| Okuno Chemical Industries Co., Ltd. Patent applications |
| Patent application number | Title | Published |
|---|
| 20110064889 | METHOD FOR PRODUCTION OF ELECTROLESS PLATING MATERIAL - A production method of an electroless plating material of the present invention is a method for the production of an electroless plating material that has a surface to be plated by electroless plating, and includes an ozone treatment step in which a material body that is made of a resin is brought into contact with a solution that contains ozone to form a modified layer in a surface of the material body, and a superficial layer removal step in which, after the ozone treatment step, the surface of the material body is irradiated with ultraviolet rays to remove a superficial layer of the modified layer. | 03-17-2011 |
| 20100155255 | PRETREATMENT PROCESS FOR ELECTROLESS PLATING OF RESIN MOLDED BODY, METHOD FOR PLATING RESIN MOLDED BODY, AND PRETREATMENT AGENT - The present invention provides a pretreatment process for electroless plating of a resin molded article, comprising etching the resin molded article using a manganate salt-containing etching solution, and then bringing the resin molded article into contact with an aqueous solution containing a reducing compound and an inorganic acid; and a plating process of a resin molded article comprising the pretreatment process. Further, the present invention provides various treatment agents for use in the plating process. According to the present invention, a plating layer with sufficient adhesion can be formed when an etching treatment is performed using a manganate salt-containing etching solution in an electroless plating treatment of a resin molded article. | 06-24-2010 |
| 20090092757 | COMPOSITION FOR ETCHING TREATMENT OF RESIN MOLDED ARTICLE - The present invention provides a composition for the etching treatment of a resin molded article. The composition is composed of an aqueous solution containing 20 to 1,200 g/l of an inorganic acid, 0.01 to 10 g/l of a manganese salt, and 1 to 200 g/l of at least one component selected from the group consisting of halogen oxoacids, halogen oxoacid salts, persulfate salts, and bismuthate salts. | 04-09-2009 |
