Rogers Corporation Patent applications |
Patent application number | Title | Published |
20150174726 | POLISHING PAD, COMPOSITION FOR THE MANUFACTURE THEREOF, AND METHOD OF MAKING AND USING - A polyurethane layer for forming a polishing pad for a semiconductor wafer is described, wherein the polyurethane layer comprises: a foamed polyurethane, wherein the polyurethane foam has a density of about 640 to about 960 kg/m | 06-25-2015 |
20140087617 | ALUMINUM POLY(ARYL ETHER KETONE) LAMINATE, METHODS OF MANUFACTURE THEREOF, AND ARTICLES COMPRISING THE SAME - A laminate having excellent bond strength, and comprising a tempered aluminum layer comprising aluminum in an amount of 95 to less than 99 wt %, and at least one of cobalt, copper, lithium, magnesium, manganese, nickel, platinum, and silicon in a total amount of at least 0.5 wt %; and a poly(aryl ether ketone) layer, wherein at least a portion layer and the poly(aryl ether ketone) layer are in direct contact. | 03-27-2014 |
20130202928 | BUSBAR INCLUDING FLEXIBLE CIRCUIT - A multilayer busbar for connecting a plurality of battery cells includes a cell connection layer including a plurality of conductor plates arranged to serially connect the plurality of battery cells. The busbar also includes a flexible circuit layer including a substrate having a plurality of measurement lines formed on it where the measurement lines are arranged to connect to a positive and a negative connection location on at least two of the plurality of battery cells. | 08-08-2013 |
20130200871 | DIRECT DRIVE WAVEFORM AMPLIFIER - A high voltage waveform is generated that is similar to a low voltage input waveform. The high voltage waveform is a series of pulses that are applied directly to the device. An error signal controls the frequency, magnitude, and duration of the pulses. A feedback signal derived from the high voltage waveform is compared with the input waveform to produce the error signal. | 08-08-2013 |
20120313682 | Direct drive waveform generator - A high voltage waveform is generated that is similar to a low voltage input waveform. The high voltage waveform is a series of pulses that are applied directly to the device. An error signal controls the frequency, magnitude, and duration of the pulses. A feedback signal derived from the high voltage waveform is compared with the input waveform to produce the error signal. | 12-13-2012 |
20120312519 | Partially composite plate - A partially composite plate includes an area of metal matrix composite and a margin of metal, of the same metal as used to infiltrate the composite, along at least one edge of the composite. In a preferred embodiment of the invention, the margin surrounds the composite, the metal is aluminum, and the metal matrix composite is AlSiC. | 12-13-2012 |
20120229108 | Reduced power consumption for boost converter - A signal for controlling output voltage from the driver is modulated by the input signal to the driver, whereby the output voltage tracks the input signal, matching power to demand. The output storage capacitor can be reduced in size because the amount of energy that needs to be stored is reduced. In addition, feedback transistors are paired on the same substrate and cause opposite changes in response to changes in temperature, thereby automatically compensating for changes in temperature without the use of additional components. | 09-13-2012 |
20120070628 | Printing dimensionally stable resin inks - Small geometry images are printed by coating a surface with a first resin and printing the image from ink containing a second resin on the first resin. The first resin and the second resin are characterized by being solvated by the same solvent. The solvent by which both resins are solvated need not be the solvent used in the inks for either layer. The solvent need not be the same for the inks in both layers. It is believed that solvent from a freshly printed second layer is at least slightly absorbed by the first layer, thereby reducing spreading. | 03-22-2012 |
20120069596 | Front lit alterable display - A tab is cut into a sheet of transparent material. The tab has a free end and a fixed end. A source of light is attached to the tab and the tab and the sheet are displaced along the z-axis of the sheet to direct light from the source into an edge of the sheet. The tab can include conductive traces for electrical connection to the light source or other electrical devices on the sheet. A variable display device adjacent the sheet is viewed through the sheet and the sheet with attached light source provides front lighting for the variable display device. | 03-22-2012 |
20110274980 | METHOD OF PRODUCING AN ELECTROCHEMICAL CELL AND ARTICLES PRODUCED THEREFROM - A method of producing an electrode assembly comprises disposing a thermoplastic polymer powder between a first surface of a first electrode and a first surface of a microporous separator to form a separator/electrode pre-assembly; and adhering the first surface of the first electrode to the first surface of the microporous separator via the thermoplastic polymer powder to form a separator/electrode assembly, wherein the adhesive thermoplastic polymer does not form a solid layer. | 11-10-2011 |
20110229709 | CIRCUIT LAMINATES, AND METHOD OF MANUFACTURE THEREOF - A method of making a supported foam circuit laminate comprises fitting a dielectric foam substrate having a shape defined by edges to a support frame having a thickness, an inner rim and an outer rim, wherein the edges of the dielectric foam substrate are flush with the inner rim of the support frame, and the dielectric foam substrate has a thickness that is greater than the thickness of the support frame; disposing an electrically conductive layer onto a side of the dielectric foam substrate and the support frame, wherein the edges of the electrically conductive layer overlap the inner rim of the support frame; and co-laminating the electrically conductive layer to the dielectric foam substrate and the overlapped support frame under heat and pressure to provide a supported foam circuit laminate. | 09-22-2011 |
20110214906 | DIELECTRIC BOND PLIES FOR CIRCUITS AND MULTILAYER CIRCUITS, AND METHODS OF MANUFACTURE THEREOF - A bond ply, comprising a first outer layer comprising a thermosetting composition and a filler composition; a second outer layer comprising a thermosetting composition and a filler composition that is of the same type as that of the first outer layer; and an intermediate layer disposed between the first and the second outer layers, and comprising a thermosetting composition and a filler composition that is of the same type as the first and second outer layers, wherein the thermosetting composition of the intermediate layer has a degree of cure that is greater than a degree of cure for each of the thermosetting compositions of the first and the second outer layers. | 09-08-2011 |
20110155945 | CONDUCTIVE POLYMER FOAMS, METHOD OF MANUFACTURE, AND USES THEREOF - A polymer foam layer is disclosed, comprising a polymer foam and a plurality of electrically conductive particles dispersed within the polymer foam, polymer foam layer having an unabraded first surface and an opposite, second surface, wherein the electrically conductive particles essentially continuously span the polymer foam layer, and a portion of the electrically conductive particles are exposed at the first surface of the layer and another portion of the electrically conductive particles are exposed at the second surface. The foams are useful as gaskets for electromagnetic shielding, grounding pads, battery contact conductive spring elements, and the like. | 06-30-2011 |
20110031003 | CIRCUIT MATERIALS WITH IMPROVED BOND, METHOD OF MANUFACTURE THEREOF, AND ARTICLES FORMED THEREFROM - A circuit subassembly, comprising: a conductive layer, a dielectric layer formed from a thermosetting composition, wherein the thermosetting composition comprises, based on the total weight of the thermosetting composition a polybutadiene or polyisoprene resin, about 30 to about 70 percent by weight of a magnesium hydroxide having less than about 1000 ppm of ionic contaminants, and about 5 to about 15 percent by weight of a nitrogen-containing compound, wherein the nitrogen-containing compound comprises at least about 15 weight percent of nitrogen; and an adhesive layer disposed between and in intimate contact with the conductive layer and the dielectric layer, wherein the adhesive comprises a poly(arylene ether), wherein the circuit subassembly has a UL-94 rating of at least V-1. | 02-10-2011 |