Rohm and Haas Electronic Materials LLC Patent applications |
Patent application number | Title | Published |
20150279511 | ADHESION PROMOTER - Compositions useful for improving the adhesion of coating compositions, such as dielectric film-forming compositions, include a hydrolyzed amino-alkoxysilane having a protected amino moiety. These compositions are useful in methods of improving the adhesion of coating compositions to a substrate, such as an electronic device substrate. | 10-01-2015 |
20150212414 | IONIC THERMAL ACID GENERATORS FOR LOW TEMPERATURE APPLICATIONS - New ionic thermal acid generator compounds are provided. Also provided are photoresist compositions, antireflective coating compositions, and chemical trim overcoat compositions, and methods of using the compositions. | 07-30-2015 |
20150179467 | Methods of Forming Patterns - Some embodiments include methods of forming patterns. A first mask is formed over a material. The first mask has features extending therein and defines a first pattern. The first pattern has a first level of uniformity across a distribution of the features. A brush layer is formed across the first mask and within the features to narrow the features and create a second mask from the first mask. The second mask has a second level of uniformity across the narrowed features which is greater than the first level of uniformity. A pattern is transferred from the second mask into the material. | 06-25-2015 |
20150072291 | SELF-ASSEMBLED STRUCTURES, METHOD OF MANUFACTURE THEREOF AND ARTICLES COMPRISING THE SAME - Disclosed herein is a graft block copolymer comprising a first block polymer; the first block polymer comprising a backbone polymer and a first graft polymer; where the first graft polymer comprises a surface energy reducing moiety that comprises a halocarbon moiety, a silicon containing moiety, or a combination of a halocarbon moiety and a silicon containing moiety; a second block polymer; the second block polymer being covalently bonded to the first block; wherein the second block comprises the backbone polymer and a second graft polymer; where the second graft polymer comprises a functional group that is operative to undergo acid-catalyzed deprotection causing a change of solubility of the graft block copolymer in a developer solvent. | 03-12-2015 |
20150064620 | PHOTOACID GENERATOR, PHOTORESIST, COATED SUBSTRATE, AND METHOD OF FORMING AN ELECTRONIC DEVICE - A photoacid generator compound has formula (1) | 03-05-2015 |
20150056793 | DOPING OF A SUBSTRATE VIA A DOPANT CONTAINING POLYMER FILM - Disclosed herein is a method for doping a substrate, comprising disposing a coating of a composition comprising a dopant-containing polymer and a non-polar solvent on a substrate; and annealing the substrate at a temperature of 750 to 1300° C. for 1 second to 24 hours to diffuse the dopant into the substrate; wherein the dopant-containing polymer is a polymer having a covalently bound dopant atom; wherein the dopant-containing polymer is free of nitrogen and silicon; and wherein the method is free of a step of forming an oxide capping layer over the coating prior to the annealing step. | 02-26-2015 |
20140377518 | ORIENTATION CONTROL LAYER POLYMERS, METHODS OF MANUFACTURE THEREOF AND ARTICLES COMPRISING THE SAME - Disclosed herein is a method comprising disposing a first composition comprising a first block copolymer upon a substrate; where the first block copolymer comprises a first segment and a second segment that are covalently bonded to each other and that are chemically different from each other; where the first segment has a first surface free energy and where the second segment has a second surface free energy; and disposing a second composition comprising an second copolymer upon a free surface of the first block copolymer; where the second copolymer comprises a surface free energy reducing moiety; where the surface free energy reducing moiety has a lower surface free energy than the first surface free energy and the second surface free energy; the second copolymer further comprising one or more moieties having an affinity to the first block copolymer; where the surface free energy reducing moiety is chemically different from the first segment and from the second segment. | 12-25-2014 |
20140377465 | NEUTRAL LAYER POLYMERS, METHODS OF MANUFACTURE THEREOF AND ARTICLES COMPRISING THE SAME - Disclosed herein is a block copolymer comprising a first segment and a second segment that are covalently bonded to each other and that are chemically different from each other; where the first segment has a first surface free energy and where the second segment has a second surface free energy; and an additive copolymer; where the additive copolymer comprises a surface free energy reducing moiety where the surface free energy reducing moiety has a lower surface free energy than that of the first segment and the second segment; the additive copolymer further comprising one or more moieties having an affinity to the block copolymer; where the surface free energy reducing moiety is chemically different from the first segment and from the second segment; where the additive copolymer is not water miscible; and where the additive copolymer is not covalently bonded with the block copolymer. | 12-25-2014 |
20140322648 | COMPOSITIONS AND PROCESSES FOR IMMERSION LITHOGRAPHY - New photoresist compositions are provided that are useful for immersion lithography. Preferred photoresist compositions of the invention comprise one or more materials that can be substantially non-mixable with a resin component of the resist. Further preferred photoresist compositions of the invention comprise 1) Si substitution, 2) fluorine substitution; 3) hyperbranched polymers; and/or 4) polymeric particles. Particularly preferred photoresists of the invention can exhibit reduced leaching of resist materials into an immersion fluid contacting the resist layer during immersion lithography processing. | 10-30-2014 |
20140295347 | ACID GENERATORS AND PHOTORESISTS COMPRISING SAME - Acid generator compounds are provided that comprise an oxo-1,3-dioxolane moiety and/or an oxo-1,3-dioxane moiety. The acid generators are particularly useful as a photoresist composition component. | 10-02-2014 |
20140262799 | METHOD OF FILLING THROUGH-HOLES - The methods inhibit or reduce dimpling and voids during copper electroplating of through-holes with flash copper layers in substrates such as printed circuit boards. An acid solution containing reaction products of aromatic heterocyclic nitrogen compounds and epoxy-containing compounds is applied to the through-holes of the substrate followed by filling the through-holes with copper using a copper electroplating bath which includes additives such as brighteners and levelers. | 09-18-2014 |
20140242287 | PLATING CATALYST AND METHOD - A solution including a precious metal nanoparticle and a polymer polymerized from at least two monomers, (1) a monomer having two or more carboxyl groups or carboxyl acid salt groups and (2) a monomer which has π electron-available features. The solution is useful for a catalyst of a process for electroless plating a metal on non-conductive surface. | 08-28-2014 |
20140238868 | ELECTROPLATING BATH - Compositions suitable for the electrodeposition of copper on substrates, such as electronic device substrates, are provided. Methods of depositing copper layers on surfaces and filling apertures with copper are also provided. | 08-28-2014 |
20140206201 | HARDMASK SURFACE TREATMENT - Compositions suitable for forming oxymetal hardmask layers are provided. Methods of forming oxymetal hardmask layers using such compositions are also provided, where the surface of the oxymetal hardmask layer formed has a water contact angle substantially matched to that of subsequently applied organic coatings. | 07-24-2014 |
20140202632 | HARDMASK SURFACE TREATMENT - Methods of treating the surface of a metal-containing hardmask used in the manufacture of semiconductors by contacting the hardmask surface with a composition capable of adjusting the water contact angle so as to substantially match that of subsequently applied organic coatings are provided. | 07-24-2014 |
20140186767 | ACID GENERATORS AND PHOTORESISTS COMPRISING SAME - Acid generator compounds are provided that are particularly useful as a photoresist composition component. In one preferred aspect, photoresists are provided that comprise (i) a polymer; (ii) a first onium salt acid generator that produces a first acid upon exposure of the photoresist composition to activating radiation; and (iii) a second onium salt acid generator that 1) comprises a covalently bound acid-labile moiety and 2) produces a second acid upon exposure of the photoresist composition to activating radiation, wherein the first acid and second acid have pKa values that differ by at least 0.5. | 07-03-2014 |
20140183052 | COPPER ELECTROPLATING SOLUTION AND METHOD OF COPPER ELECTROPLATING - A copper electroplating solution which contains compounds with the structure —X—S—Y— wherein X and Y are, independently atoms selected from a group consisting of hydrogen, carbon, sulfur, nitrogen, and oxygen, and X and Y can be the same only if they are carbon atoms and ninhydrin. By using this copper electroplating solution, it is possible to form good filled vias without worsening the appearance of the plating. | 07-03-2014 |
20140179582 | METHODS AND COMPOSITIONS FOR REMOVAL OF METAL HARDMASKS - The invention provides a process for removing a film from a substrate, said process comprising applying a composition to the film, and
| 06-26-2014 |
20140178572 | FORMALDEHYDE FREE ELECTROLESS COPPER PLATING COMPOSITIONS AND METHODS - The copper electroless baths are formaldehyde free and are environmentally friendly. The electroless copper baths include one or more sulfinate compounds as reducing agents to replace formaldehyde. The electroless baths are stable and deposit a bright copper on substrates. | 06-26-2014 |
20140174937 | COPPER ELECTROPLATING SOLUTION AND METHOD OF COPPER ELECTROPLATING - A copper plating solution which contains compounds with the structure —X—S—Y— where X and Y are, independently of each other, atoms selected from a group consisting of hydrogen, carbon, sulfur, nitrogen, and oxygen, and X and Y can be the same only if they are carbon atoms and aliphatic semialdehydes. By using this copper electroplating solution it is possible to form good filled vias without worsening the appearance of the plating. | 06-26-2014 |
20140174936 | PLATING OF COPPER ON SEMICONDUCTORS - Monovalent copper plating baths are used to metallize current tracks of the front side or emitter side of semiconductor wafers. Copper is selectively deposited on the current tracks by electrolytic plating or LIP. Additional metallization of the current tracks may be done using conventional metal plating baths. The metalized semiconductors may be used in the manufacture of photovoltaic devices. | 06-26-2014 |
20140174322 | ORGANIC SOLDERABILITY PRESERVATIVE AND METHOD - An organic solderability preservative solution includes pyrazine derivatives which inhibit corrosion of metal. The solution is applied to metal surfaces of components for electronic apparatus to improve solderability of electrical connections between the components in the electronic apparatus. | 06-26-2014 |
20140120470 | PHOTORESISTS COMPRISING IONIC COMPOUND - New photoresist compositions are provided that comprise a component that comprises a radiation-insensitive ionic compound. Preferred photoresists of the invention may comprise a resin with photoacid-labile groups; a photoacid generator compound; and a radiation-insensitive ionic compound that can function to decrease undesired photogenerated-acid diffusion out of unexposed regions of a photoresist coating layer. | 05-01-2014 |
20140120469 | THERMAL ACID GENERATORS FOR USE IN PHOTORESIST - New photoresist compositions are provided that comprise a component that comprises a thermal acid generator and a quencher. Preferred photoresists of the invention may comprise a resin with photoacid-labile groups; a photoacid generator compound; and at least one thermal acid generator and at least one quencher that can function to improve line width roughness and photospeed. | 05-01-2014 |
20140120263 | PROCESS FOR ELECTROLESS PLATING AND A SOLUTION USED FOR THE SAME - A process of pretreatment for selective application of electroless metallization to a surface of a non-conductive material and a solution useful for the pretreatment are provided. The process achieves good coverage in areas to be plated on the surface of non-conductive materials without skip plating or over plating. | 05-01-2014 |
20140120244 | ADHESION PROMOTER - Compositions useful for improving the adhesion of coating compositions, such as dielectric film-forming compositions, include a hydrolyzed poly(alkoxysilane). These compositions are useful in methods of improving the adhesion of coating compositions to a substrate. | 05-01-2014 |
20140120242 | ADHESION PROMOTER - Compositions useful for improving the adhesion of coating compositions, such as dielectric film-forming compositions, to a substrate are provided. Also provided are methods of improving the adhesion of coating compositions to a substrate. | 05-01-2014 |
20140117503 | EPHEMERAL BONDING - Compositions suitable for temporarily bonding two surfaces, such as a wafer active side and a substrate, are disclosed. Methods of temporarily bonding two surfaces, such as the active side of a wafer and a substrate using the compositions disclosed herein are also provided. | 05-01-2014 |
20140083322 | METHOD OF REMOVING IMPURITIES FROM PLATING LIQUID - Impurities are removed from tin plating liquids by adding additives containing aromatic organic sulfonic acids or salts thereof to the tin plating liquids containing nonionic surface active agents and thiourea or thiourea compounds and producing a precipitate by cooling. | 03-27-2014 |
20140081045 | METAL PLATING COMPOSITIONS AND METHODS - Disclosed are metal plating compositions and methods. The metal plating compositions provide good leveling performance and throwing power. | 03-20-2014 |
20140080060 | ACID GENERATOR COMPOUNDS AND PHOTORESISTS COMPRISING SAME - Acid generator compounds are provided that are particularly useful as a photoresist composition component. In one preferred aspect, cyclic sulfonium salt and photoresist compositions that comprise such compounds are provided. In another preferred aspect, acid generator compounds are provided that comprise one or more covalently linked acid-labile moieties, particularly ester-containing acid-labile moieties. | 03-20-2014 |
20140065836 | TEXTURING OF MONOCRYSTALLINE SEMICONDUCTOR SUBSTRATES TO REDUCE INCIDENT LIGHT REFLECTANCE - Monocrystalline semiconductor substrates are textured with alkaline solutions to form pyramid structures on their surfaces to reduce incident light reflectance and improve light absorption of the wafers. The alkaline baths include hydantoin compounds and derivatives thereof in combination with alkoxylated glycols to inhibit the formation of flat areas between pyramid structures to improve the light absorption. | 03-06-2014 |
20140061956 | ORGANOMETALLIC COMPOUND PURIFICATION - Methods of purifying crude cyclopentadienyl magnesium compounds using a scavenging agent are provided. The purified cyclopentadienyl magnesium compounds have very low levels of metallic impurities. | 03-06-2014 |
20140061155 | Composition and method for preparing pattern on a substrate - A copolymer composition and a method of processing a substrate to form line space features thereon are provided. | 03-06-2014 |
20140051248 | INKJET PRINTABLE ETCH RESIST - The methods involve selectively depositing a resist containing a solid hydrogenated rosin resin and a liquid hydrogenated rosin resin ester as a mixture on a semiconductor followed by etching uncoated portions of the semiconductor and simultaneously inhibiting undercutting of the resist. The etched portions may then be metallized to form current tracks. | 02-20-2014 |
20140027954 | Method of manufacturing high aspect ratio silver nanowires - A process for manufacturing silver nanowires is provided, comprising: providing a silver ink core component containing ≧60 wt % silver nanoparticles dispersed in a silver carrier; providing a shell component containing a film forming polymer dispersed in a shell carrier; providing a substrate; coelectrospinning the silver ink core component and the shell component depositing on the substrate a core shell fiber having a core and a shell surrounding the core, wherein the silver nanoparticles are in the core; and, treating the silver nanoparticles to form a population of silver nanowires, wherein the population of silver nanowires exhibit an average length, L, of ≧60 μm. | 01-30-2014 |
20140020764 | Vapor Delivery Device, Methods of Manufacture And Methods of Use Thereof - A method comprises transporting a first stream of a carrier gas to a delivery device that contains a liquid precursor compound. The method further comprises transporting a second stream of the carrier gas to a point downstream of the delivery device. The first stream after emanating from the delivery device and the second stream are combined to form a third stream, such that the dew point of the vapor of the liquid precursor compound in the third stream is lower than the temperature of the plumbing that transports the vapor to a CVD reactor or a plurality of CVD reactors. The flow direction of the first stream, the flow direction of the second stream and the flow direction of the third stream are unidirectional and are not opposed to each other. | 01-23-2014 |
20140015400 | Phosphor and light emitting devices comprising same - A red phosphor is provided. Also provided is a lighting apparatus containing a red phosphor. | 01-16-2014 |
20140014002 | High temperature thermal annealing process - A method for processing a substrate is provided; wherein the method comprises applying a film of a copolymer composition, comprising a poly(styrene)-b-poly(siloxane) block copolymer component; and, an antioxidant to a surface of the substrate; optionally, baking the film; subjecting the film to a high temperature annealing process under a gaseous atmosphere for a specified period of time; followed by a treatment of the annealed film to remove the poly(styrene) from the annealed film and to convert the poly(siloxane) in the annealed film to SiO | 01-16-2014 |
20140014001 | Thermal annealing process - A method for processing a substrate is provided; wherein the method comprises applying a film of a copolymer composition, comprising a poly(styrene)-b-poly(siloxane) block copolymer component; and, an antioxidant to a surface of the substrate; optionally, baking the film; annealing the film in a gaseous atmosphere containing ≧20 wt % oxygen; followed by a treatment of the annealed film to remove the poly(styrene) from the annealed film and to convert the poly(siloxane) in the annealed film to SiO | 01-16-2014 |
20140004701 | TEXTURING OF MONOCRYSTALLINE SEMICONDUCTOR SUBSTRATES TO REDUCE INCIDENT LIGHT REFLECTANCE | 01-02-2014 |
20130344438 | PHOTOACID GENERATOR, PHOTORESIST, COATED SUBSTRATE, AND METHOD OF FORMING AN ELECTRONIC DEVICE - A photoacid generator has the formula (I): | 12-26-2013 |
20130337179 | METAL HARDMASK COMPOSITIONS - The invention provides a composition comprising at least the following A and B:
| 12-19-2013 |
20130270356 | APPARATUS AND METHOD FOR PRODUCING FREE-STANDING MATERIALS - An apparatus includes a manifold with a chamber for mixing multiple reactants. Gases are jetted into the manifold by a plurality of inlet injectors. The inlet injectors are arranged such that the gases passing into the manifold impinge on each other at a common point to form a mixture. The mixture passes through a plurality of holes in one side of the manifold into a deposition chamber where the mixture of gases impinges on additional gases at a common point to provide a reaction resulting in deposition of solid materials in the deposition chamber. The solid materials are free-standing. | 10-17-2013 |
20130264214 | METAL PLATING FOR PH SENSITIVE APPLICATIONS - Metal electroplating processes are used in pH sensitive applications to plate metal layers on semiconductors. The semiconductors may be used in the manufacture of photovoltaic devices and solar cells. | 10-10-2013 |
20130256145 | PLATING BATH AND METHOD - Silver electroplating baths having certain sulfide compounds and methods of electrodepositing a silver-containing layer using these baths are disclosed. Such electroplating baths are useful to provide silver-containing solder deposits having reduced void formation and improved within-die uniformity. | 10-03-2013 |
20130244438 | PHOTOLITHOGRAPHIC METHODS - Provided are photoresist overcoat compositions, substrates coated with the overcoat compositions and methods of forming electronic devices by a negative tone development process. The compositions, coated substrates and methods find particular applicability in the manufacture of semiconductor devices. | 09-19-2013 |
20130244178 | PHOTORESISTS COMPRISING MULTI-AMIDE COMPONENT - New photoresist compositions are provided that comprise a component that comprises two or more amide groups. Preferred photoresists of the invention may comprise a resin with photoacid-labile groups; a photoacid generator compound; and a multi-amide component that can function to decrease undesired photogenrated-acid diffusion out of unexposed regions of a photoresist coating layer | 09-19-2013 |
20130236742 | ADHESION PROMOTION OF CYANIDE-FREE WHITE BRONZE - White bronze is electroplated from a cyanide-free tin/copper bath onto a void inhibiting layer coating a copper underlayer. The void inhibiting metal layer includes one or more void inhibiting metals. | 09-12-2013 |
20130230707 | METHOD OF MAKING DURABLE ARTICLES - Optical articles of zinc sulfide and zinc selenide with thick coatings of alumina are disclosed. The alumina coatings are deposited on the zinc sulfide and zinc selenide by a microwave assisted magnetron sputtering. In addition to alumina coatings, the optical articles may also include various polymer coatings. | 09-05-2013 |
20130230657 | STABLE CATALYSTS FOR ELECTROLESS METALLIZATION - Catalysts include nanoparticles of catalytic metal and gallic acid or gallic acid derivatives or salts thereof. The catalysts are used in electroless metal plating. The catalysts are free of tin. | 09-05-2013 |
20130216718 | STABLE CATALYST FOR ELECTROLESS METALLIZATION - Catalysts include nanoparticles of catalytic metal and cellulose or cellulose derivatives. The catalysts are used in electroless metal plating. The catalysts are free of tin. | 08-22-2013 |
20130216713 | STABLE TIN FREE CATALYSTS FOR ELECTROLESS METALLIZATION - Catalysts which include nanoparticles of palladium metal and cellulose derivatives are used in electroless metal plating. The palladium catalysts are free of tin. | 08-22-2013 |
20130211118 | ORGANOMETALLIC COMPOUND PREPARATION - A method of continuously manufacturing organometallic compounds is provided where two or more reactants are conveyed to a reactor having a laminar flow contacting zone, a heat transfer zone, and a mixing zone having a turbulence-promoting device; and causing the reactants to form the organometallic compound. | 08-15-2013 |
20130209934 | PHOTOSENSITIVE COPOLYMER, PHOTORESIST COMPRISING THE COPOLYMER, AND ARTICLES FORMED THEREFROM - A copolymer comprising the polymerized product of an electron-sensitizing acid deprotectable monomer, such as the monomer having the formula (XX), and a comonomer: | 08-15-2013 |
20130209696 | Diblock copolymer blend composition - A diblock copolymer blend containing a unique combination of an ordered poly(styrene)-b-poly(methyl methacrylate) diblock copolymer and a disordered poly(styrene)-b-poly(methyl methacrylate) diblock copolymer is provided. Also provided are substrates treated with the diblock copolymer blend. | 08-15-2013 |
20130209694 | Blended block copolymer composition - A block copolymer composition containing a diblock copolymer blend including a first poly(methyl methacrylate)-b-poly((trimethylsilyl)methyl methacrylate) diblock copolymer; and, a second poly(methyl methacrylate)-b-poly((trimethylsilyl)methyl methacrylate) diblock copolymer. Also provided are substrates treated with the block copolymer composition. | 08-15-2013 |
20130209693 | Block copolymer and methods relating thereto - A copolymer composition including a block copolymer having a poly(methyl methacrylate) block and a poly((trimethylsilyl)methyl methacrylate) block is provided; wherein the block copolymer exhibits a number average molecular weight, M | 08-15-2013 |
20130209344 | Thermal annealing process - A method for processing a substrate is provided; wherein the method comprises applying a film of a copolymer composition, comprising a poly(styrene)-b-poly(dimethylsiloxane) block copolymer component to a surface of the substrate; optionally, baking the film; subjecting the film to a high temperature annealing process under particularized atmospheric conditions for a specified period of time; followed by a treatment of the annealed film to remove the poly(styrene) from the annealed film and to convert the poly(dimethylsiloxane) in the annealed film to SiO | 08-15-2013 |
20130206602 | PLATING BATH AND METHOD - Tin-silver alloy electroplating baths having certain amine-oxide surfactants and methods of electrodepositing a tin-silver-containing layer using these baths are disclosed. Such electroplating baths are useful to provide tin-silver solder deposits having reduced void formation and improved within-die uniformity. | 08-15-2013 |
20130203252 | ACTIVATION PROCESS TO IMPROVE METAL ADHESION - Native oxide removing and activating solutions containing fluoride ions and organic acids are used in the formation of metal layers on semiconductor wafers. The method may also be used in the formation of silicides and for preparing the metal silicides for additional metal plating and build-up. The solutions and methods may be used in the manufacture of photovoltaic devices and other electronic devices and components. | 08-08-2013 |
20130196174 | HIGH TEMPERATURE RESISTANT SILVER COATED SUBSTRATES - A thin film of tin is plated directly on nickel coating a metal substrate followed by plating silver directly on the thin film of tin. The silver has good adhesion to the substrate even at high temperatures. | 08-01-2013 |
20130186766 | FLUX METHOD FOR TIN AND TIN ALLOYS - A flux composition which includes one or more organic compounds including one or more sulfonic acid groups, salts or anhydrides thereof is applied to tin or tin alloy deposits. The flux composition is then homogenized on the tin or tin alloy to inhibit tin or tin alloy oxidation and improve brightness of the tin or tin alloy. | 07-25-2013 |
20130171825 | PHOTORESIST PATTERN TRIMMING METHODS - Provided are methods of trimming photoresist patterns. The methods involve coating a photoresist trimming composition over a photoresist pattern, wherein the trimming composition includes a matrix polymer, a thermal acid generator and a solvent, the trimming composition being free of cross-linking agents. The coated semiconductor substrate is heated to generate an acid in the trimming composition from the thermal acid generator, thereby causing a change in polarity of the matrix polymer in a surface region of the photoresist pattern. The photoresist pattern is contacted with a developing solution to remove the surface region of the photoresist pattern. The methods find particular applicability in the formation of very fine lithographic features in the manufacture of semiconductor devices. | 07-04-2013 |
20130171574 | PHOTORESIST PATTERN TRIMMING METHODS - Provided are methods of trimming photoresist patterns. The methods involve coating a photoresist trimming composition over a photoresist pattern, wherein the trimming composition includes a matrix polymer, a free acid having fluorine substitution and a solvent, the trimming composition being free of cross-linking agents. The coated semiconductor substrate is heated to cause a change in polarity of the resist polymer in a surface region of the photoresist pattern. The photoresist pattern is contacted with a developing solution to remove the surface region of the photoresist pattern. The methods find particular applicability in the formation of very fine lithographic features in the manufacture of semiconductor devices. | 07-04-2013 |
20130171567 | PHOTOACID GENERATOR AND PHOTORESIST COMPRISING SAME - A photoacid generator includes those of formula (I): | 07-04-2013 |
20130171549 | CYCLOALIPHATIC MONOMER, POLYMER COMPRISING THE SAME, AND PHOTORESIST COMPOSITION COMPRISING THE POLYMER - A monomer has the Formula I: | 07-04-2013 |
20130171452 | TRANSPARENT CONDUCTIVE ARTICLES - Articles with graphene are selectively transparent to electromagnetic radiation. The articles transmit electromagnetic radiation in the infrared and visible light bands while inhibiting incident radio frequency radiation. The articles have high electrical conductivity and may be used in windows and domes. | 07-04-2013 |
20130171429 | CYCLOALIPHATIC MONOMER, POLYMER COMPRISING THE SAME, AND PHOTORESIST COMPOSITION COMPRISING THE POLYMER - A monomer has the Formula I: | 07-04-2013 |
20130171366 | PLATING CATALYST AND METHOD - A solution including a precious metal nanoparticle and a polymer polymerized from a monomer comprising at least a monomer having two or more carboxyl groups or carboxylic acid salt groups. The solution is useful for a catalyst for a process of electroless plating of a metal on non-conductive surface. | 07-04-2013 |
20130171363 | PLATING CATALYST AND METHOD - A catalyst solution includes a precious metal nanoparticle and a polymer having a carboxyl group and a nitrogen atom. The catalyst solution is useful for a catalyzing an electroless process for plating metal on non-conductive surfaces. | 07-04-2013 |
20130157195 | CALIXARENE COMPOUND AND PHOTORESIST COMPOSITION COMPRISING SAME - A molecular glass compound includes (A) a tetrameric reaction product of a specific aromatic compound having at least one hydroxy group, and a specific polycyclic or fused polycyclic aromatic aldehyde; and (B) an acid-removable protecting group as an adduct with the hydroxy group of the aromatic compound and/or a hydroxy group of the polycyclic or fused polycyclic aromatic aldehyde. A photoresist composition including the molecular glass compound, and a coated substrate including a layer of the photoresist composition are also disclosed. | 06-20-2013 |
20130137038 | PHOTORESIST COMPOSITION - A photoresist composition comprises an acid-sensitive polymer, and a cyclic sulfonium compound having the formula: | 05-30-2013 |
20130137035 | SURFACE ACTIVE ADDITIVE AND PHOTORESIST COMPOSITION COMPRISING SAME - A polymer comprises the polymerized product of monomers comprising a nitrogen-containing monomer comprising formula (Ia), formula (Ib), or a combination of formulas (Ia) and (Ib), and an acid-deprotectable monomer having the formula (II): | 05-30-2013 |
20130122205 | Gallium Ink and Methods Of Making and Using Same - A method for depositing gallium using a gallium ink, comprising, as initial components: a gallium component comprising gallium; a stabilizing component; an additive; and, a liquid carrier; is provided comprising applying the gallium ink on the substrate; heating the applied gallium ink to eliminate the additive and the liquid carrier, depositing gallium on the substrate; and, optionally, annealing the deposited gallium. | 05-16-2013 |
20130115559 | METHODS OF FORMING PHOTOLITHOGRAPHIC PATTERNS BY NEGATIVE TONE DEVELOPMENT - Provided are methods of forming photolithographic patterns by negative tone development. The methods employ a photoresist composition that includes a polymer having a unit of the following general formula (I): | 05-09-2013 |
20130115553 | TOPCOAT COMPOSITIONS AND PHOTOLITHOGRAPHIC METHODS - Topcoat compositions are provided that can be used in immersion lithography to form photoresist patterns. The topcoat compositions include a polymer system that includes a matrix polymer and a surface active polymer. The matrix polymer is present in the composition in a larger proportion by weight than the surface active polymer, and the surface active polymer has a lower surface energy than a surface energy of the matrix polymer. A solvent system includes a first organic solvent chosen from gamma-butyrolactone and/or gamma-valerolactone, and a second organic solvent. The first organic solvent has a higher surface energy than a surface energy of the surface active polymer, and a higher boiling point than a boiling point of the second organic solvent. | 05-09-2013 |
20130098770 | PLATING BATH AND METHOD - Copper plating baths containing a leveling agent that is a reaction product of one or more of certain pyridine compounds with one or more epoxide-containing compounds, that deposit copper on the surface of a conductive layer are provided. Such plating baths deposit a copper layer that is substantially planar on a substrate surface across a range of electrolyte concentrations. Methods of depositing copper layers using such copper plating baths are also disclosed. | 04-25-2013 |
20130084525 | PHOTOACID GENERATOR AND PHOTORESIST COMPRISING SAME - A photoacid generator compound has the formula (I): | 04-04-2013 |
20130082095 | Flux Composition And Method Of Soldering - A flux composition is provided, comprising, as an initial component: a carboxylic acid; and, a fluxing agent represented by formula I: | 04-04-2013 |
20130082094 | POLYAMINE, CARBOXYLIC ACID FLUX COMPOSITION AND METHOD OF SOLDERING - A flux composition is provided, comprising, as initial components: a carboxylic acid; and, a polyamine fluxing agent represented by formula I: | 04-04-2013 |
20130082093 | Amine, Carboxylic Acid Flux Composition And Method Of Soldering - A flux composition is provided, comprising, as initial components: a carboxylic acid; and, an amine fluxing agent represented by formula I: | 04-04-2013 |
20130082092 | Curable Amine, Carboxylic Acid Flux Composition And Method Of Soldering - A curable flux composition is provided, comprising, as initial components: a resin component having at least two oxirane groups per molecule; a carboxylic acid; and, an amine fluxing agent represented by formula I: | 04-04-2013 |
20130082089 | CURABLE FLUX COMPOSITION AND METHOD OF SOLDERING - A curable flux composition is provided, comprising, as initial components: a resin component having at least two oxirane groups per molecule; a carboxylic acid; a fluxing agent represented by formula I: | 04-04-2013 |
20130078569 | CALIXARENE AND PHOTORESIST COMPOSITION COMPRISING SAME - A molecular glass compound comprises a vinyl ether adduct of an aromatic vinyl ether of formula C(R | 03-28-2013 |
20130078384 | Gallium Formulated Ink and Methods Of Making and Using Same - A method for depositing a Group 1b/gallium/(optional indium)/Group 6a material using a gallium formulated ink, comprising, as initial components: (a) a Group 1b/gallium/(optional indium)/Group 6a system which comprises a combination of, as initial components: a gallium component; a selenium component; an organic chalcogenide component; a Group 1b component comprising, as an initial component, at least one of CuCl | 03-28-2013 |
20130071561 | COMPOSITIONS AND ANTIREFLECTIVE COATINGS FOR PHOTOLITHOGRAPHY - A composition comprising:
| 03-21-2013 |
20130071560 | COMPOSITIONS AND ANTIREFLECTIVE COATINGS FOR PHOTOLITHOGRAPHY - Compositions for use in microelectronic applications: | 03-21-2013 |
20130069246 | METHODS OF FORMING ELECTRONIC DEVICES - Methods of forming electronic devices are provided. The methods involve alkaline treatment of photoresist patterns and allow for the formation of high density resist patterns. The methods find particular applicability in semiconductor device manufacture. | 03-21-2013 |
20130065178 | COMPOSITIONS AND PROCESSES FOR IMMERSION LITHOGRAPHY - New photoresist compositions are provided that are useful for immersion lithography. Preferred photoresist compositions of the invention comprises two or more distinct materials that can be substantially non-mixable with a resin component of the resist. Particularly preferred photoresists of the invention can exhibit reduced leaching of resist materials into an immersion fluid contacting the resist layer during immersion lithography processing. | 03-14-2013 |
20130048505 | PLATING BATH AND METHOD - Copper plating baths containing a leveling agent that is a reaction product of one or more of certain cyclodiaza-compounds with one or more epoxide-containing compounds that deposit copper on the surface of a conductive layer are provided. Such plating baths deposit a copper layer that is substantially planar on a substrate surface across a range of electrolyte concentrations. Methods of depositing copper layers using such copper plating baths are also disclosed. | 02-28-2013 |
20130045552 | Light emitting diode manufacturing method - A method of making a light emitting diode (LED) having an optical element is provided, comprising: providing a curable liquid polysiloxane/TiO | 02-21-2013 |
20130045292 | Curable liquid composite light emitting diode encapsulant - A curable liquid polysiloxane/TiO | 02-21-2013 |
20130040419 | Selenium/group 1B ink and methods of making and using same - A method for preparing a Group 1a-1b-3a-6a material using a selenium/Group 1b ink comprising, as initial components: a selenium component comprising selenium, an organic chalcogenide component having a formula selected from RZ—Z′R′ and R | 02-14-2013 |
20130034933 | Dichalcogenide selenium ink and methods of making and using same - A method for preparing a Group 1a-1b-3a-6a material using a selenium ink comprising a chemical compound having a formula RZ—Se | 02-07-2013 |
20130017487 | COMPOSITIONS AND PROCESSES FOR PHOTOLITHOGRAPHY - Topcoat layer compositions are provided that are applied above a photoresist composition. The compositions find particular applicability to immersion lithography processing. | 01-17-2013 |
20130011783 | MONOMERS, POLYMERS, PHOTORESIST COMPOSITIONS AND METHODS OF FORMING PHOTOLITHOGRAPHIC PATTERNS - Provided are (meth)acrylate monomers containing acetal moieties, polymers containing a unit formed from such a monomer and photoresist compositions containing such a polymer. The monomers, polymers and photoresist compositions are useful in forming photolithographic patterns. Also provided are substrates coated with the photoresist compositions, methods of forming photolithographic patterns and electronic devices. The compositions, methods and coated substrates find particular applicability in the manufacture of semiconductor devices. | 01-10-2013 |
20130004901 | COATING COMPOSITIONS FOR USE WITH AN OVERCOATED PHOTORESIST - Organic coating compositions, particularly antireflective coating compositions, are provided that comprise that comprise a component that comprises one or more uracil moieties. Preferred compositions of the invention are useful to reduce reflection of exposing radiation from a substrate back into an overcoated photoresist layer and/or function as a planarizing, conformal or via-fill layer. | 01-03-2013 |
20130004893 | COATING COMPOSITIONS FOR USE WITH AN OVERCOATED PHOTORESIST - Organic coating compositions, particularly antireflective coating compositions, are provided that comprise that comprise a component that comprises one or more parabanic acid moieties. Preferred compositions of the invention are useful to reduce reflection of exposing radiation from a substrate back into an overcoated photoresist layer and/or function as a planarizing, conformal or via-fill layer. | 01-03-2013 |
20130001088 | LEVELER COMPOUNDS - Leveling agents for metal plating baths are provided. Plating baths containing such leveling agents provide metal deposits having substantially level surfaces. Such leveling agents may be selected to selectively incorporate desired levels of impurities into the metal deposit. | 01-03-2013 |
20120318676 | METHOD OF ELECTROPLATING UNIFORM COPPER LAYERS - Electroplating methods provide substantially uniform deposits of copper on the edges and walls of through-holes of printed circuit boards. The electroplating methods provide copper deposits which have high throwing power. | 12-20-2012 |
20120308927 | POLYMERS, PHOTORESIST COMPOSITIONS AND METHODS OF FORMING PHOTOLITHOGRAHIC PATTERNS - Provided are polymers and photoresist compositions useful in forming photolithographic patterns. Also provided are substrates coated with the photoresist compositions and methods of forming photolithographic patterns. The compositions, methods and coated substrates find particular applicability in the manufacture of semiconductor devices. | 12-06-2012 |
20120301823 | POLYMER COMPOSITION AND PHOTORESIST COMPRISING THE POLYMER - A copolymer comprises the polymerized product of a base-soluble monomer of formula (I): | 11-29-2012 |
20120298586 | ALPHA-PARTICLE EMITTER REMOVAL - Methods of purifying acidic metal solutions by removing at least a portion of alpha-particle emitting materials are provided. The purified metal solutions are useful in a variety of applications requiring low levels of alpha-particle emission. | 11-29-2012 |
20120298207 | Vapor Delivery Device, Methods of Manufacture And Methods of Use Thereof - A method comprises transporting a first stream of a carrier gas to a delivery device that contains a solid precursor compound. The first stream of carrier gas is at a temperature greater than or equal to 20° C. The method further comprises transporting a second stream of the carrier gas to a point downstream of the delivery device. The first stream and the second stream are combined to form a third stream, such that the dewpoint of the vapor of the solid precursor compound in the third stream is lower than the ambient temperature. The flow direction of the first stream, the flow direction of the second stream and the flow direction of the third stream are unidirectional and are not opposed to each other. | 11-29-2012 |
20120298040 | Vapor Delivery Device, Methods of Manufacture And Methods of Use Thereof - A method comprises transporting a first stream of a carrier gas to a delivery device that contains a solid precursor compound. The first stream of carrier gas is at a temperature greater than or equal to 20° C. The method further comprises transporting a second stream of the carrier gas to a point downstream of the delivery device. The first stream and the second stream are combined to form a third stream, such that the dewpoint of the vapor of the solid precursor compound in the third stream is lower than the ambient temperature. The flow direction of the first stream, the flow direction of the second stream and the flow direction of the third stream are unidirectional and are not opposed to each other. | 11-29-2012 |
20120288794 | POLYMERS, PHOTORESIST COMPOSITIONS AND METHODS OF FORMING PHOTOLITHOGRAPHIC PATTERNS - Provided are polymers containing a unit having a particular acetal moiety and photoresist compositions containing such a polymer. Also provided are substrates coated with the photoresist compositions and methods of forming photolithographic patterns. The polymers, photoresist compositions, methods and coated substrates find particular applicability in the manufacture of semiconductor devices. | 11-15-2012 |
20120285835 | ADHESION PROMOTION OF METAL TO A DIELECTRIC - An adhesion solution containing curable amine compounds and curable epoxy compounds are applied to a dielectric material followed by drying the solution and electrolessly plating a thin metal layer on the dielectric material. The composite is then annealed to cure the amine and epoxy compounds. The adhesion solution contains an excess amount of curable amine to curable epoxy. The adhesion solution and method may be used in the manufacture of printed circuit boards. | 11-15-2012 |
20120267627 | POLYCRYSTALLINE TEXTURING COMPOSITION AND METHOD - An aqueous acidic composition which includes alkaline compounds, fluoride ions and oxidizing agents is provided for texturing polycrystalline semiconductors. Methods for texturing are also disclosed. The textured polycrystalline semiconductors have reduced reflectance of light incidence. | 10-25-2012 |
20120264053 | COMPOSITIONS AND PROCESSES FOR PHOTOLITHOGRAPHY - Topcoat layer compositions are provided that are applied above a photoresist composition. The compositions find particular applicability to immersion lithography processing. | 10-18-2012 |
20120225384 | COMPOSITIONS AND PROCESSES FOR PHOTOLITHOGRAPHY - Topcoat layer compositions are provided that are applied above a photoresist composition. The compositions find particular applicability to immersion lithography processing. | 09-06-2012 |
20120219902 | PHOTORESIST COMPOSITIONS AND METHODS OF FORMING PHOTOLITHOGRAPHIC PATTERNS - Provided are photoresist compositions useful in forming photolithographic patterns. Also provided are substrates coated with the photoresist compositions and methods of forming photolithographic patterns. The compositions, methods and coated substrates find particular applicability in the manufacture of semiconductor devices. | 08-30-2012 |
20120219901 | PHOTORESIST COMPOSITIONS AND METHODS OF FORMING PHOTOLITHOGRAPHIC PATTERNS - Provided are photoresist compositions useful in forming photolithographic patterns. Also provided are substrates coated with the photoresist compositions and methods of forming photolithographic patterns. The compositions, methods and coated substrates find particular applicability in the manufacture of semiconductor devices. | 08-30-2012 |
20120219755 | DEVELOPER COMPOSITIONS AND METHODS OF FORMING PHOTOLITHOGRAPHIC PATTERNS - Provided are photoresist developer compositions that include a mixture of organic solvents. Also provided are methods of forming photolithographic patterns using negative tone development, coated substrates and electronic devices formed by the methods. The methods find particular applicability in the manufacture of electronic devices. | 08-30-2012 |
20120199957 | PHOTORESISTS AND METHODS FOR USE THEREOF - New photoresists are provided that comprise a multi-keto component and that are particularly useful for ion implant lithography applications. Preferred photoresists of the invention can exhibit good adhesion to underlying inorganic surfaces such as SiON, silicon oxide, silicon nitride, hafnium silicate, zirconium silicate and other inorganic surfaces. | 08-09-2012 |
20120184098 | ELECTROCHEMICAL ETCHING OF SEMICONDUCTORS - Semiconductors are electrochemically etched in solutions containing sources of bifluoride and nickel ions. The electrochemical etching may form pores in the surface of the semiconductor in the nanometer range. The etched semiconductor is then nickel plated. | 07-19-2012 |
20120177821 | COMPOSITION OF NANOPARTICLES - Catalytic nanoparticles are coated with a layer of an amphoteric surfactant to stabilize the nanoparticles for electroless metal plating. | 07-12-2012 |
20120171626 | COMPOSITIONS COMPRISING BASE-REACTIVE COMPONENT AND PROCESSES FOR PHOTOLITHOGRAPHY - New photoresist compositions are provided that comprise one or more materials that have base-reactive groups and are particularly useful for dry lithography. Particularly preferred photoresists of the invention can exhibit reduced defects following development of a coating layer of the resist. | 07-05-2012 |
20120164342 | METHOD FOR REMOVING IMPURITIES FROM PLATING SOLUTION - A method of regenerating an electroless tin or tin alloy plating solution containing thiourea or thiourea compounds by reducing impurities by adding organosulfonic acid, organosulfonic acid compound, or salts thereof in certain amounts and then cooling the solution to form precipitates. The precipitates are then removed from the tin or tin alloy solution. | 06-28-2012 |
20120164341 | METHOD FOR REMOVING IMPURITIES FROM PLATING SOLUTIONS - Impurities are removed from electroless tin and tin alloy plating solutions by generating precipitates through the addition of sufficient amounts of benzenesulfonic acid, benzenesulfonic acid hydrate or salts thereof to the electroless tin and tin alloy plating solutions. The precipitates may then be removed from the electroless plating solutions using conventional apparatus. | 06-28-2012 |
20120156595 | COMPOSITIONS COMPRISING SUGAR COMPONENT AND PROCESSES FOR PHOTOLITHOGRAPHY - New photoresist compositions are provided that are useful for immersion lithography. Preferred photoresist compositions of the invention comprise one or more materials that have sugar substitution. Particularly preferred photoresists of the invention can exhibit reduced leaching of resist materials into an immersion fluid contacting the resist layer during immersion lithography processing. | 06-21-2012 |
20120145555 | PLATING CATALYST AND METHOD - Stable zero-valent metal compositions and methods of making and using these compositions are provided. Such compositions are useful as catalysts for subsequent metallization of non-conductive substrates, and are particularly useful in the manufacture of electronic devices. | 06-14-2012 |
20120145554 | PLATING CATALYST AND METHOD - Stable zero-valent metal compositions and methods of making and using these compositions are provided. Such compositions are useful as catalysts for subsequent metallization of non-conductive substrates, and are particularly useful in the manufacture of electronic devices. | 06-14-2012 |
20120132533 | GOLD PLATING SOLUTION - A gold plating bath and a plating method is disclosed where gold cyanide or salts thereof provide the source of gold, a cobalt compound, and a reaction product of compound containing at least a nitrogen-containing heterocyclic compound and an epihalohydrin. The gold plating bath has high deposition selectivity. | 05-31-2012 |
20120132530 | TIN PLATING SOLUTION - To provide a tin plating solution having uniformity of through-hole plating, uniformity of film thickness distribution and no burn deposits even. The tin plating solution include a tin ion source, at least one non-ionic surfactant, imidazoline dicarboxylate and 1,10-phenanthroline. | 05-31-2012 |
20120129332 | METHOD FOR FORMING METAL CONTACTS - Methods of forming metal contacts with metal inks in the manufacture of photovoltaic devices are disclosed. The metal inks are selectively deposited on semiconductor coatings by inkjet and aerosol apparatus. The composite is heated to selective temperatures where the metal inks burn through the coating to form an electrical contact with the semiconductor. Metal layers are then deposited on the electrical contacts by light induced or light assisted plating. | 05-24-2012 |
20120129108 | BASE REACTIVE PHOTOACID GENERATORS AND PHOTORESISTS COMPRISING SAME - This invention relates to new photoacid generator compounds and photoresist compositions that comprise such compounds. In particular, the invention relates to photoacid generator compounds that comprise base-cleavable groups. | 05-24-2012 |
20120129105 | PHOTOSENSITIVE COPOLYMER AND PHOTORESIST COMPOSITION - A copolymer has formula: | 05-24-2012 |
20120129104 | LACTONE PHOTOACID GENERATORS AND RESINS AND PHOTORESISTS COMPRISING SAME - New lactone-containing photoacid generator compounds (“PAGs”) and photoresist compositions that comprise such PAG compounds are provided. These photoresist compositions are useful in the manufacture of electronic devices | 05-24-2012 |
20120122030 | COMPOSITIONS COMPRISING BASE-REACTIVE COMPONENT AND PROCESSES FOR PHOTOLITHOGRAPHY - New photoresist compositions are provided that are useful for immersion lithography. Preferred photoresist compositions of the invention comprise one or more materials that comprise one or more base reactive groups and (i) one or more polar groups distinct from the base reactive groups, and/or (ii) at least one of the base reactive groups is a non-perfluorinated base reactive group. Particularly preferred photoresists of the invention can exhibit reduced leaching of resist materials into an immersion fluid contacting the resist layer during immersion lithography processing. | 05-17-2012 |
20120097548 | STABLE NANOPARTICLES FOR ELECTROLESS PLATING - Stable tin-free palladium catalysts are used to metalize through-holes of printed circuit boards. A stabilizer is included in the catalyst formulation which prevents precipitation and agglomeration of the palladium. | 04-26-2012 |
20120088192 | UNDERLAYER COMPOSITION AND METHOD OF IMAGING UNDERLAYER - A method of forming a pattern comprises diffusing an acid, generated by irradiating a portion of a photosensitive layer, into an underlayer comprising an acid sensitive copolymer comprising an acid decomposable group and an attachment group, to form an interpolymer crosslink and/or covalently bonded to the surface of the substrate. Diffusing comprises heating the underlayer and photosensitive layer. The acid sensitive group reacts with the diffused acid to form a polar region at the surface, in the shape of the pattern. The photosensitive layer is removed to forming a self-assembling layer comprising a block copolymer having a block with an affinity for the polar region, and a block having less affinity than the first. The first block forms a domain aligned to the polar region, and the second block forms a domain aligned to the first. Removing either the first or second domain exposes a portion of the underlayer. | 04-12-2012 |
20120088188 | UNDERLAYER COMPOSITION AND METHOD OF IMAGING UNDERLAYER COMPOSITION - A method of forming a pattern comprises diffusing an acid formed by irradiating a portion of a photosensitive layer, into an underlayer comprising an acid sensitive copolymer having acid decomposable groups and attachment groups covalently bonded to the surface of the substrate and/or forming an interpolymer crosslink. Diffusing comprises heating the underlayer and photosensitive layer. The acid sensitive group reacts with the diffused acid to form a polar region on the underlayer, with the shape of the pattern. The photosensitive layer is removed, forming a self-assembling layer comprising a block copolymer having a first block with an affinity for the polar region, and a second block having less affinity for the polar region. The first block forms a domain aligned to the polar region, and the second block forms another domain aligned to the first. Removing either domain exposes a portion of the underlayer. | 04-12-2012 |
20120077120 | PHOTORESISTS COMPRISING MULTI-AMIDE COMPONENT - New photoresist compositions are provided that comprise a component that comprises two or more amide groups. Preferred photoresists of the invention may comprise a resin with photoacid-labile groups; a photoacid generator compound; and a multi-amide component that can function to decrease undesired photogenrated-acid diffusion out of unexposed regions of a photoresist coating layer | 03-29-2012 |
20120067735 | CYANIDE-FREE SILVER ELECTROPLATING SOLUTIONS - A cyanide-free silver electroplating solution may be used to electroplate mirror bright silver layers at high current density ranges and at high temperatures such as in reel-to-reel electroplating. The cyanide-free silver electroplating solution is environmentally friendly. | 03-22-2012 |
20120067733 | METHOD OF ELECTROPLATING SILVER STRIKE OVER NICKEL - A silver electroplating solution is used to electroplate a mirror bright silver layer on a nickel or nickel alloy substrate. The silver electroplating solution is cyanide-free and environmentally friendly. | 03-22-2012 |
20120064456 | PHOTORESIST COMPOSITIONS AND METHODS OF FORMING PHOTOLITHOGRAPHIC PATTERNS - Provided are photoresist compositions useful in forming photolithographic patterns by a negative tone development process. Also provided are methods of forming photolithographic patterns by a negative tone development process and substrates coated with the photoresist compositions. The compositions, methods and coated substrates find particular applicability in the manufacture of semiconductor devices. | 03-15-2012 |
20120055802 | ACIDIC GOLD ALLOY PLATING SOLUTION - A gold alloy plating solution and plating method thereof that provides a gold plating solution with high deposition selectivity by using a gold plating solution that contains gold cyanide, cobalt ions, hexamethylene tetramine, and specific glossing agents. | 03-08-2012 |
20120034378 | Delivery device and method of use thereof - A delivery device comprises an inlet port and an outlet port. The delivery device comprises an inlet chamber and an outlet chamber, with the outlet chamber being opposedly disposed to the inlet chamber and in fluid communication with the inlet chamber via a conical section. The outlet chamber comprises a labyrinth that is operative to prevent solid particles of a solid precursor compound contained in the delivery device from leaving the delivery device while at the same time permitting vapors of the solid precursor compound to leave the delivery device via the outlet port. | 02-09-2012 |
20120034371 | METAL PLATING COMPOSITIONS - Disclosed are metal plating compositions for plating a metal on a substrate. The metal plating compositions include compounds which influence the leveling and throwing performance of the metal plating compositions. Also disclosed are methods of depositing metals on a substrate. | 02-09-2012 |
20110318479 | METAL PLATING COMPOSITIONS AND METHODS - Disclosed are metal plating compositions and methods. The metal plating compositions provide good leveling performance and throwing power. | 12-29-2011 |
20110308960 | Tin electroplating solution and a method for tin electroplating - A tin plating solution and tin plating method for chip components minimizes tin shavings when plated components are rubbed together such as during bulk mounting. This minimizes sticking of the chip components together. | 12-22-2011 |
20110294069 | PHOTORESIST COMPOSITIONS AND METHODS OF FORMING PHOTOLITHOGRAPHIC PATTERNS - Provided are photoresist compositions useful in forming photolithographic patterns by a negative tone development process. Also provided are methods of forming photolithographic patterns by a negative tone development process and substrates coated with the photoresist compositions. The compositions, methods and coated substrates find particular applicability in the manufacture of semiconductor devices. | 12-01-2011 |
20110290660 | PLATING BATH AND METHOD - Copper plating baths containing a leveling agent that is a reaction product of a certain imidazole with a certain epoxide-containing compound that deposit copper on the surface of a conductive layer are provided. Such plating baths deposit a copper layer that is substantially planar on a substrate surface across a range of electrolyte concentrations. Methods of depositing copper layers using such copper plating baths are also disclosed. | 12-01-2011 |
20110290653 | GOLD ALLOY ELECTROLYTES - Compositions and methods for depositing gold alloys are disclosed. The compositions include certain dithiocarboxylic acids, salts and esters thereof and mercapto group containing compounds which provide bright gold alloy deposits with uniform color. | 12-01-2011 |
20110287634 | METHOD OF FORMING CURRENT TRACKS ON SEMICONDUCTORS - Methods of making current tracks for semiconductors are disclosed. The methods involve selectively depositing a hot melt ink resist containing rosin resins and waxes on a silicon dioxide or silicon nitride layer coating a semiconductor followed by etching uncoated portions of the silicon dioxide or silicon nitride layer with an inorganic acid etch to expose the semiconductor and simultaneously inhibit undercutting of the hot melt ink resist. The etched portions may then be metallizaed to form a plurality of substantially uniform current tracks. | 11-24-2011 |
20110287614 | Group 6a/Group 3a ink and methods of making and using same - A selenium/Group 3a ink, comprising (a) a selenium/Group 3a complex which comprises a combination of, as initial components: a selenium component comprising selenium; an organic chalcogenide component having a formula selected from RZ—Z′R′ and R | 11-24-2011 |
20110287610 | Selenium/Group 3A ink and methods of making and using same - A selenium/Group 3a ink, comprising (a) a selenium/Group 3a complex which comprises a combination of, as initial components: a selenium component comprising selenium; a carboxylic acid component having a formula R—COOH, wherein R is selected from a C | 11-24-2011 |
20110287361 | PHOTOACID GENERATORS AND PHOTORESISTS COMPRISING SAME - New photoacid generator compounds are provided that comprise a nitrogen-base functional component of the structure —C(═O)N<. Photoresist compositions also are provided that comprise one or more PAGs of the invention. | 11-24-2011 |
20110287184 | PRECURSOR COMPOSITIONS AND METHODS - Compositions including an amido-group-containing vapor deposition precursor and a stabilizing additive are provided. Such compositions have improved thermal stability and increased volatility as compared to the amido-group-containing vapor deposition precursor itself. These compositions are useful in the deposition of thin films, such as by atomic layer deposition. | 11-24-2011 |
20110274874 | CHEMICAL VAPOR DEPOSITED SILICON CARBIDE ARTICLES - Chemical vapor deposited silicon carbide articles and the methods of making them are disclosed. The chemical vapor deposited silicon carbide articles are composed of multiple parts which are joined together by sintered ceramic joints. The joints strengthen and maintain tolerances at the joints of the articles. The articles may be used in semi-conductor processing. | 11-10-2011 |
20110269074 | NOVEL POLYMERS AND PHOTORESIST COMPOSITIONS - New polymers are provided comprising (i) one or more covalently linked photoacid generator moieties and (ii) one or more photoacid-labile groups, wherein the one or more photoacid generator moieties are a component of one or more of the photoacid-labile groups. Preferred polymers of the invention are suitable for use in photoresists imaged at short wavelengths such as sub-200 nm, particularly 193 nm. | 11-03-2011 |
20110269070 | PHOTOACID GENERATORS AND PHOTORESISTS COMPRISING SAME - New methods are provided for synthesis of photoacid generator compounds (“PAGs”), new photoacid generator compounds and photoresist compositions that comprise such PAG compounds. In a particular aspect, photoacid generators that comprise 1) a SO | 11-03-2011 |
20110262861 | PHOTOSENSITIVE COMPOSITION - Photoresist compositions and methods suitable for depositing a thick photoresist layer in a single coating application are provided. Such photoresist layers are particularly suitable for use in chip scale packaging, for example, in the formation of metal bumps. | 10-27-2011 |
20110259754 | TIN OR TIN ALLOY ELECTROPLATING SOLUTION - An additive obtained from the reaction product obtained by reacting glutaraldehyde and at least one type of compound selected from hydrocarbon compounds containing a hydroxyl group, and at least one type of compound selected from amine compounds, as well as a tin or tin alloy plating solution containing this additive. | 10-27-2011 |
20110256481 | PHOTORESISTS AND METHODS OF USE THEREOF - New photoresist are provided that comprises a low-Tg component and that are particularly useful for ion implant lithography applications. Preferred photoresists of the invention can exhibit good adhesion to underlying inorganic surfaces such as SiON, silicon oxide, silicon nitride and other inorganic surfaces. | 10-20-2011 |
20110255069 | COMPOSITIONS AND PROCESSES FOR IMMERSION LITHOGRAPHY - New photoresist compositions are provided that are useful for immersion lithography. Preferred photoresist compositions of the invention comprise one or more materials that can be substantially non-mixable with a resin component of the resist. Further preferred photoresist compositions of the invention comprise 1) Si substitution, 2) fluorine substitution; 3) hyperbranched polymers; and/or 4) polymeric particles. Particularly preferred photoresists of the invention can exhibit reduced leaching of resist materials into an immersion fluid contacting the resist layer during immersion lithography processing. | 10-20-2011 |
20110255061 | COMPOSITIONS COMPRISING BASE-REACTIVE COMPONENT AND PROCESSES FOR PHOTOLITHOGRAPHY - New photoresist compositions are provided that are useful for immersion lithography. Preferred photoresist compositions of the invention comprise one or more materials that have base-reactive groups. Particularly preferred photoresists of the invention can exhibit reduced leaching of resist materials into an immersion fluid contacting the resist layer during immersion lithography processing. | 10-20-2011 |
20110254140 | PHOTORESISTS AND METHODS FOR USE THEREOF - New photoresists are provided that comprise preferably as distinct components: a resin, a photoactive component and a phenolic component Preferred photoresists of the invention are can be useful for ion implant lithography protocols. | 10-20-2011 |
20110254133 | PHOTORESISTS AND METHODS FOR USE THEREOF - New photoresist are provided that comprises an Si-containing component and that are particularly useful for ion implant lithography applications. Photoresists of the invention can exhibit good adhesion to underlying inorganic surfaces such as SiON, silicon oxide, silicon nitride and other inorganic surfaces. | 10-20-2011 |
20110250762 | METHOD OF CLEANING AND MICRO-ETCHING SEMICONDUCTOR WAFERS - A method of simultaneously cleaning inorganic and organic contaminants from semiconductor wafers and micro-etching the semiconductor wafers. After the semiconductor wafers are cut or sliced from ingots, they are contaminated with cutting fluid as well as metal and metal oxides from the saws used in the cutting process. Aqueous alkaline cleaning and micro-etching solutions containing alkaline compounds and mid-range alkoxylates are used to simultaneously clean and micro-etch the semiconductor wafers. | 10-13-2011 |
20110250542 | SULFONYL PHOTOACID GENERATORS AND PHOTORESISTS COMPRISING SAME - New bis(sulfonyl)imide and tri(sulfonyl)methide photoacid generator compounds (“PAGs”) are provided as well as photoresist compositions that comprise such PAG compounds. | 10-13-2011 |
20110250538 | PHOTOACID GENERATORS AND PHOTORESISTS COMPRISING SAME - New methods are provided for synthesis of photoacid generator compounds (“PAGs”), new photoacid generator compounds and photoresist compositions that comprise such PAG compounds. In a particular aspect, sulfonium-containing (S+) photoacid generators and methods of synthesis of sulfonium photoacid generators are provided. | 10-13-2011 |
20110250537 | CHOLATE PHOTOACID GENERATORS AND PHOTORESISTS COMPRISING SAME - New photoacid generator compounds (“PAGs”) are provided that comprise a cholate moiety and photoresist compositions that comprise such PAG compounds. | 10-13-2011 |
20110236823 | NOVEL POLYMERS AND PHOTORESIST COMPOSITIONS - The invention relates to new polymers that comprise units that contain one or more photoacid generator groups and photoresists that contain the polymers. Preferred polymers of the invention are suitable for use in photoresists imaged at short wavelengths such as sub-250 nm or sub-200 nm, particularly 248 nm and 193 nm. | 09-29-2011 |
20110232758 | Thin film photovoltaic cell - A thin film photovoltaic cell is provided having a substrate; a back contact provided on the substrate; a p-type semiconductor absorber layer provided on the back contact; a n-type semiconductor layer provided on the p-type semiconductor absorber layer; a dielectric organic material layer provided on the n-type semiconductor layer; a transparent conductive film provided on the dielectric organic material layer; and, optionally, an antireflective layer provided on the transparent conductive film. Also provided is a method of manufacturing a thin film photovoltaic cell. | 09-29-2011 |
20110223535 | PHOTORESIST COMPRISING NITROGEN-CONTAINING COMPOUND - New nitrogen-containing compounds are provided that comprise multiple hydroxyl moieties and photoresist compositions that comprise such nitrogen-containing compounds. Preferred nitrogen-containing compounds comprise 1) multiple hydroxyl substituents (i.e. 2 or more) and 2) one or more photoacid-labile groups. | 09-15-2011 |
20110220514 | Plating bath and method - Copper plating baths containing a leveling agent that is a reaction product of a certain imidazole with a certain epoxide-containing compound that deposit copper on the surface of a conductive layer are provided. Such plating baths deposit a copper layer that is substantially planar on a substrate surface across a range of electrolyte concentrations. Methods of depositing copper layers using such copper plating baths are also disclosed. | 09-15-2011 |
20110220513 | Plating bath and method - Copper plating baths containing a leveling agent that is a reaction product of a certain benzimidazole with a certain epoxide-containing compound that deposit copper on the surface of a conductive layer are provided. Such plating baths deposit a copper layer that is substantially planar on a substrate surface across a range of electrolyte concentrations. Methods of depositing copper layers using such copper plating baths are also disclosed. | 09-15-2011 |
20110220512 | Plating bath and method - Copper plating baths containing a leveling agent that is a reaction product of a certain imidazole with a certain epoxide-containing compound that deposit copper on the surface of a conductive layer are provided. Such plating baths deposit a copper layer that is substantially planar on a substrate surface across a range of electrolyte concentrations. Methods of depositing copper layers using such copper plating baths are also disclosed. | 09-15-2011 |
20110171383 | METHOD FOR CONSTANT CONCENTRATION EVAPORATION AND A DEVICE USING THE SAME - Disclosed herein is a device comprising an evaporator; and a heat exchanger; the heat exchanger being in fluid communication with evaporator; evaporator comprising an outer casing; and an inner casing that is disposed within the outer casing; the inner casing contacting a plate; wherein the inner casing encloses a first conduit that is operative to introduce a carrier fluid into evaporator; and a second conduit that is operative to remove carrier fluid entrained with a precursor; wherein the outer casing is detachably attached to the plate; the plate contacting a first precursor conduit that is operative to introduce the precursor into evaporator from the heat exchanger; where the heat exchanger is disposed proximate to evaporator at a distance effective to maintain the precursor in evaporator at a substantially constant temperature when the ambient temperature around the heat exchanger and evaporator fluctuates by an amount of up to about ±35° C. | 07-14-2011 |
20110159429 | PHOTOSENSITIVE COMPOSITIONS - Provided are radiation-sensitive polymers and compositions which may be used in photolithographic processes. The polymers and compositions provide enhanced sensitivity to activating radiation. | 06-30-2011 |
20110159253 | METHODS OF FORMING PHOTOLITHOGRAPHIC PATTERNS - Provided are methods of forming photolithographic patterns using a negative tone development process. Also provided are coated substrates and electronic devices formed by the methods. The methods find particular applicability in the manufacture of electronic devices. | 06-30-2011 |
20110151671 | METHOD OF TEXTURING SEMICONDUCTOR SUBSTRATES - Semiconductor substrates are cleaned and subsequently oxidized. After the semiconductor is oxidized it is textured to reduce incident light reflectance. The textured semiconductors can be used in the manufacture of photovoltaic devices. | 06-23-2011 |
20110147225 | HIGH SPEED METHOD FOR PLATING PALLADIUM AND PALLADIUM ALLOYS - A high speed method of depositing palladium and palladium alloys is disclosed. The high speed method uses an aqueous, ammonia-based bath which has reduced free ammonia in the bath. The high speed method may be used to deposit palladium and palladium alloy coatings on various substrates such as electrical devices and jewelry. | 06-23-2011 |
20110147220 | ANTI-DISPLACEMENT HARD GOLD COMPOSITIONS - Anti-displacement hard gold compositions are disclosed for inhibiting displacement of metal from substrates which are plated with the hard gold. The anti-displacement hard gold compositions may be used to spot plate substrates with hard gold. | 06-23-2011 |
20110143281 | COATING COMPOSITIONS FOR PHOTORESISTS - In one aspect, the present invention relates to coating compositions that comprise a resin component, wherein the predominant portion of the resin component comprising one or more resins that are at least substantially free of fluorine. Coating compositions of the invention are useful as photoresist overcoat layers, including in immersion lithography processing. | 06-16-2011 |
20110123937 | COMPOSITIONS AND PROCESSES FOR IMMERSION LITHOGRAPHY - The present invention relates to barrier layer compositions that are applied above a photoresist composition for immersion lithography processing. In a further aspect, new methods are provided for immersion lithography processing. | 05-26-2011 |
20110117490 | METHODS OF FORMING ELECTRONIC DEVICES - Methods of forming electronic devices are provided. The methods involve alkaline treatment of photoresist patterns and allow for the formation of high density resist patterns. The methods find particular applicability in semiconductor device manufacture. | 05-19-2011 |
20110103022 | Indium compositions - Indium compositions including hydrogen suppressor compounds and methods of electrochemically depositing indium metal from the compositions onto substrates are disclosed. Articles made with the indium compositions are also disclosed. | 05-05-2011 |
20110081742 | TEXTURING SEMICONDUCTOR SUBSTRATES - Semiconductors are textured with aqueous solutions containing non-volatile alkoxylated glycols, their ethers and ether acetate derivatives having molecular weights of 170 or greater and flash points of 75° C. or greater. The textured semiconductors can be used in the manufacture of photovoltaic devices. | 04-07-2011 |
20110076799 | Selenium/Group 1b ink and methods of making and using same - A selenium/Group 1b ink comprising, as initial components: a selenium component comprising selenium, an organic chalcogenide component having a formula selected from RZ—Z′R′ and R | 03-31-2011 |
20110076798 | Dichalcogenide ink containing selenium and methods of making and using same - A selenium ink comprising, as initial components: a liquid carrier; a selenium component comprising selenium; and, an organic chalcogenide component having a formula selected from RZ—Z′R′ and R | 03-31-2011 |
20110065274 | ENHANCED METHOD OF FORMING NICKEL SILICIDES - Silicon containing substrates are coated with nickel. The nickel is coated with a protective layer and the combination is heated to a sufficient temperature to form nickel silicide. The nickel silicide formation may be performed in oxygen containing environments. | 03-17-2011 |
20110064879 | ORGANOMETALLIC COMPOUNDS - Methods of vapor depositing metal-containing films using certain organometallic compounds containing a carbonyl-containing ligand are disclosed. | 03-17-2011 |
20110064870 | PREPARING SUBSTRATES CONTAINING POLYMERS FOR METALLIZATION - Methods of swelling and topographically altering polymers of substrates using low foaming compositions are disclosed. Solvent swells which are stable, homogeneous and low foaming are applied to substrates containing polymers to swell and soften the polymers followed by applying an oxidizer to topographically alter and desmear the polymers in preparation for metallization of the substrate. | 03-17-2011 |
20110039210 | NOVEL RESINS AND PHOTORESIST COMPOSITIONS COMPRISING SAME - Provided are new resins that comprise lactone units and photoresist compositions that comprise such resins. | 02-17-2011 |
20110039206 | NOVEL RESINS AND PHOTORESIST COMPOSITIONS COMPRISING SAME - Provided are new resins that comprise multi-ring, aromatic and/or multi-cyclic ester unit which preferably are photoacid-labile. Also provided are chemically-amplified positive photoresist that comprise such resins as well as multi-ring, aromatic and/or multi-cyclic ester monomers. | 02-17-2011 |
20110033801 | COATING COMPOSITIONS FOR USE WITH AN OVERCOATED PHOTORESIST - Coating compositions for use with an overcoated photoresist are provided where the coating composition comprises a resin containing cyanurate groups and hydrophobic groups. The coating composition can enhance resolution of an overcoated photoresist relief image. | 02-10-2011 |
20110033800 | COATING COMPOSITIONS FOR USE WITH AN OVERCOATED PHOTORESIST - Cyanurate compositions are provided that are particularly useful as a reagent to form a resin component of a coating composition underlying an overcoated photoresist. Preferred isocyanurates compound comprise substitution of multiple cyanurate nitrogen ring atoms by at least two distinct carboxy and/or carboxy ester groups. | 02-10-2011 |
20110020981 | Dichalcogenide Selenium Ink and Methods of Making and Using Same - A selenium ink comprising a chemical compound having a formula RZ-Se | 01-27-2011 |
20110008729 | COMPOSITIONS AND METHODS FOR FORMING ELECTRONIC DEVICES - Compositions are provided which can be used for treating photoresist patterns in the manufacture of electronic devices. The compositions allow for the formation of fine lithographic patterns and find particular applicability in semiconductor device manufacture. | 01-13-2011 |
20110003463 | DOPING METHOD - Methods of doping a III-V compound semiconductor film are disclosed. | 01-06-2011 |
20110003257 | PROCESSES FOR PHOTOLITHOGRAPHY - New lithographic processing methods are provided which are particularly useful in immersion lithography schemes. In one aspect, processes of the invention comprise: applying on a substrate a photoresist composition; exposing the photoresist layer to radiation activating for the photoresist composition; removing a portion but not all of the exposed photoresist layer; and developing the treated photoresist layer to provide a photoresist relief image. | 01-06-2011 |
20110003250 | COATING COMPOSITIONS SUITABLE FOR USE WITH AN OVERCOATED PHOTORESIST - In one aspect, organic coating compositions, particularly antireflective coating compositions, are provided that comprise that comprise a diene/dienophile reaction product. In another aspect, organic coating compositions, particularly antireflective coating compositions, are provided that comprise a component comprising a hydroxyl-naphthoic group, such as a 6-hydroxy-2-naphthoic group Preferred compositions of the invention are useful to reduce reflection of exposing radiation from a substrate back into an overcoated photoresist layer and/or function as a planarizing, conformal or via-fill layer. | 01-06-2011 |
20100330503 | METHODS OF FORMING ELECTRONIC DEVICES - Methods of forming electronic devices are provided. The methods involve alkaline treatment of photoresist patterns and allow for the formation of high density resist patterns. The methods find particular applicability in semiconductor device manufacture. | 12-30-2010 |
20100330501 | METHODS OF FORMING ELECTRONIC DEVICES - Methods of forming electronic devices are provided. The methods involve alkaline treatment of photoresist patterns and allow for the formation of high density resist patterns. The methods find particular applicability in semiconductor device manufacture. | 12-30-2010 |
20100330500 | METHODS OF FORMING ELECTRONIC DEVICES - Methods of forming electronic devices are provided. The methods involve alkaline treatment of photoresist patterns and allow for the formation of high density resist patterns. The methods find particular applicability in semiconductor device manufacture. | 12-30-2010 |
20100330499 | METHODS OF FORMING ELECTRONIC DEVICES - Methods of forming electronic devices are provided. The methods involve alkaline treatment of photoresist patterns and allow for the formation of high density resist patterns. The methods find particular applicability in semiconductor device manufacture. | 12-30-2010 |
20100330471 | METHODS OF ADJUSTING DIMENSIONS OF RESIST PATTERNS - Methods of adjusting dimensions of resist patterns are provided. The methods allow for control of photoresist pattern dimensions and find particular applicability in resist pattern rework in semiconductor device manufacturing. | 12-30-2010 |