picoDrill SA Patent applications |
Patent application number | Title | Published |
20120181264 | METHOD OF CUTTING A SUBSTRATE AND A DEVICE FOR CUTTING - The present invention relates to a method of cutting a substrate by the introduction of thermo-mechanical tensions. The present invention also relates to the precise manufacturing of a substrate shape by the cutting method specified. The present invention also relates to a device for performing the method according to the present invention. | 07-19-2012 |
20120138339 | METHOD OF PRODUCING AN ELECTRICALLY CONDUCTING VIA IN A SUBSTRATE - The present invention relates to a method of producing an electrically-conducting via in a substrate and to a substrate produced thereby. The method comprises the steps: a) providing a substrate made of at least one electrically insulating material ( | 06-07-2012 |
20120055905 | METHOD OF SMOOTHING AND/OR BEVELLING AN EDGE OF A SUBSTRATE - The present invention relates to a method of smoothing and/or bevelling an edge of a substrate. The present invention also relates to a substrate produced by the method according to the present invention, in particular a substrate having an edge smoothed and/or bevelled by the method according to the present invention. | 03-08-2012 |
20110304023 | METHOD OF GENERATING A HOLE OR RECESS OR WELL IN A SUBSTRATE - The present invention relates to a method of generating a hole or recess or well in an electrically insulating or semiconducting substrate, and to a hole or recess or well in a substrate generated by this method. The invention also relates to an array of holes or recesses or wells in a substrate generated by the method. The invention also relates to a device for performing the method according to the present invention. | 12-15-2011 |
20110278648 | METHOD OF INTRODUCING A STRUCTURE IN A SUBSTRATE - This invention relates to methods for the production of micro-structured substrates and their application in natural sciences and technology, in particular in semiconductor, microfluidic and analysis devices. It concerns a method of introducing a structure, such as a hole or cavity or channel or well or recess or a structural change by providing a controlled electrical discharge. | 11-17-2011 |