| ONAMBA CO., LTD. Patent applications |
| Patent application number | Title | Published |
|---|
| 20110133764 | APPARATUS AND METHOD FOR DETECTING ABNORMALITY IN SOLAR CELL POWER GENERATION SYSTEM - The present invention provides an apparatus for easily detecting an abnormal status of power generation of a solar cell panel in a solar cell power generation system having the power generation of 1 MW or higher. | 06-09-2011 |
| 20100170716 | TERMINAL PLATE CIRCUIT USING A PRESSING MEMBER - The present invention provides a terminal plate circuit in which the reliability of an electrical connection state between a terminal plate and a rectangular wire is enhanced by a simple method. The present invention is a terminal plate circuit including a terminal plate, a rectangular wire, and a pressing member, characterized in that a hole through which the rectangular wire penetrates is provided in the terminal plate; the rectangular wire is inserted into this hole so as to establish an electrical contact between the terminal plate and the rectangular wire; and the contact state is maintained by a pressing force of the pressing member to the part of the surface of the rectangular wire on the side opposite to the part of the surface of the rectangular wire that is in contact with the terminal plate, and that the pressing member has a sandwiching part that can sandwich the end of the terminal plate, and the pressing force of the pressing member to the rectangular wire is generated by sandwiching the end of the terminal plate with this sandwiching part. Preferably, soldering or welding is carried out so as to cover a part at which the terminal plate and the rectangular wire are in electrical contact with each other. | 07-08-2010 |
| 20100110639 | TERMINAL PLATE CIRCUIT - In a terminal plate circuit in which the bottom surface of the diode is attached to the surface of the terminal plate with solder so as to dissipate the heat of the diode, heat transfer from the diode to the terminal plate is facilitated by removing the air bubbles in the solder during the soldering. A terminal plate circuit configured in such a manner that a metal part of a bottom surface of a diode of surface mounting type is soldered onto a surface of a terminal plate that is larger than the metal part, characterized in that streaks consisting of a plurality of lines that do not intersect with each other are formed on the surface of the terminal plate onto which the diode is to be soldered, whereby air bubbles generated within the solder during the soldering are let to escape from a lower surface of the diode to outside through the streaks. This terminal plate circuit is suitable for the use in a terminal box for solar cell panel. | 05-06-2010 |
| 20100084183 | TWIN-CHIP-MOUNTING TYPE DIODE - The present invention provides a diode that does not deteriorate its function even if it is used in an environment where the temperature change is considerable, such as in a terminal box for solar cell panel that is placed outdoors. A diode of twin-chip-mounting type in which each chip has a lead foot for being joined to a common terminal plate, wherein said lead feet are electrically connected with each other in a region of each lead foot from each chip to a portion wherein each lead foot is joined. The electrical connection of the lead feet is preferably formed by integral molding with each lead foot. | 04-08-2010 |
