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OCTEC INC.

Tokyo, JP

OCTEC INC. Patent applications
Patent application numberTitlePublished
20100032357CHROMATOGRAPHY COLUMN AND MANUFACTURING METHOD OF THE SAME - A high separation efficiency column 02-11-2010
20090285998PLASMA PROCESSING APPARATUS, ELECTRODE PLATE FOR PLASMA PROCESSING APPARATUS, AND ELECTRODE PLATE MANUFACTURING METHOD - A plasma processing apparatus for performing a plasma process on a target substrate includes a process container configured to accommodate the target substrate and to reduce pressure therein. A first electrode is disposed within the process container. A supply system is configured to supply a process gas into the process container. An electric field formation system is configured to form an RF electric field within the process container so as to generate plasma of the process gas. A number of protrusions are discretely disposed on a main surface of the first electrode and protrude toward a space where the plasma is generated.11-19-2009
20090120677WIRING SUBSTRATE AND ASSOCIATED MANUFACTURING METHOD - A wiring substrate for mounting electronic parts and a method for manufacturing the same are provided. The wiring substrate includes a substrate that includes a first surface, a second surface and a plurality of through-holes that extend through the substrate from the first surface to the second surface so as to define a plurality of inner walls respectively. The wiring substrate further includes an external conductor that is formed on at least one of the first surface or the second surface of the substrate. A through-hole conductor is formed on one of the plurality of inner walls so as to define a through-hole conductor space and so as to be electrically connected to the external conductor. Also included is a conductive post with first and second post ends, the first post end being positioned in the through-hole conductor space such that the first post end is in contact with and is electrically connected to the through-hole conductor, and the second post end projects out of the conductor space.05-14-2009

Patent applications by OCTEC INC.