning tray for electrical components and carrying tool with the same - A cleaning tray for electrical components includes a holder having a frame and a pair of crossed inner bars. End portions of the crossed inner bars connect to the frame to separate the frame into four sub-frames. The frame has a bottom bar, two opposite side bars and a top bar which is tilted against the bottom bar for facilitating dropping water. Several male fasteners are formed along inner borders of each of the sub-frames. The cleaning tray is shared by those different electrical components and consequently to reduce tray cost, simplify manufacturing process and increase productive efficiency. The invention also discloses a carrying tool for electrical components with the cleaning tray. | 10-02-2008 |
| 20080223155 | Probe assembly for lapping bar using patterned probe - A probe assembly used to lap a bar, the bar being provided with elements that are to be formed into sliders, is provided. The probe assembly comprises an elastically deflectable probe, and a stopper for applying bending deformation to the probe so as to cause first bending deflection at a leading end of the probe and for maintaining the first bending deflection of the leading end while preventing a bending deformation at the leading end from becoming smaller than the first bending deflection. The leading end of the probe is adapted to be subjected to second bending deflection that is larger than the first bending deflection in a same direction as a direction of the first bending deflection and thereby to abut against an electrode pad to establish electrical connection between the probe and the electrode pad, the electrode pad being provided on a surface of the bar other than a surface to be lapped. | 09-18-2008 |
| 20080218895 | Systems and/or methods for controlling bias voltages between recording media and read/write heads in disk drive devices - Certain example embodiments relate to techniques for more precisely adjusting the spacing between a head and a disk in a disk drive device. A spindle motor of a disk drive device may be electrically isolated from at least the base plate by means of, for example, a nonconductive adhesive. Circuitry for monitoring and/or applying a voltage to the head and/or to the disk to control an amount of spacing between the head and the disk may be provided. In certain example embodiments, such circuitry may monitor the disk voltage and then apply an appropriate voltage bias to the head to control the spacing therebetween electrostatically. In certain other example embodiments, such circuitry may monitor the head voltage and then adjust the spindle voltage accordingly. In still other example embodiments, the disk voltage and the head voltage may be controlled and/or adjusted based on a known voltage differential so that a precise disk/head voltage potential is achieved. | 09-11-2008 |
| 20080212242 | Method for preventing TMR MRR drop of a slider and method for manufacturing sliders - The invention provides a method for preventing TMR MRR drop of a slider, including: positioning a row bar constructed by sliders on a tray, each slider incorporating a TMR element; loading the tray into a processing chamber and evacuating the processing chamber to a predetermined pressure; forming a first etching means; exposing the sliders to the first etching means such that an oxide layer is formed on a surface of the TMR element; forming a second etching means; and exposing the sliders to the second etching means such that the oxide layer is etched to get a reduced thickness. The invention also discloses a method for manufacturing sliders. | 09-04-2008 |
| 20080202036 | METHOD AND APPARATUS FOR TREATING THE SURFACE OF A MEDIA, SUCH AS A MAGNETIC HARD DISK, WHILE OPERATING, SUCH AS DURING DYNAMIC ELECTRICAL TESTING - A system and method for treating (e.g. polishing to remove defects) the surface of a media, such as a magnetic hard disk, while in operation, such as during dynamic electrical testing is disclosed. Further, a method for manufacturing a head for treating the surface of a media is disclosed. | 08-28-2008 |
| 20080197484 | Method of manufacturing electronic component package, and wafer and substructure used for manufacturing electronic component package - In a method of manufacturing an electronic component package, first, there is fabricated a wafer incorporating a plurality of sets of external connecting terminals corresponding to a plurality of electronic component packages, and a retainer for retaining the plurality of sets of external connecting terminals, the wafer including a plurality of pre-base portions that will be separated from one another later to be bases of the electronic component packages. Next, at least one electronic component chip is bonded to each of the pre-base portions of the wafer. Next, electrodes of the electronic component chips are connected to the external connecting terminals. Next, the electronic component chips are sealed. Next, the wafer is cut so that the pre-base portions are separated from one another and the plurality of bases are thereby formed. | 08-21-2008 |
