| QMC Co., Ltd. Patent applications |
| Patent application number | Title | Published |
|---|
| 20120111310 | TARGET OBJECT PROCESSING METHOD AND TARGET OBJECT PROCESSING APPARATUS - There is provided a target object processing method capable of self-breaking a target object with a laser beam. The target object processing method includes: generating a laser beam from a laser beam source; correcting a divergence angle of the generated laser beam; and forming a spot by condensing the corrected laser beam to the inside of the target object. A shape or a size of the spot is adjusted by correcting the divergence angle of the laser beam, a phase transformation area is formed within the target object by the spot, and the target object is subject to self-breaking with the phase transformation area as the starting point. | 05-10-2012 |
| 20120043474 | LASER PROCESSING METHOD AND LASER PROCESSING APPARATUS - The present disclosure relates to laser processing and a laser processing apparatus for processing materials using laser. Processing performed after loading a wafer on a work stage and a laser processing apparatus for implementing such processing, among others, are disclosed. The laser processing includes loading a wafer on a work stage; determining the number of chips formed on the wafer loaded on the work stage, performing chip defect inspection and aligning the wafer while moving the work stage; measuring a height of a surface of the wafer loaded on the work stage using a displacement sensor; monitoring output power of a processing laser using a power meter; and shifting the work stage while irradiating a laser beam on the wafer to process the wafer. | 02-23-2012 |
| 20110316579 | LED CHIP TESTING DEVICE - The present invention provides an LED chip testing device that measures characteristics of an LED chip. | 12-29-2011 |
