| Roth & Rau AG Patent applications |
| Patent application number | Title | Published |
|---|
| 20110124144 | SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD - A substrate processing apparatus includes an evacuatable process chamber configured to receive a substrate carrier having at least one substrate, a plasma generating module, a gas feed, a gas discharge and a vapor etching module provided in the process chamber. A substrate processing method includes introducing a substrate carrier including at least one substrate into an evacuatable process chamber, generating a plasma in a plasma process using a plasma generating module in a gas or a gas mixture, performing a vapor etching of the at least one substrate before, after or alternatingly with the plasma process and performing at least one of a coating, etching, surface modification and cleaning of the substrate. | 05-26-2011 |
| 20090242131 | ECR PLASMA SOURCE - The invention relates to an ECR plasma source comprising a coaxial microwave supply line with an internal conductor and an external conductor, wherein the internal conductor with one end as the antenna passes through a vacuum flange in insulated fashion, which vacuum flange closes off an opening in the wall to the plasma space. A multipole magnet arrangement is provided coaxially with respect to the microwave supply line and its magnetic fields pass through the vacuum flange and form an annular-gap magnetic field in the plasma space coaxially with respect to the antenna. The antenna protrudes directly into the plasma space and, in comparison with the internal conductor, it has a radially larger antenna head at which an underside is provided parallel to the vacuum flange in such a way that an annular gap is formed between the vacuum flange and the underside and that the plasma space is delimited coaxially with respect to the antenna and radially outside the annular-gap magnetic field by means of a shield, whose end side facing away from the vacuum flange defines the plasma outlet opening. | 10-01-2009 |
