ROKKO TECHNOLOGY PTE LTD.
|ROKKO TECHNOLOGY PTE LTD. Patent applications|
|Patent application number||Title||Published|
|20120000337||ASSEMBLY AND METHOD FOR IMPROVED SINGULATION - A punch and die assembly for singulating an IC unit from a substrate, the assembly comprising an array of punches a guide block having opposed first and second faces with a plurality of elongate channels corresponding to each punch extending from said first to second face; a die block for supporting said substrate, said die block having an array of punching zones at which the punches bear so as to singulate all or a portion of a peripheral edge of said IC units from the substrate.||01-05-2012|
|20100096735||CLAMPING ASSEMBLY - A clamping assembly for clamping a lead frame with pre-attached semiconductor device, comprising of: a first member, to hold the lead frame, said first member having a surface profile in contact with a surface profile of the semiconductor device, a second member for allowing the mounting of the first member thereon, an attachment means to secure the first member onto the second member, wherein the attachment means is adjustable to conform the surface profile of the first member to the surface profile of the lead frame.||04-22-2010|