| 20100078309 | SPUTTERING METHOD AND SPUTTERING APPARATUS - A sputtering method is for forming, in a vacuum chamber, an initial layer on a film formation target object and then further forming a second layer on the initial layer therein, and the method includes: in the vacuum chamber, arranging surfaces of a pair of targets to face each other while distanced apart from each other at a preset distance and to be inclined toward the film formation target object placed at a lateral position between the targets, and then sputtering the targets by generating a magnetic field space on the facing surfaces of the pair of targets, and thus forming the initial layer on the film formation target object by using particles sputtered by the sputtering; and further forming the second layer on the film formation target object at a higher film forming rate than a film forming rate of the initial layer. | 04-01-2010 |
