Paragon Technologies Co., Ltd. Patent applications |
Patent application number | Title | Published |
20140327623 | POWER-SAVING TOUCH PAD APPARATUS - A power-saving touch pad apparatus includes a control unit, a proximity sensing unit, an electric charge induction unit, a touch pad driving-operation unit, and a touch pad unit. The electric charge induction unit is formed by a sputtering process. The electric charge induction unit informs the proximity sensing unit when the electric charge induction unit inducts electric charges. The proximity sensing unit informs the control unit. The control unit is configured to control the touch pad driving-operation unit to wake up the touch pad unit. The electric charge induction unit informs the proximity sensing unit when the electric charge induction unit does not induct electric charges. The proximity sensing unit informs the control unit. The control unit is configured to control the touch pad driving-operation unit to control the touch pad unit to enter a power-saving mode. | 11-06-2014 |
20140262721 | TOUCH KEYBOARD WITH IMPROVED STRUCTURE - A touch keyboard with an improved structure is disclosed. The touch keyboard includes a keyboard casing and an inductive circuit layer. The keyboard casing has a front surface and a rear surface; the front surface has a keyboard key assembly composed of a plurality of touch keyboard keys. The touch keyboard keys are integrally formed with the keyboard casing and projected from the front surface of the keyboard casing. The inductive circuit layer is formed on the rear surface of the keyboard casing and is used to detect touching and sliding operations from the user. The touch keyboard keys are projected from the front surface of the keyboard casing so as to identify positions of the touch keyboard keys without fixing user's eyes on the keyboard and increase touching feeling. | 09-18-2014 |
20110120763 | STRUCTURE AND METHOD OF FORMING A FILM THAT BOTH PREVENTS ELECTROMAGNETIC INTERFERENCE AND TRANSMITS AND RECEIVES SIGNALS - The present invention is a film for prevention of electromagnetic interference and transmission of wireless signals. A conductive lamination is integrally attached to a preset position of a substrate and shaped as a film and a signal transceiver. The method of forming the film includes selecting a substrate and selecting a signal transmitting and receiving mode and a form of the conductive surface according to a specific need. A film-shaped signal transceiver and conductive lamination are integrally formed on a preset area of the substrate. By plating and/or coating, the present invention can form a conductive lamination on the substrate with both functions as a signal transceiver and a shield. | 05-26-2011 |
20100127619 | LED Chip Package Module Using Coating for Converting Optical Spectrum - A coating for converting optical spectrum includes: a transparent colloid layer and an emitter material unit. The emitter material unit is used to convert one part of a short-wavelength band of a light source into a long-wavelength band. The emitter material unit has at least one first emitter body and at least one second emitter body both mixed with the transparent colloid layer, the at least one first emitter body is an inorganic silicate compound, and the at least one second emitter body is an organic dye. Hence, the color rendering index (CRI) and the range of color temperature of white light generated by an LED chip package module using the coating are increased according to the function of the emitter material unit for converting one part of a short-wavelength band of a light source into a long-wavelength band. | 05-27-2010 |
20090321761 | COATING FOR CONVERTING OPTICAL SPECTRUM AND LED CHIP PACKAGE MODULE USING THE SAME - A coating for converting optical spectrum includes: a transparent colloid layer and an emitter material unit. The emitter material unit is used to convert one part of a short-wavelength band of a light source into a long-wavelength band. The emitter material unit has at least one first emitter body and at least one second emitter body both mixed with the transparent colloid layer, the at least one first emitter body is an inorganic silicate compound, and the at least one second emitter body is aan organic dye. Hence, the color rendering index (CRI) and the range of color temperature of white light generated by an LED chip package module using the coating are increased according to the function of the emitter material unit for converting one part of a short-wavelength band of a light source into a long-wavelength band. | 12-31-2009 |
20090267841 | ASSEMBLED FILM ANTENNA STRUCTURE - The present invention provides an assembled film antenna structure. The antenna structure includes a substrate, a feeder and conductive medium. The substrate is provided with a conductive thin-profile antenna body. The antenna body includes a signal connector. One side of the conductive medium is connected with the feeder, and the other side is assembled and positioned securely onto the signal connector of antenna body. An anchor protrudes from one side of the conductive medium, and the anchor is embedded into the antenna body and substrate via hot pressing. Thus, the conductive medium and antenna body can be assembled in a more simple and fast way, generating an improved applicability and industrial efficiency. | 10-29-2009 |
20090267839 | FILM ANTENNA ASSEMBLY AND FABRICATION METHOD - The present invention provides a film antenna assembly and a fabrication method thereof. The assembly includes an antenna body, which is a conducting body placed onto the substrate. The antenna body is provided with a signal connector, a feeder, and a conducting medium. One side of the conducting medium is coupled with the feeder, and the other side is located on the signal connector of antenna body. With this combined structure of the feeder, the film antenna assembly could be protected against damage, and the stable electrical connection resolves the coupling issue of the film antenna and feeder for improved applicability and economic efficiency. | 10-29-2009 |