| POLYTRONICS TECHNOLOGY CORP. Patent applications |
| Patent application number | Title | Published |
|---|
| 20120075762 | Over-Current Protection Device - An over-current protection device includes a first electrode layer, a second electrode layer, and a resistance material disposed between the first and second electrode layers. The first electrode layer includes a first groove pattern formed on and through the first electrode layer. The first groove pattern is configured to separate the first electrode layer into a plurality of connected regions. The second electrode layer includes a second groove pattern formed on and through the second electrode layer. The second groove pattern is configured to separate the second electrode layer into a plurality of connected regions. The first and second groove patterns are further configured to be formed in an interlaced manner that when the first and second electrode layers are overlapped, the first and second groove patterns form a plurality of independent regions, which divide the resistance material into a plurality of electrically isolated and parallel connected units. | 03-29-2012 |
| 20110217462 | METHODS FOR MANUFACTURING INSULATED HEAT CONDUCTIVE SUBSTRATE AND INSULATED HEAT CONDUCTIVE COMPOSITE SUBSTRATE - A method for manufacturing an insulated heat conductive substrate comprises the steps of: performing hydrolysis and condensation of at least one thermally conductive ceramic powder to prepare at least one modified thermally conductive ceramic powder, which comprises a plurality of modified powder particles, each grafted with an organic material; mixing the at least one modified thermally conductive ceramic powder with two substantially mutually soluble polymers to achieve a uniform mixture; blending the uniform mixture with a curing agent to obtain a melt extrudable dielectric curable material; extruding the dielectric curable material through a slit to form a sheet-like substrate; and disposing a first film and a second film on two side surfaces of the substrate to obtain an insulated heat conductive substrate, wherein each of the first and second films can be either a metal foil or a release film. | 09-08-2011 |
| 20110214852 | HEAT CONDUCTIVE DIELECTRIC POLYMER MATERIAL AND HEAT DISSIPATION SUBSTRATE CONTAINING THE SAME - A heat conductive dielectric polymer material comprises a polymer, a curing agent and a heat conductive filler. The polymer comprises a thermoplastic and a thermosetting epoxy resin. The thermoplastic comprises 3% to 30% by volume of the heat conductive dielectric polymer material, and the thermosetting epoxy is selected from end-epoxy-function group epoxy resin, side chain epoxy function group epoxy resin, multi-function group epoxy resin or the mixture thereof. The curing agent can cure the thermosetting epoxy resin at a temperature. The heat conductive filler is uniformly distributed in the polymer and comprises 40% to 70% by volume of the heat conductive dielectric polymer material. The heat conductive dielectric polymer material has an interpenetrating network structure, and the heat conductive coefficient is greater than 1.0 W/m-K. | 09-08-2011 |
| 20100134942 | SURFACE-MOUNTED OVER-CURRENT PROTECTION DEVICE - A surface-mounted over-current protection device with positive temperature coefficient (PTC) behavior is disclosed. The surface-mounted over-current protection device comprises a first metal foil, a second metal foil corresponding to the first metal foil, a PTC material layer stacked between the first metal foil and the second metal foil, a first metal electrode, a first metal conductor electrically connecting the first metal foil to the first metal electrode, a second metal electrode corresponding to the first metal electrode, a second metal conductor electrically connecting the second metal foil to the second metal electrode, and at least one insulated layer to electrically insulate the first metal electrode from the second metal electrode. The surface-mounted over-current protection device, at 25° C., indicates that a hold current thereof divided by the product of a covered area thereof and the number of the conductive composite module is at least 0.16 A/mm | 06-03-2010 |
