Rohm and Haas Electroinic Materials CMP Holidays, Inc.
Rohm and Haas Electroinic Materials CMP Holidays, Inc. Patent applications | ||
Patent application number | Title | Published |
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20100269416 | Method for manufacturing chemical mechanical polishing pad polishing layers having reduced gas inclusion defects - A method for manufacturing chemical mechanical polishing pad polishing layers that minimizes entrained gas inclusion defects is provided. Also provided is a mix head assembly for use in the manufacture of chemical mechanical polishing pad polishing layers, wherein inclusions of entrained gas inclusion defects are minimized. | 10-28-2010 |