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PERKINELMER ELCOS GMBH

PERKINELMER ELCOS GMBH Patent applications
Patent application numberTitlePublished
20110260181Mounting structure for LEDs, LED assembly, LED assembly socket, method for forming a mounting structure - A mounting structure for at least one LED has a substrate made of silicon and/or another semiconductor, wherein at least one mounting portion formed in a front surface of the substrate for mounting at least one LED chip thereon, and cooling grooves or channels for a cooling fluid are formed in the substrate, preferably in or beneath a rear surface thereof.10-27-2011
20110254030LIQUID REFLECTOR - A light emitting diode (LED) package is disclosed which has an integral reflector for improving performance. The package includes a substrate for supporting the LED. A frame is formed on the top surface of the substrate surrounding the LED. During fabrication, a liquid compound is dispensed into the frame in a manner to surround the LED without covering the active area of the LED. The liquid compound includes particles for scattering light. The top surface of the liquid compound is curved due to surface tension. The curvature remains after the compound is cured. In a preferred embodiment, an encapsulating material is used to cover the LED and the compound. The reflector functions to increase the light output from the LED package.10-20-2011
20090206758Illumination Device, Illumination Control Apparatus, Illumination System - An illumination device comprises on a common substrate (08-20-2009