OptiZ, Inc. Patent applications |
Patent application number | Title | Published |
20150189204 | Semiconductor Device On Cover Substrate And Method Of Making Same - A sensor device comprising a sensor die, a second substrate and a conductor assembly. The sensor die includes a first substrate having front and back surfaces, a sensor disposed in or at the front surface, bond pads disposed in or at the front surface and electrically coupled to the sensor, and a plurality of openings each extending from the back surface to one of the bond pads. The second substrate has top and bottom surfaces, wherein the bottom surface of the second substrate is mounted to the front surface of the first substrate. The conductor assembly is electrically coupled to at least some of the bond pads through at least some of the openings. | 07-02-2015 |
20140264693 | Cover-Free Sensor Module And Method Of Making Same - A sensor package includes host substrate assembly includes a first substrate, circuit layers in the first substrate, and first contact pads electrically coupled to the circuit layers. A sensor chip includes a second substrate with opposing first and second surfaces, sensor(s) formed on or under the first surface of the second substrate, a plurality of second contact pads formed at the first surface of the second substrate and which are electrically coupled to the sensor(s), a plurality of holes each formed into the second surface of the second substrate and extends through the second substrate to one of the second contact pads, and conductive leads each extending from one of the second contact pads, through one of the plurality of holes, and along the second surface of the second substrate. A plurality of electrical connectors each electrically connect one of the first contact pads and one of the conductive leads. | 09-18-2014 |
20140264692 | Low Profile Sensor Module And Method Of Making Same - A host substrate assembly includes a first substrate with opposing first and second surfaces, an aperture extending therethrough, circuit layers, and first contact pads electrically coupled to the circuit layers. A sensor chip includes a second substrate with opposing first and second surfaces, a plurality of photo detectors formed on or in the second substrate and configured to receive light incident on the second substrate first surface, and a plurality of second contact pads formed at the second substrate first or second surfaces and are electrically coupled to the photo detectors. A spacer is mounted to the second substrate first surface. A protective substrate is mounted to the spacer and disposed over the photo detectors. Electrically conductive conduits each extend through the spacer and are in electrical contact with one of the second contact pads. Electrical connectors electrically connect the first contact pads and the conduits. | 09-18-2014 |
20140264691 | Low Profile Image Sensor - A sensor package comprising a host substrate with opposing first and second surfaces, an aperture extending therethrough, circuit layers, and first contact pads. A second substrate at least partially in the aperture has opposing first and second surfaces, a plurality of photo detectors, second contact pads at the second substrate first surface and electrically coupled to the photo detectors, and trenches formed into the second substrate first surface, conductive traces extending from the second contact pads and into the trenches. A third substrate has a first surface mounted to the first surface of the second substrate. The third substrate includes a cavity formed into its first surface and positioned over the photo detectors. Electrical connectors connect the first contact pads and conductive traces. A lens module is mounted to the host substrate for focusing light through the third substrate and onto the photo detectors. | 09-18-2014 |
20140248736 | Method Of Forming A Low Profile Image Sensor Package - An image sensor package, and method of making same, that includes a printed circuit board having a first substrate with an aperture extending therethrough, one or more circuit layers, and a plurality of first contact pads electrically coupled to the one or more circuit layers. A sensor chip mounted to the printed circuit board and disposed at least partially in the aperture. The sensor chip includes a second substrate, a plurality of photo detectors formed on or in the second substrate, and a plurality of second contact pads formed at the surface of the second substrate which are electrically coupled to the photo detectors. Electrical connectors each electrically connect one of the first contact pads and one of the second contact pads. A lens module is mounted to the printed circuit board and has one or more lenses disposed for focusing light onto the photo detectors. | 09-04-2014 |
20140065755 | Method Of Making A Low Stress Cavity Package For Back Side Illuminated Image Sensor - An image sensor package includes an image sensor chip and crystalline handler. The image sensor chip includes a substrate, and a plurality of photo detectors and contact pads at the front surface of the substrate. The crystalline handler includes opposing first and second surfaces, and a cavity formed into the first surface. A compliant dielectric material is disposed in the cavity. The image sensor front surface is attached to the crystalline substrate handler second surface. A plurality of electrical interconnects each include a hole aligned with one of the contact pads, with a first portion extending from the second surface to the cavity and a second portion extending through the compliant dielectric material, a layer of insulation material formed along a sidewall of the first portion of the hole, and conductive material extending through the first and second portions of the hole and electrically coupled to the one contact pad. | 03-06-2014 |
20140004664 | Method Of Making 3D Integration Microelectronic Assembly For Integrated Circuit Devices | 01-02-2014 |
20140004647 | Method Of Forming 3D Integrated Microelectronic Assembly With Stress Reducing Interconnects | 01-02-2014 |
20140004646 | Method Of Making 3D Integration Microelectronic Assembly For Integrated Circuit Devices | 01-02-2014 |