| Palo Alto Research Center, Inc. Patent applications |
| Patent application number | Title | Published |
|---|
| 20090195572 | System And Method For Leveling Applied Ink In A Printer - A system enables ink on an image receiving member to be re-distributed to reduce banding effects in the image. The system includes an ink applicator for applying ink to form an ink image on an image receiving member as it passes by the ink applicator; a plenum chamber for receiving a flow of pressurized fluid from a fluid source, and at least one opening in the plenum chamber to direct the flow of pressurized fluid from the plenum towards the ink image on the image receiving member to re-distribute the ink on the image receiving member. | 08-06-2009 |
| 20090160007 | Systems and Methods for biasing high fill-factor sensor arrays and the like - A high fill-factor photosensor array is formed comprising a P-layer, an I-layer, one or more semiconductor structures adjacent to the I-layer and each coupled to a N-layer, an electrically conductive electrode formed on top of the P-layer, and an additional semiconductor structure, adjacent to the N-layer and which is electrically connected to a voltage bias source. The bias voltage applied to the additional semiconductor structure charges the additional semiconductor structure, thereby creating a tunneling effect between the N-layer and the P-layer, wherein electrons leave the N-layer and reach the P-layer and the electrically conductive layer. The electrons then migrate and distribute uniformly throughout the electrically conductive layer, which ensures a uniform bias voltage across to the entire photosensor array. The biasing scheme in this invention allows to achieve mass production of photosensors without the use of wire bonding. | 06-25-2009 |
| 20090160006 | Systems and methods for biasing high fill-factor sensor arrays and the like - A high fill-factor photosensor array is formed comprising a P-layer, an I-layer, one or more semiconductor structures adjacent to the I-layer and each coupled to a N-layer, an electrically conductive electrode formed on top of the P-layer, and an additional semiconductor structure, adjacent to the N-layer and which is electrically connected to a voltage bias source. The bias voltage applied to the additional semiconductor structure charges the additional semiconductor structure, thereby creating a tunneling effect between the N-layer and the P-layer, wherein electrons leave the N-layer and reach the P-layer and the electrically conductive layer. The electrons then migrate and distribute uniformly throughout the electrically conductive layer, which ensures a uniform bias voltage across to the entire photosensor array. The biasing scheme in this invention allows to achieve mass production of photosensors without the use of wire bonding. | 06-25-2009 |
