| OPTOPAC CO., LTD. Patent applications |
| Patent application number | Title | Published |
|---|
| 20110260275 | ELECTRONIC DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME - Provided are an electronic device package and a method of manufacturing the same. The electronic device package includes an electronic device including a polymer layer and a passivation layer configured to protect a device layer, a substrate assembly facing the electronic device, and a sealing ring formed in a closed loop between the electronic device and the substrate assembly and surrounding a sealing region. At least one side surface of the sealing ring contacts the polymer layer, and the sealing ring is disposed on the passivation layer. A polymer layer such as a microlens and a color filter is removed from a region provided with a sealing ring to form the sealing ring on a passivation layer, thereby making the sealing ring and joints the same height, thus preventing an electrical defect. | 10-27-2011 |
| 20110193231 | ELECTRONIC DEVICE PACKAGE AND METHOD FOR FABRICATING THE SAME - An electronic device package includes a substrate assembly, an electronic device disposed to face the substrate assembly, and a sealing ring or rings including a sealing layer and a bonding layer that is disposed between the substrate assembly and the electronic device, wherein the sealing ring(s) has a closed loop shape surrounding a sealing region of the electronic device, and the bonding layer is formed through a reaction of the sealing layer and sealing layer pad with a low-melting-point material layer whose melting point is lower than that of the sealing layer and sealing ring pad. The bonding layer is formed of an intermetallic compound of the sealing layer, sealing ring pad and low-melting-point material that melts at a temperature greater than the melting temperature of the low-melting-point material. The device package also includes electrical connections in the form of joints between the substrate assembly and electronic device. | 08-11-2011 |
| 20100289104 | PHOTOSENSOR PACKAGE - A photosensor package includes a substrate assembly, a photosensor chip mounted at the substrate assembly, a solder ball to electrically connect the photosensor chip, the substrate assembly and a printed circuit board, and a passive device mounted at the substrate assembly. | 11-18-2010 |
| 20100237498 | PACKAGE FOR SEMICONDUCTOR DEVICE AND PACKAGING METHOD THEREOF - A semiconductor device package and a method thereof are able to reliably package a semiconductor device on a substrate without using flux. The semiconductor device package includes a semiconductor device and a substrate reciprocally disposed with respect to the semiconductor device, wherein the substrate includes a side reciprocal to the semiconductor device on which there are formed a plurality of prominences surrounding an accommodation region where the semiconductor device is to be disposed. The method of packaging a semiconductor device includes preparing the semiconductor device, preparing a substrate, forming a plurality of prominences to surround an accommodation region on the substrate where the semiconductor device is to be disposed, dropping the semiconductor device within the accommodation region, and packaging the semiconductor device on the substrate. | 09-23-2010 |
| 20100141825 | IMAGE SENSOR CAMERA MODULE AND METHOD OF MANUFACTURING THE SAME - The present invention relates to an image sensor camera module and a method of manufacturing the same. An image sensor camera module according to the present invention includes a lens; a lens housing having the lens mounted thereto; an image sensor package adhering to a portion of an inside of the lens housing; and a protruding portion for maintaining a gap between the lens and the image sensor package, wherein the image sensor package adheres to the lens housing at an outside of the protruding portion. According to the present invention, since a lens barrel is not used and a focus adjusting process is not performed, the process simplification and automation process can be achieved, thereby saving a manufacturing cost and obtaining uniform focus quality. Further, it is possible to prevent an image defect from being generated by foreign substances, thereby improving a yield. | 06-10-2010 |
| 20080224721 | APPARATUS, UNIT AND METHOD FOR TESTING IMAGE SENSOR PACKAGES - The present invention relates to an apparatus, unit and method for testing image sensor packages, which can automatically test whether the image sensor packages are defective before they are assembled into camera modules. An apparatus for testing image sensor packages according to the present invention comprises a seating unit on which image sensor packages are seated for tests; a testing section having a lens and a light source above the image sensor packages to perform an open and short test and an image test for the image sensor packages; and a controlling and processing unit having a tester module for performing the open and short test and the image test for the image sensor packages. A method for testing image sensor packages according to the present invention comprises the steps of connecting the image sensor packages to a tester module for performing tests for checking whether the image sensor packages are defective; and carrying out an open and short test and an image test for the image sensor packages while irradiating light on the image sensor packages through a lens or blocking the light. | 09-18-2008 |
