PERASO TECHNOLOGIES, INC.
|PERASO TECHNOLOGIES, INC. Patent applications|
|Patent application number||Title||Published|
|20150270617||WAVEGUIDE ADAPTER PLATE TO FACILITATE ACCURATE ALIGNMENT OF SECTIONED WAVEGUIDE CHANNEL IN MICROWAVE ANTENNA ASSEMBLY - An antenna apparatus includes a waveguide adapter plate for mounting an antenna flange and an RF system-in-package or other IC package. The waveguide adapter plate comprises a first surface and an opposing second surface and a waveguide flange interface. The waveguide flange interface comprises a waveguide channel section extending between the first surface and the second surface and a set of flange mounting holes extending from the first surface to the second surface. The waveguide adapter plate further includes a plurality of substrate alignment pins extending substantially perpendicular from the second surface.||09-24-2015|
|20150270616||RF SYSTEM-IN-PACKAGE WITH QUASI-COAXIAL COPLANAR WAVEGUIDE TRANSITION - An IC package includes an IC die disposed at a first surface of a substrate, which includes a signal via extending between first and second metal layers. The first metal layer is proximate to the first surface and includes a first coplanar waveguide. The first coplanar waveguide has a first signal line coupling a die bump to the signal via and has a first ground plane co-planar with the first signal line. The second metal layer is proximate to a second surface and includes a second coplanar waveguide that has a second signal line coupling the signal via to a launcher element and has a second ground plane co-planar with the second signal line. The IC package further includes a waveguide channel aperture comprising a region surrounding the launcher element and which is substantially devoid of conductive material and a via fence disposed at a perimeter of the first region.||09-24-2015|
|20140285393||DUAL-TAPERED MICROSTRIP-TO-WAVEGUIDE TRANSITION - An antenna apparatus comprises a substrate with a microstrip-to-waveguide transition comprising a microstrip feedline extending between a first terminal point and a second terminal point at a first metal layer and comprising a microstrip element and a probe element. The microstrip element includes a connection segment extending from the first terminal point to a second point, a taper segment extending from the second point to a third point, and a continuous-width segment extending from the third point to a fourth point. The probe element extends from the fourth point to the second terminal point and has a width which is narrower than the continuous-width segment. The substrate further includes a waveguide opening comprising a region surrounding the probe element and includes a plurality of metal vias disposed at the perimeter of the waveguide opening and which extend from the first metal layer to the second metal layer.||09-25-2014|
|20140285389||RF SYSTEM-IN-PACKAGE WITH MICROSTRIP-TO-WAVEGUIDE TRANSITION - An apparatus includes an IC package comprising a substrate having a first metal layer, a second metal layer, and a dielectric layer disposed between the first and second metal layers. The IC package further comprises an IC die disposed at a surface of the substrate and comprising RF circuitry. The first metal layer comprises a microstrip feedline extending from a pin of the IC die. The microstrip feedline includes a conductive trace having a probe element at a tip distal from the pin. The first metal layer further comprises a waveguide opening comprising a region surrounding the probe element, the region being substantially devoid of conductive material. The substrate further comprises a plurality of metal vias disposed at the perimeter of the region, the metal vias extending from the first metal layer to the second metal layer.||09-25-2014|
|20140285383||RECONFIGURABLE WAVEGUIDE INTERFACE ASSEMBLY FOR TRANSMIT AND RECEIVE ORIENTATIONS - An antenna apparatus comprises a lower assembly and an upper assembly, which together forming a cavity to contain an RF circuit device. The upper assembly comprises a waveguide flange interface at an external surface of the upper assembly. The waveguide flange interface comprises a waveguide channel extending from the external surface to an internal surface forming a surface of the cavity. An opening of the waveguide channel at the internal surface is substantially centered about a first centerline of the upper assembly parallel with the external surface and offset from a second centerline of the upper assembly parallel with the external surface, whereby the second centerline perpendicular is to the first centerline. The upper assembly is removably attachable to the lower assembly in either of a first orientation or a second orientation, whereby the second orientation represents a 180 degree rotation of the upper assembly relative to the first orientation.||09-25-2014|
|20130300624||BROADBAND END-FIRE MULTI-LAYER ANTENNA - A microstrip antenna is formed on a multilayer substrate. The microstrip antenna includes a dipole formed of two dipole halves. Each of the dipole halves is formed in one of at least two layers of the multilayer substrate. Optionally, at least one passive reflector is located proximate the dipole in one of the layers, or a third layer of the substrate.||11-14-2013|
|20120190312||RADIO ANTENNA SWITCH - A radio antenna switch module for a high frequency radio transceiver enables the radio transceiver to have a small number of receivers and transmitters and a larger number of antennas, whereby each antenna has a different diversity characteristic. The diversity between antennas provide for greater communication reliability, while the small number of receivers and transmitters allows the transceiver to operate at relatively low power compared to conventional radio transceivers. The switch module also allows for two loopback modes between the transmitter and the receiver for at-speed, low-cost self-test in production.||07-26-2012|
Patent applications by PERASO TECHNOLOGIES, INC.