| 20110273701 | METHODS FOR CHARACTERIZATION OF THE MECHANICAL PROPERTIES OF THIN FILMS AND TEST STRUCTURES FOR PERFORMING THE SAME - A test structure allows one or more deposited thin film layers to be moved such that mechanical properties of the thin film layer or layers may be determined. Methods for characterizing the mechanical properties of the deposited thin film layer include the determination of a transition voltage of the movable thin film layer in the test structure, or the mechanical stiffness of the movable layer, and/or a determination of residual stress within the movable layer. Methods may also include the determination of creep rate or fatigue, as well as the variance in mechanical properties of the movable layer at various temperatures. Test structures used with the testing methods may include structures which interferometrically modulate incident light, enabling electrical or optical determination of the state of the test structures. | 11-10-2011 |
