| Progressive Cooling Solutions, Inc. Patent applications |
| Patent application number | Title | Published |
|---|
| 20110043092 | LED BULB FOR HIGH INTENSITY DISCHARGE BULB REPLACEMENT - The disclosed system includes a two-phase cooling apparatus configured for cooling an array of LED dies. | 02-24-2011 |
| 20100132404 | BONDS AND METHOD FOR FORMING BONDS FOR A TWO-PHASE COOLING APPARATUS - Bonds and method for forming bonds for a two-phase cooling apparatus are disclosed. In one aspect of the present disclosure, the two-phase cooling apparatus includes an evaporator. One embodiment of the evaporator includes, a first layer having porous regions and non-porous regions, the porous regions having a plurality of through-holes extending through the first layer, a cap structure formed such that when disposed over the first layer, at least a portion of the plurality of through-holes are unobstructed to liquid or vapor flow, a bonding layer formed between the first layer and the cap structure, the bonding layer in contact with at least a portion of the non-porous regions of the first layer, the bonding layer comprising a bond. The bonding layer is typically compatible with liquid and forms a hermetic seal between the first layer and the cap structure | 06-03-2010 |
| 20100038660 | TWO-PHASE COOLING FOR LIGHT-EMITTING DEVICES - System, method, and apparatus for two phase cooling in light-emitting devices are disclosed. In one aspect of the present disclosure, an apparatus includes a light-emitting device and a two-phase cooling apparatus coupled to the light-emitting device. The coupling of the two-phase cooling apparatus and the light-emitting device is operatively configured such that thermal coupling between the light-emitting device and the two-phase cooling apparatus enables, when, in operation, heat generated from the light-emitting device to be absorbed by a substance of a first phase in the two-phase cooling apparatus to convert the substance to a second phase. | 02-18-2010 |
