| OPTROMAX ELECTRONICS CO., LTD Patent applications |
| Patent application number | Title | Published |
|---|
| 20120025346 | FABRICATING PROCESS OF CIRCUIT SUBSTRATE AND CIRCUIT SUBSTRATE STRUCTURE - A fabricating process of circuit substrate sequently includes: providing a substrate with a pad and a dielectric stack layer disposed at the substrate and overlaying the pad, in which the stack layer includes two dielectric layers and a third dielectric layer located between the two dielectric layers, and the etching rate of the third dielectric layer is greater than the etching rate of the two dielectric layers; forming an opening corresponding to the pad at the stack layer; performing a wet etching process on the stack layer to remove the portion of the third dielectric layer surrounding the opening to form a gap between the portions of the two dielectric layers surrounding the opening; performing a plating process on the stack layer and the pad to respectively form two plating layers at the stack layer and the pad, in which the gap isolates the two plating layers from each other. | 02-02-2012 |
| 20110080101 | ELECTRONIC DEVICE - An electronic device is provided. The electronic device includes a plurality of load units, a plurality of serial-parallel switch units and a control module. The control module switches the serial-parallel switch units to a first state or a second state according to a level variation of an input voltage. Connection relations of the load units are correspondingly changed according to the level variation of the input voltage. In this way, the electronic device can be driven by an alternating-current voltage. | 04-07-2011 |
