ORIENT SEMICONDUCTOR ELECTRONICS, LIMITED Patent applications |
Patent application number | Title | Published |
20120192445 | APPARATUS OF CHECKING DIMENSIONS OF MEMORY CARD - An apparatus of checking dimensions of an object includes a checking platform. The checking platform has a checking slot extending from one side and arriving at another side thereof. The checking slot is defined by a first side wall, a second side wall and a bottom wall, wherein the first side wall has a front section connecting to a rear section. The second side wall has a middle section connecting to a front section and a rear section, wherein the distance between the front section of the first side wall and the front section of the second side wall is greater than that between the rear section of the first side wall and the rear section of the second side wall, and is smaller than that from a connecting location to the middle section of the second side wall. | 08-02-2012 |
20120038839 | MICRO PROJECTOR MODULE - A micro projector module according to the present invention is provided. The micro projector module includes a substrate, a controller chip, a LCOS chip, a glass and a liquid crystal layer. The controller chip is positioned on the upper surface of the substrate and electrically connected to the substrate. The LCOS chip is positioned on the controller chip and electrically connected to the substrate. The glass is positioned on the LCOS chip and the liquid crystal layer is disposed between the LCOS chip and glass. | 02-16-2012 |
20080304245 | SEMICONDUCTOR PACKAGE AND METHOD FOR DISCHARGING ELECTRONIC DEVICES ON A SUBSTRATE - A method for discharging an electronic device on a substrate is provided. A metal pin mounted on a wire bonder is used to touch with a specific finger disposed on the substrate which is in electrical connection with the electronic device. As a result, the electric charge previously stored in the electronic device will be conducted to the wire bonder through the specific finger and metal pin thereby discharging the stored charge. Another method for discharging an electronic device on a substrate is also provided. A metal wire protruding out from the capillary of a wire bonder is heated to form a metal ball at the capillary. The capillary is moved to bring the metal ball into contact with the specific finger. As a result, the electric charge previously stored in the electronic device will thus can be discharged to the wire bonder. The present invention further provides a semiconductor package. | 12-11-2008 |