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Quality Packing, Inc.

Quality Packing, Inc. Patent applications
Patent application numberTitlePublished
20090101534Recyclable Blister Pack and Process of Making - A recyclable blister pack system is provided, including a substrate having a dry tack cohesive adhesive layer deposited on one of its surfaces and a blister layer for receiving a product. The properties of the dry tack cohesive are selected so the blister layer is separable from the substrate without leaving substantial substrate residue on the blister layer. This improves the recyclability of the blister layer.04-23-2009