Renesas Technology America, Inc. Patent applications |
Patent application number | Title | Published |
20120098117 | POWER AND THERMAL DESIGN USING A COMMON HEAT SINK ON TOP OF HIGH THERMAL CONDUCTIVE RESIN PACKAGE - An apparatus and method of manufacture may be provided for a package that can be coupled to a common heat sink without external electrical isolation. The apparatus, for example, can include a semi-conductor die comprising at least one electronic device. The apparatus can also include a frame on which a bottom side of the die is mounted, a bottom side of the frame being configured to attach to a printed circuit board. The apparatus can further include a high thermal conductivity resin molded onto a top side of the die. | 04-26-2012 |
20110115471 | Current Sensing and Measuring Method and Apparatus - A method can include obtaining a voltage across a first transistor as an obtained voltage. The method can also include multiplying the obtained voltage by a predetermined multiple M to yield a multiplied voltage. The method can further include applying the multiplied voltage to a second transistor, wherein the second transistor is N times smaller than the first transistor. The method can additionally include providing an output current of the second transistor as an M/N scaled estimate of an output current of the first transistor. | 05-19-2011 |
20110002358 | Temperature Detection and Reporting System and Method in Power Driving and/or Consuming System - An apparatus, in one embodiment, can include a configuration including a plurality of heat generation devices. The apparatus also includes a plurality of thermal sensors respectively, operably connected to each of the plurality of heat generation devices, wherein each thermal sensor of the plurality of thermal sensors includes a respective output terminal configured to provide a voltage representative of the temperature of the respective heat generation device. The apparatus further includes an output circuit configured to output the highest temperature information among the heat generation devices. The output terminals of the plurality of thermal sensors are tied together. A corresponding method is also discussed. | 01-06-2011 |
20090230905 | Back Electro-Motive Force (BEMF) Commutation and Speed Control of a Three-Phase Brushless DC (BLDC) Motor - A DC motor comprises a stator having at least three windings coupled to a neutral point; a first pair of upper and lower switches for driving a first winding of the at least three windings to a first voltage or in tristate; a second pair of upper and lower switches for driving a second winding of the at least three windings to a second voltage or in tristate; a third pair of upper and lower switches for driving a third winding of the at least three windings to a third voltage or in tristate, one of the first, second or third windings being in tristate; a back electro-motive force (BEMF) signal generation circuit coupled to receive a BEMF voltage from the winding in tristate; a comparator coupled to receive the BEMF voltage and a zero-crossing voltage representing the voltage at the neutral point at a predetermined time and for comparing the BEMF voltage and the zero-crossing voltage to generate a comparison result; a zero-crossing voltage generation circuit to output the zero-crossing voltage to the comparator; and a commutation controller coupled to receive the comparison result and a speed control signal and for using the comparison result and the speed control signal to generate complementary pulse width modulated (PWM) control signals, one of the complementary PWM control signals for controlling an upper switch and the other of the complementary PWM control signals for substantially simultaneously controlling a lower switch. | 09-17-2009 |
20080313383 | Processor for Virtual Machines and Method Therefor - Apparatus and method are described for a data processing device. The data processor includes features suitable for executing a software virtual machine. The data processor provides an instruction set that supports object-level memory protection suitable for high speed operation. Memory control logic is provided to accommodate a configuration having relatively less random access memory (RAM) as compared to re-programmable, nonvolatile memory, and to improve access to the re-programmable, nonvolatile memory. | 12-18-2008 |