ROFIN-SINAR TECHNOLOGIES INC. Patent applications |
Patent application number | Title | Published |
20160016257 | METHOD AND APPARATUS FOR PERFORMING LASER CURVED FILAMENTATION WITHIN TRANSPARENT MATERIALS - Systems and methods are described for forming continuous curved laser filaments in transparent materials. The filaments are preferably curved and C-shaped. Filaments may employ other curved profiles (shapes). A burst of ultrafast laser pulses is focused such that a beam waist is formed external to the material being processed without forming an external plasma channel, while a sufficient energy density is formed within an extended region within the material to support the formation of a continuous filament, without causing optical breakdown within the material. Filaments formed according to this method may exhibit lengths in the range of 100 μm-10 mm. An aberrated optical focusing element is employed to produce an external beam waist while producing distributed focusing of the incident beam within the material. Optical monitoring of the filaments may be employed to provide feedback to facilitate active control of the process. | 01-21-2016 |
20150246415 | METHOD AND APPARATUS FOR MATERIAL PROCESSING USING MULTIPLE FILAMENTATION OF BURST ULTRAFAST LASER PULSES - A method of drilling multiple orifices in and texturing a substrate is disclosed and includes the following steps. Ultrafast laser pulses are passed through a beam splitting diffractive optical element and then multiple beams are passed through a distributive-focus lens focusing assembly. The relative distance and/or angle of said distributive-focus lens focusing assembly in relation to the laser source is adjusted focusing the pulses in a distributed focus configuration creating a principal focal waist and at least one secondary focal waist. The fluence level of the at least one secondary focal waists is adjusted such that it is or they are of sufficient intensity and number to ensure propagation of multiple filaments in the substrate. Photoacoustic compressive machining is performed and forms multiple volume(s) within the substrate. | 09-03-2015 |
20150151380 | METHOD AND APPARATUS FOR LASER PROCESSING OF SILICON BY FILAMENTATION OF BURST ULTRAFAST LASER PULSES - A method for laser processing of Silicon includes placing a Kerr material into engagement with the Silicon forming an interface therebetween. A laser beam is applied having at least one subpulse in a burst envelope operating at a first wavelength. The laser beam passes through a distributive lens focusing assembly and to the Kerr material. The first wavelength is modified to a plurality of second wavelengths, some of which are effective for processing Silicon. Photoacoustic compression processing is produced by the laser pulse energy by a portion of second wavelengths delivered through the interface and to the Silcon which initiates Kerr Effect self focusing which is propagated in the Silicon by additional energy input to the Silicon thus producing a filament within the Silicon. | 06-04-2015 |
20150140735 | ELECTRO/MECHANICAL MICROCHIPS AND METHOD OF MAKING WITH BURST ULTRAFAST LASER PULSES - A method for making an electromechanical chip using a plurality of transparent substrates, comprising the steps of: machining, using photoacoustic compression, full or partial voids in at least one of the plurality of substrates. The plurality of transparent substrates are stacked and arranged in a specific order. The transparent substrates are affixed and sealed together. The chip may be sealed by laser welding or adhesive. | 05-21-2015 |
20150140241 | METHOD AND APPARATUS FOR SPIRAL CUTTING A GLASS TUBE USING FILAMENTATION BY BURST ULTRAFAST LASER PULSES - A method of producing a spiral cut transparent tube using laser machining includes using an ultrafast laser beam comprising a burst of laser pulses and focusing the laser beam on the transparent tube to enable relative movement between the laser beam and the transparent tube by moving the laser beam, the glass tube or both the laser beam and the glass tube. A beam waist is formed external to the surface of the transparent tube wherein the laser pulses and sufficient energy density is maintained within the transparent tube to form a continuous laser filament therethrough without causing optical breakdown. The method and delivery system makes a spiral cut in the transparent tube. | 05-21-2015 |
20150140229 | METHOD AND APPARATUS FOR FORWARD DEPOSITION OF MATERIAL ONTO A SUBSTRATE USING BURST ULTRAFAST LASER PULSE ENERGY - A process of forward deposition of a material onto a target substrate is accomplished by passing a burst of ultrafast laser pulses of a laser beam through a carrier substrate that is transparent to a laser beam. The carrier substrate is coated with a material to be transferred on the bottom side thereof. Electrons on the back side of said transparent carrier coated with the material are excited by the first few sub-pulses of the laser beam which lifts the material from the carrier substrate and subsequent sub-pulse of the laser beam send the material into space at hypersonic speed by a shock wave that drives the material with forward momentum across a narrow gap between the carrier substrate and the target substrate, and onto the target substrate. | 05-21-2015 |
20150136743 | METHOD OF CLOSED FORM RELEASE FOR BRITTLE MATERIALS USING BURST ULTRAFAST LASER PULSES - A method for machining and releasing closed forms from a transparent, brittle substrate includes using a burst of ultrafast laser pulses to drill patterns of orifices in the substrate. Orifices are formed by photoacoustic compression and they extend completely or partially in the transparent substrate. A scribed line of spaced apart orifices in the transparent substrate comprise a closed form pattern in the substrate. A heat source is applied in a region about said scribed line of spaced apart orifices until the closed form pattern releases from the transparent substrate. | 05-21-2015 |
20150122656 | MASS BASED FILTRATION DEVICES AND METHOD OF FABRICATION USING BURSTS OF ULTRAFAST LASER PULSES - A mass separation device includes a transparent substrate and a plurality of small diameter cylindrically shaped orifices in the transparent substrate. The small diameter cylindrically shaped orifices include smooth wall surfaces and are not tapered. The small diameter cylindrically shaped orifices are drilled by photoacoustic compression and are clean and sharp and do not have ejecta mounds surrounding the orifice on the surface of the transparent substrate. The small diameter cylindrically shaped orifices in said transparent substrate are less than or equal to 1 μm in diameter. The transparent substrate is glass and preferably is borosilicate glass. | 05-07-2015 |
20150121960 | METHOD AND APPARATUS FOR MACHINING DIAMONDS AND GEMSTONES USING FILAMENTATION BY BURST ULTRAFAST LASER PULSES - A non-ablative laser machining method and apparatus for cutting facets of a diamond, using a material machining technique involving filamentation by burst ultrafast laser pulses well suited to mass production. Coupled with 3D modeling and the computerized laser machining system, complex geometric surfaces can be created on the diamond. The facets of the diamond need not be planar in configuration, and may incorporate acute as well as oblique angles. This method minimizes the need for diamond polishing, speeds up production, and realizes great reductions in the quantity of lost material from the cutting process. | 05-07-2015 |
20150118522 | METHOD OF FABRICATING A GLASS MAGNETIC HARD DRIVE DISK PLATTER USING FILAMENTATION BY BURST ULTRAFAST LASER PULSES - A non-ablative method and apparatus for making an economical glass hard disk (platter) for a computer hard disk drive (HDD) using a material machining technique involving filamentation by burst ultrafast laser pulses. Two related methods disclosed, differing only in whether the glass substrate the HDD platter is to be cut from has been coated with all the necessary material layers to function as a magnetic media in a computer's hard drive. Platter blanks are precisely cut using filamentation by burst ultrafast laser pulses such that the blank's edges need not be ground, the platter's geometric circularity need not be corrected and there is no need for further surface polishing. Thus the platters can be cut from raw glass or coated glass. As a result, this method reduces the product contamination, speeds up production, and realizes great reductions in the quantity of waste materials and lower production costs. | 04-30-2015 |
20150044416 | METHOD AND APPARATUS FOR HYBRID PHOTOACOUSTIC COMPRESSION MACHINING IN TRANSPARENT MATERIALS USING FILAMENTATION BY BURST ULTRAFAST LASER PULSES - An apparatus, system and method for the processing of orifices in materials by laser filamentation that utilizes an optical configuration that focuses the incident laser light beam in a distributed manner along the longitudinal beam axis. This distributed focusing method enables the formation of filaments over distances, and the laser and focusing parameters are adjusted to determine the filament propagation and termination points so as to develop a single/double end stopped orifice, or a through orifice. Selected transparent substrates from a stacked or nested configuration may have orifices formed therein/therethrough without affecting the adjacent substrate. These distributed focusing methods support the formation filaments with lengths well beyond ten millimeters in borosilicate glass and similar brittle materials and semiconductors. | 02-12-2015 |
20150038313 | METHOD AND APPARATUS FOR PERFORMING LASER FILAMENTATION WITHIN TRANSPARENT MATERIALS - Systems and methods are described for forming continuous laser filaments in transparent materials. A burst of ultrafast laser pulses is focused such that a beam waist is formed external to the material being processed without forming an external plasma channel, while a sufficient energy density is formed within an extended region within the material to support the formation of a continuous filament, without causing optical breakdown within the material. Filaments formed according to this method may exhibit lengths exceeding 10 mm. In some embodiments, an aberrated optical focusing element is employed to produce an external beam waist while producing distributed focusing of the incident beam within the material. Various systems are described that facilitate the formation of filament arrays within transparent substrates for cleaving/singulation and/or marking. Optical monitoring of the filaments may be employed to provide feedback to facilitate active control of the process. | 02-05-2015 |
20150034613 | SYSTEM FOR PERFORMING LASER FILAMENTATION WITHIN TRANSPARENT MATERIALS - Systems and methods are described for forming continuous laser filaments in transparent materials. A burst of ultrafast laser pulses is focused such that a beam waist is formed external to the material being processed without forming an external plasma channel, while a sufficient energy density is formed within an extended region within the material to support the formation of a continuous filament, without causing optical breakdown within the material. Filaments formed according to this method may exhibit lengths exceeding up to 10 mm. In some embodiments, an aberrated optical focusing element is employed to produce an external beam waist while producing distributed focusing of the incident beam within the material. Various systems are described that facilitate the formation of filament arrays within transparent substrates for cleaving/singulation and/or marking. Optical monitoring of the filaments may be employed to provide feedback to facilitate active control of the process. | 02-05-2015 |