OCLARO JAPAN, INC.
|OCLARO JAPAN, INC. Patent applications|
|Patent application number||Title||Published|
|20130315531||OPTICAL SEMICONDUCTOR AND OPTICAL MODULE - Provided are an optical semiconductor which includes a pyroelectric first substrate having an optical waveguide formed in a surface thereof and a second substrate connected to the first substrate via an insulating adhesive layer and which inhibits a pyroelectric effect caused therein, and an optical module. The optical semiconductor includes: a first substrate which has an electro-optic effect and is pyroelectric, the first substrate having an optical waveguide formed in an upper surface thereof; a second substrate connected the first substrate via an insulating adhesive layer; a first conductive film formed on a lower surface of the first substrate; and a second conductive film formed on at least one side surface of the first substrate and the second substrate, in which the first conductive film is electrically connected to the second conductive film.||11-28-2013|
|20130209021||OPTICAL SEMICONDUCTOR MODULATOR DEVICE AND OPTICAL MODULE - In an optical semiconductor device related to the present invention, a first light source outputting light having a first polarization, a second light source outputting light having a second polarization, a first optical modulator being optically connected to an output side of the first light source and modulating the light that is output from the first light source to output a light signal, a second optical modulator being optically connected to an output side of the second light source and modulating the light that is output from the second light source to output a light signal, and an optical multiplexer coupling the light signal that is output from the first optical modulator with the light signal that is output from the second optical modulator to output a coupled light signal, are integrated on a semiconductor substrate together.||08-15-2013|
|20130208751||OPTICAL SEMICONDUCTOR DEVICE - In a BH laser which uses InGaAlAs-MQW in an active layer, Al-based semiconductor multi-layer films including an InP buffer layer and an InGaAlAs-MQW layer, and an InGaAsP etching stop layer are formed in a mesa shape, and a p type InP burial layer is buried in side walls of the mesa shape. An air ridge mesa-stripe of a lateral center that is substantially the same as that of the mesa shape is formed on the mesa shape. According to the present structure, a leakage current can be considerably reduced, the light confinement coefficient can be made to be larger than in a BH laser in the related art, and thereby it is possible to implement a semiconductor laser with a low leakage current and a high relaxation oscillation frequency.||08-15-2013|
|20130182735||SEMICONDUCTOR LASER - An aluminium gallium indium phosphide (AlGaInP)-based semiconductor laser device is provided. On a main surface of a semiconductor substrate formed of n-type GaAs (gallium arsenide), from the bottom layer, an n-type buffer layer, an n-type cladding layer formed of an AlGaInP-based semiconductor containing silicon (Si) as a dopant, an active layer, a p-type cladding layer formed of an AlGaInP-based semiconductor containing magnesium (Mg) or zinc (Zn) as a dopant, an etching stopper layer, and a p-type contact layer are formed. Here, when an Al composition ratio x of the AlGaInP-based semiconductor is taken as a composition ratio of Al and Ga defined as (Al||07-18-2013|
|20130163996||Printed Circuit Board and Optical Transmission Device - A printed circuit board includes a substrate, a signal output circuit formed on the substrate for outputting a clock signal, a shield for covering the signal output circuit, a power supply wiring for connecting the signal output circuit and a power source, and a trap filter provided to the power supply wiring and provided inside the shield, for attenuating a frequency component corresponding to a frequency of clock signal. The trap filter includes a resonance circuit having one portion of the power supply wiring, an inner-layer wiring of the substrate located below the one portion of the power supply wiring, an inner-layer ground wiring of the substrate located below the inner-layer wiring, and a via hole for connecting the one portion of the power supply wiring and the inner-layer wiring.||06-27-2013|
|20130161497||OPTICAL MODULE - An optical module includes a light-receiving element configured to convert an incident optical signal to an electric signal. The light-receiving element includes a mesa part configured to laminate at least a first semiconductor layer, a light absorption semiconductor layer that absorbs an optical signal entering from a light reception surface, and a second semiconductor layer. The light-receiving element also includes an electrode part disposed on a top of the mesa part and a wiring part that covers a part of a side surface of the mesa part. The optical module includes a lens configured to condense an optical signal from an optical fiber onto the light reception surface. The wiring part is disposed at a position based on an intensity distribution of the optical signal on the light reception surface.||06-27-2013|
|20130147002||RECEIVER MODULE AND DEVICE - Provided is a receiver module, including: a semiconductor light receiving element including an electrode; and a sub-mount including: an electrical wiring joined to the electrode with solder; and a trap region arranged around a joining surface of the electrical wiring, the trap region retaining solder by solder wetting.||06-13-2013|
|20130077920||OPTICAL MODULE AND CAGE - An optical module includes an electromagnetic wave absorption member. The electric connection member includes a floating portion which is in a floating state spaced apart from the housing and at a position away from a mounting portion by which the electric connection member is mounted on the housing in the direction opposite to the direction that the optical module is inserted into a cage. At least a portion of the electromagnetic wave absorption member is arranged between the housing and the floating portion. The floating portion is brought into contact with an inner side of the cage so as to establish the electrical connection with the inner side of the cage when the housing is inserted into the cage.||03-28-2013|
|20130051725||OPTICAL DEVICE, OPTICAL MODULE, AND METHOD FOR MANUFACTURING OPTICAL DEVICE - An optical device includes a substrate and a first optical waveguide including a mesa. The mesa includes a first lower clad layer portion, a first core layer portion, and a first upper clad layer portion. The first lower clad layer portion, the first core layer portion, and the first upper clad layer portion are disposed in this order from the substrate side. The optical device also includes a first etch stop layer configured to stop etching when the first optical waveguide is formed. The first etch stop layer being laminated over the substrate. The first optical waveguide is laminated on the first etch stop layer.||02-28-2013|
Patent applications by OCLARO JAPAN, INC.