RAVE LLC Patent applications |
Patent application number | Title | Published |
20140130215 | Indented Mold Structures For Diamond Deposited Probes - The present invention discloses a method of fabricating a scanning probe microscopy probe including positioning a pattern probe over a mold substrate; indenting the pattern probe into the mold substrate material to form a mold pit; depositing a film onto the mold substrate including the mold pit; removing a portion of the deposited film to form a probe, and releasing the probe from the mold substrate material. | 05-08-2014 |
20140069457 | Apparatus And Method For Indirect Surface Cleaning - Methods for cleaning a surface of a photomask and for increasing the useable lifetime of the photomask are disclosed. One method includes, a first wafer print processing using a photomask and a pellicle disposed across the photomask, and cleaning the photomask. The cleaning the photomask includes directing a laser beam through the pellicle toward the photomask, the laser beam having a wavelength that is substantially equal to a local maximum of an absorption spectrum of the photomask, heating the photomask with the laser beam, and transferring heat from the photomask to a contaminant disposed on the photomask, thereby thermally decomposing the contaminant. | 03-13-2014 |
20130037053 | Debris Removal in High Aspect Structures - A system for removing debris from a surface of a photolithographic mask is provided. The system includes an atomic force microscope with a tip supported by a cantilever. The tip includes a surface and a nanometer-scaled coating disposed thereon. The coating has a surface energy lower than the surface energy of the photolithographic mask. | 02-14-2013 |
20120231397 | Wafer Fabrication Process - A wafer fabrication process with removal of haze formation from a pellicalized photomask surface is provided. The wafer fabrication process includes pre-print wafer processing, wafer print processing using at least one photomask having a pellicle, photomask clean processing, wafer print processing using the photomask, and post-print wafer processing. The photomask clean processing step includes directing a laser through the pellicle towards an inorganic particle disposed on the photomask to remove the particle from the photomask by thermal decomposition. | 09-13-2012 |
20110303062 | Method for Fabricating High Aspect Ratio Nanostructures - A method for fabricating high aspect ratio nanostructures is provided. The method uses a nanomachining tip of an atomic force microscope to create an orthogonal series of isolated cuts that define a grid of high aspect ratio nanostructures in a work area on a substrate. Additional material can then be removed to smooth out at least one of the nanostructures in the work area. | 12-15-2011 |
20090317730 | SYSTEM AND A METHOD FOR IMPROVED CROSSHATCH NANOMACHINING OF SMALL HIGH ASPECT THREE DIMENSIONAL STRUCTURES BY CREATING ALTERNATING SUPERFICIAL SURFACE CHANNELS - This invention provides the user the ability to accurately nanomachine surfaces with reduced tip induced errors. Nanomaching has two types of errors, a first type of error is brought about by the tip's shape and its aspect ratio. A second type of error due to the tip's deflection as it works the material. Therefore, embodiments of the present invention minimizes tip deflection errors allowing allow high aspect Nano-bits to reliably and accurately nanomachine small high aspect three dimensional structures to repair and rejuvenate photomasks | 12-24-2009 |
20090114850 | APPARATUS AND METHOD FOR MODIFYING AN OBJECT - A method and apparatus includes positioning a reactant on a surface in specific location and then directing an energy source from a device at the reactant such that it modifies the surface to either remove material or add material. | 05-07-2009 |