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Orbit Semicon LTD.
| Orbit Semicon LTD. Patent applications | ||
| Patent application number | Title | Published |
|---|---|---|
| 20110241026 | LIGHT-EMITTING DIODE CHIP AND PACKAGE STRUCTURE THEREOF - A light-emitting diode chip includes a first electrode and a metal composite layer. The metal composite layer is disposed on the first electrode and has a nickel layer. Since the metal composite layer is disposed on the first electrode, the yield of the wedge bonding can be increased, and the chip damage can be avoided. | 10-06-2011 |