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OPULENT ELECTRONICS INTERNATIONAL PTE LTD

OPULENT ELECTRONICS INTERNATIONAL PTE LTD Patent applications
Patent application number	Title	Published
20100307800	Anodised Aluminum, Dielectric, and Method - The invention provides an anodised aluminium product for use in a metal core printed circuit board which in which the anodised layer forms a dielectric, and the resultant metal core printed circuit board has a sandwich structure having a thermal conductivity higher than and a thermal resistance lower than conventional metal core printed circuit boards using alternative dielectric layers, and with improved electrical insulation properties. The invention has application in manufacture of rigid and flexible printed circuit boards which have a metal substrate, manufacture of a heat conductive substrate for semiconductor devices, and electronic devices. While the use of the invention is described in relation to metal core printed circuit boards, the anodising process and anodised aluminium of the invention may have other applications beyond this technology. The invention also provides a method of manufacturing such an anodised aluminium product.	12-09-2010
20100285725	METHOD OF DEPTH ROUTING AN ELECTRONIC LAYUP AND APPARATUS FOR EFFECTING SUCH A METHOD - A method of depth routing an electronic layup comprised of a dielectric sandwiched between a metal layer and a metal substrate which is then laminated. The method involves first positioning a hardened mask so that the mask is interposed between the metal layer and at least one nozzle of a sandblasting machine, the mask having at least one aperture provided therein. Thereafter, the electronic layup is sandblasted through the at least one aperture by way of the sandblasting machine. The force, size and type of abrasive applied by the sandblasting machine are sufficient to erode the metal layer and the dielectric but not the substrate.	11-11-2010