PST SENSORS (PROPRIETARY) LIMITED Patent applications |
Patent application number | Title | Published |
20150023393 | Large Area Temperature Sensor - A sensing device is made up of a network of nominally identical temperature dependent resistors which is topologically equivalent to a square resistor network. The device has terminals at which an average resistance value thereof can be measured. The resistors are supported on a substrate which can be reduced in size from an initial size without substantially changing the average resistance value. In preferred embodiments, a pattern of contacts and conductive tracks joining the contacts are printed on a substrate, and a material having a temperature dependent resistance is applied over the contacts to define a network of interconnected thermistors. Alternatively, the material can be applied to the substrate first and the contacts and tracks printed on it. | 01-22-2015 |
20150016487 | Flexible Temperature and Strain Sensors - A strain compensated temperature sensor includes a first, temperature dependent resistor, and a second, substantially temperature independent resistor connected in series with the temperature dependent resistor. At least one electrical contact allows an electrical potential difference to be applied across both resistors simultaneously. Both the temperature dependent resistor and the substantially temperature independent resistor are sensitive to mechanical strain. This permits temperature readings from the sensor to be corrected automatically for mechanical distortion of the sensor. The temperature dependent resistor and the substantially temperature independent resistor are of substantially similar construction, preferably being located adjacent one another in or on a common substrate, and hence have a similar response to a mechanical force applied to them. | 01-15-2015 |
20150007665 | Thermal Imaging Sensors - A sensor device comprises an array of spaced apart sensor elements disposed in a pattern on a substrate. Each sensor element is connected electrically so that a physical variable measured by each sensor element independently can be recorded and/or displayed by an external instrument. The sensing device may be a temperature sensing device, in which case the sensor elements are temperature sensing elements such as negative temperature coefficient (NTC) thermistors. Alternatively the sensing device may be a strain or pressure sensing device, or an optical imaging device, in which case the sensor elements include piezoresistors or photoresistors. The sensor elements may be connected in a common source or write all—read one configuration, in a common output or write one—read all configuration, or in an array comprising X rows and Y columns, in a write X—read Y configuration, | 01-08-2015 |
20140216920 | Method of Producing Nanoparticles - A method is provided of producing nanoparticles in the size range 1 nm to 1000 nm through the synthesis of one or more precursor fluids. The method includes providing a fluid medium comprising at least one precursor fluid and generating an electrical spark within said fluid medium to cause pyrolysis of said at least one precursor fluid in a relatively hot plasma zone to produce at least one radical species. Nanoparticles are formed by nucleation in the fluid medium in a cooler reaction zone about the plasma zone, where the radical species acts as a reactant or catalytic agent in the synthesis of material composing the nanoparticles. The spark is created by an electrical discharge having a frequency between 0.01 Hz and 1 kHz, and a total energy between 0.01 J and 10 J. The nanoparticles may comprise silicon, or compounds or alloys of silicon, and are typically useful in electronic and electrical applications. | 08-07-2014 |
20130199826 | Assembling and Packaging a Discrete Electronic Component - An electronic component assembly comprises a printed component structure comprising at least one of a semiconducting ink, an insulating ink and a conducting ink deposited onto a substrate. The component structure defining at least one contact area, with a connecting lead disposed against or adjacent to the contact area. At least one layer of electrically insulating material encloses the component structure. At least one of the substrate and the layer of electrically insulating material comprises packaging material. The component structure can be printed on a substrate such as paper or another soft material, which is secured to a layer of insulating packaging material such as polyethylene. Instead, the substrate can be the insulating packaging material itself. Variations using hard and soft substrates are possible, and various examples of electronic component assembly are disclosed. | 08-08-2013 |