Inventors list |
Assignees list |
Classification tree browser |
Top 100 Inventors |
Top 100 Assignees |
OCCAM PORTFOLIO LLC
| OCCAM PORTFOLIO LLC Patent applications | ||
| Patent application number | Title | Published |
|---|---|---|
| 20120211265 | FLEXIBLE CIRCUIT ASSEMBLY WITHOUT SOLDER - The present invention provides an electronic assembly. The assembly uses no solder. Components or component packages with I/O leads are mounted on a flexible substrate and encapsulated with an electrically insulating material. Vias connect through the substrate to the components' leads. | 08-23-2012 |
| 20120077293 | Light-Emitting Diode Package Assembly - An electrical device containing multiple light emitting diode (LED) dies each having respective first and second connectors suitable to receive current through the LED die. A common base layer of a first electrically conductive material has cavities into which at least one LED die is mounted with its second connector electrically connected by a conductive bonding material to the first conductive material of the base layer. One or more over-layer sections of a second electrically conductive material each are electrically connected by a bond to at least one of the first connector of a LED die. And an insulator electrically separates the first conductive material of the base layer from the second conductive material of over-layer sections. | 03-29-2012 |
| 20120006589 | Electronic Assemblies Without Solder and Methods for their Manufacture - The present invention provides an electronic assembly | 01-12-2012 |
| 20110315302 | Occam Process for Components Having Variations in Part Dimensions - An Occam process (solderless manufacturing) that employs a component support fixture that provides permanent or temporary support for components during subsequent processing in a solderless process for electrically connecting the components to circuits. The component support fixture provides oversized compartments for housing the components which may have varying sizes. The compartments are provided with vent holes or apertures for venting air or excess glue as the component support is pressed against the components during manufacture. | 12-29-2011 |
| 20110199740 | Monolithic Molded Flexible Electronic Assemblies Without Solder and Methods for their Manufacture | 08-18-2011 |
| 20110182042 | Electronic Assemblies without Solder and Methods for their Manufacture - An electronic assembly | 07-28-2011 |
| 20110127080 | Electronic Assemblies without Solder and Methods for their Manufacture - The present invention provides an electronic assembly | 06-02-2011 |
| 20100096166 | Flexible Circuit Assemblies without Solder and Methods for their Manufacture - The present invention provides an electronic assembly | 04-22-2010 |
| 20090278139 | LIGHT-EMITTING DIODE PACKAGE ASSEMBLY - An electrical device containing multiple light emitting diode (LED) dies each having respective first and second connectors suitable to receive current through the LED die. A common base layer of a first electrically conductive material has cavities into which at least one LED die is mounted with its second connector electrically connected by a conductive bonding material to the first conductive material of the base layer. One or more over-layer sections of a second electrically conductive material each are electrically connected by a bond to at least one of the first connector of a LED die. And an insulator electrically separates the first conductive material of the base layer from the second conductive material of over-layer sections. | 11-12-2009 |
| 20090277677 | Electronic Assemblies without Solder and Method for their Design, Prototyping, and Manufacture - A system for prototyping electrical circuits, as well as creating production circuits, without using solder. Stand-in electrical components | 11-12-2009 |
| 20090237901 | Monolithic Molded Flexible Electronic Assemblies Without Solder and Methods for their Manufacture | 09-24-2009 |
| 20090056997 | Electronic Assemblies Without Solder and Methods for their Manufacture | 03-05-2009 |
| 20090041977 | System for the Manufacture of Electronic Assemblies Without Solder - The present invention provides an electronic assembly | 02-12-2009 |
| 20090035454 | Assembly of Encapsulated Electronic Components to a Printed Circuit Board - Electrical components | 02-05-2009 |
| 20090034219 | Electronic Assemblies Without Solder Having Overlapping Components - An apparatus is disclosed that improves density of electrical components in a circuit assembly. Electrical components | 02-05-2009 |
| 20090017264 | ELECTRONIC ASSEMBLIES WITHOUT SOLDER AND METHODS FOR THEIR MANUFACTURE - A method for producing an assembly of electronic components and assemblies in accord with this, wherein the electronic components have component terminals. A conductive firmament having a first side and a second side is provided. Then the component terminals are connected to the first side of the firmament with an anisotropic conductor. A pattern is applied to the second side of said firmament. And portions of the firmament are removed based on the pattern, such that remaining portions of said firmament form the electrical circuit interconnecting the component terminals. | 01-15-2009 |
| 20090008140 | Electronic Assemblies Without Solder and Methods for their Manufacture - An electronic assembly | 01-08-2009 |
| 20080297985 | Electronic Assemblies Without Solder and Methods for their Manufacture - The present invention provides an electronic assembly | 12-04-2008 |
| 20080277675 | LIGHT-EMITTING DIODE ASSEMBLY WITHOUT SOLDER - An electrical device in the form of a light emitting diode (LED) assembly. A plurality of LEDs are provided, wherein each has an anode and a cathode. A base holds this plurality of LEDs in a substantially fixed relationship. One or more anode conductors then each connect electrically to one or more of the LED anodes in a manner characterized by not including any solder material. Similarly, one or more cathode conductors each connect electrically to one or more of the LED cathodes in a manner characterized by not including any solder material. | 11-13-2008 |
| 20080277151 | Electronic Assemblies without Solder and Methods for their Manufacture - The present invention provides an electronic assembly | 11-13-2008 |