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Pac Tech- Packaging Technologies GmbH
Nauen, DE
| Pac Tech- Packaging Technologies GmbH Patent applications | ||
| Patent application number | Title | Published |
|---|---|---|
| 20100213243 | TRANSFER DEVICE FOR RECEIVING AND TRANSFERRING A SOLDER BALL ARRANGEMENT - The present invention relates to a transfer device ( | 08-26-2010 |
| 20090249620 | METHOD AND DEVICE FOR APPLYING AN ELECTRONIC COMPONENT - The invention relates to a method for applying an electronic component ( | 10-08-2009 |