| PETER WOLTERS GMBH Patent applications |
| Patent application number | Title | Published |
|---|
| 20110300785 | Apparatus for Double-Sided, Grinding Machining of Flat Workpieces - The invention relates to an apparatus for the double-sided, grinding machining of flat workpieces with an upper and a lower work disk, each of which has a work surface with a grinding layer, wherein the work surfaces form a work gap amongst themselves, in which workpieces can be ground, wherein at least one of the work disks is rotatably drivable by means of a driving mechanism, and further having a device for guiding the workpieces in the work gap. It is provided according to the invention that debarring means are arranged on at least one of the work disks, which are designed to deburr the workpieces during their machining in the apparatus. | 12-08-2011 |
| 20110222071 | METHOD FOR MEASURING THE THICKNESS OF A DISCOIDAL WORKPIECE - The invention relates to a method for measuring the thickness of a discoidal workpiece, which serves as a substrate for electronic components, comprising the steps: infrared radiation is directed at the top side of the workpiece, wherein a first radiation portion is reflected on the top side and a second radiation portion penetrates the workpiece thickness, is reflected on the bottom side of the workpiece and emerges again on the top side of the workpiece, the first and the second radiation portion interfere under formation of an interference pattern and the optical workpiece thickness between the top side of the workpiece and the bottom side of the workpiece is determined using the interference pattern. It is provided according to the invention that the mechanical workpiece thickness is determined from a measurement of the intensity of the infrared radiation reflected and/or transmitted from the workpiece. | 09-15-2011 |
| 20100099337 | Device For The Double-Sided Processing Of Flat Workpieces and Method For The Simultaneous Double-Sided Material Removal Processing Of A Plurality Of Semiconductor Wafers - A device for double-sided processing of flat workpieces has upper and lower working discs forming between them a working gap containing a carrier disc with cutout(s) for workpiece(s), the carrier disc having circumferential teeth by means of which it rolls on an inner and an outer gear wheel or pin ring, wherein the gear wheels or pin rings have a multiplicity of gear or pin arrangements which engage the teeth of the carrier discs during rolling, at least one of the pin arrangements having a guide which delimits movement of the margin of the carrier disc in at least one axial direction, the guide formed by a circumferential shoulder or a circumferential groove. | 04-22-2010 |
| 20080304929 | MACHINING MACHINE WITH MEANS FOR ACQUIRING MACHINING PARAMETERS - A machining machine with an upper rotatingly drivable machining disc, the annular machining plane of which has a machining coating and is facing a lower machining plane, wherein the machining planes form a machining gap between each other. Plural rotor discs are arranged in the gap, which accommodate workpieces in recesses and which can be brought into rotation by means of a roll-off device, wherein the workpieces move along a cycloid path, wherein plural sensor elements for acquiring at least one machining parameter are arranged in the upper machining disc, distributed across its cross section, the sensor elements are each one coupled to an active or passive RFID chip and a reading device is assigned to the upper machining disc for reading out the RFID chips. | 12-11-2008 |
