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PARK ELECTROCHEMICAL CORPORATION
| PARK ELECTROCHEMICAL CORPORATION Patent applications | ||
| Patent application number | Title | Published |
|---|---|---|
| 20110048776 | THERMOSETTING RESIN COMPOSITIONS AND ARTICLES - The present invention generally relates to a resin composition, a cured resin, a sheet-like cured resin, a laminated body, a prepreg, electronic parts, single and multilayer circuit boards comprising a cyanate ester polymer and condensed phosphate ester, for use in single and multilayer circuit boards that are especially useful in the high-frequency range of above 100 MHz. | 03-03-2011 |