Orbit Semicon LTD.
|Orbit Semicon LTD. Patent applications|
|Patent application number||Title||Published|
|20110241026||LIGHT-EMITTING DIODE CHIP AND PACKAGE STRUCTURE THEREOF - A light-emitting diode chip includes a first electrode and a metal composite layer. The metal composite layer is disposed on the first electrode and has a nickel layer. Since the metal composite layer is disposed on the first electrode, the yield of the wedge bonding can be increased, and the chip damage can be avoided.||10-06-2011|