| 20110239429 | METHOD TO INCREASE YIELD AND REDUCE DOWN TIME IN SEMICONDUCTOR FABRICATION UNITS BY PRECONDITIONING COMPONENTS USING SUB-APERTURE REACTIVE ATOM ETCH - An embodiment of the present inventions provides a method for preconditioning a semiconductor fabrication component using a plasma etching process and an optional enhanced ultrasonic and/or megasonic preconditioning step in order to eliminate the need for a burn-in period typically associated with said components, as well as extend the useful life of the component during its wear-out phase. | 10-06-2011 |
