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PAC TECH - PACKAGING TECHNOLOGIES GMBH AND SMART PAC GMBH TECHNOLOGY SERVICES
| PAC TECH - PACKAGING TECHNOLOGIES GMBH AND SMART PAC GMBH TECHNOLOGY SERVICES Patent applications | ||
| Patent application number | Title | Published |
|---|---|---|
| 20080302863 | Method and Device for Transferring a Solder Deposit Configuration - Method and device for transferring a solder deposit configuration having multiple solder deposits onto a terminal surface configuration of a contact surface of a substrate ( | 12-11-2008 |