| OC OERLIKON BALZERS AG Patent applications |
| Patent application number | Title | Published |
|---|
| 20120031749 | REACTIVE SPUTTERING WITH MULTIPLE SPUTTER SOURCES - The apparatus ( | 02-09-2012 |
| 20120009730 | METHOD OF INLINE MANUFACTURING A SOLAR CELL PANEL - Throughput of manufacturing thin-film solar panels by inline technique is made substantially independent from the time extent of different surface treatment steps by accordingly subdividing treatment steps in sub-steps performed in inline subsequent treatment stations. Treatment duration in each of the subsequent treatment stations is equal (τ). | 01-12-2012 |
| 20120003064 | VACUUM TREATMENT APPARATUS - A transport arrangement ( | 01-05-2012 |
| 20110203920 | TARGET SHAPING - A target for a physical vapor deposition system includes a top, a bottom, and a base. The base essentially is defined by the surface of the target to be sputtered. A first, inner ring and a second, outer ring extend from the base. Each ring has an inner side and an outer side, wherein sputtering is concentrated on the outer sides by means of a magnet arrangement adjacent to the target. | 08-25-2011 |
| 20110192715 | MAGNETRON SOURCE AND METHOD OF MANUFACTURING - A magnetron source comprises a target ( | 08-11-2011 |
| 20110186421 | TARGET ASSEMBLY FOR A MAGNETRON SPUTTERING APPARATUS, A MAGNETRON SPUTTERING APPARATUS AND A METHOD OF USING THE MAGNETRON SPUTTERING APPARATUS - To provide, in a magnetron sputtering apparatus for coating a substrate with a material of high magnetic permeability, for a sufficient trapping field of at least 24 kA/m (300 Oe) field strength above a target surface a target assembly consists of target plates ( | 08-04-2011 |
| 20110177649 | PROCESS FOR THE DEPOSITION OF AN ANTI-REFLECTION FILM ON A SUBSTRATE - A method for the deposition of an anti-reflection film on a substrate is disclosed. A substrate including a plurality of solar cell structures is provided and placed in a vacuum chamber with a target including silicon. A flow of a nitrogen-containing reactive gas into the vacuum chamber is set to a first value while a voltage between the target and ground is switched off and then increased to a second value. A voltage is applied between the target and ground, whereby a film of silicon and nitrogen is deposited on the substrate in a flow of the nitrogen-containing reactive gas which is higher than the first value. | 07-21-2011 |
| 20110117702 | APPARATUS AND METHOD FOR PROCESSING A SUBSTRATE - A method of processing a substrate that displays out-gassing when placed in a vacuum comprises placing the substrate in a vacuum and performing an out-gassing treatment by heating the substrate to a temperature T | 05-19-2011 |
| 20100155238 | RF SPUTTERING ARRANGEMENT - Apparatus for sputtering comprises a vacuum chamber, at least one first electrode having a first surface arranged in the vacuum chamber, a counter electrode having a surface arranged in the vacuum chamber and a RF generator. The RF generator is configured to apply a RF electric field across the at least one first electrode and the counter electrode so as to ignite a plasma between the first electrode and the counter electrode. The counter electrode comprises at least two cavities in communication with the vacuum chamber. the cavities each have dimensions such that a plasma can be formed in the cavity. | 06-24-2010 |
| 20100126853 | RF SPUTTERING ARRANGEMENT - Apparatus for sputtering comprises a vacuum chamber defined by at least one side wall, a base and a cover, at least one first electrode having a surface arranged in the vacuum chamber, a counter electrode having a surface arranged in the vacuum chamber and a RF generator. The RF generator is configured to apply a RF electric field across the at least one first electrode and the counter electrode so as to ignite a plasma between the first electrode and the counter electrode. The counter electrode comprises at least a portion of the side wall and/or the base of the vacuum chamber and an additional electrically conductive member. The additional electrically conductive member comprises at least two surfaces arranged generally parallel to one another and spaced at a distance from one another. | 05-27-2010 |
| 20090263966 | APPARATUS FOR SPUTTERING AND A METHOD OF FABRICATING A METALLIZATION STRUCTURE - A method of depositing a metallization structure ( | 10-22-2009 |
| 20090252892 | PROCESSING CHAMBER - A process apparatus for treatment of a substrate comprising a load chamber for loading the substrate, a process chamber for processing the substrate, a sealing plane separating the process chamber from the load chamber and means for vertically moving the substrate from the load chamber to the process chamber, and a method for treating the substrate are provided. The load chamber is located in one of the lower and upper portions of the process apparatus, and the process chamber is located in the other of the lower and upper portions of the process apparatus. The process apparatus and method of the present invention will provide easy maintenance and reduced costs by reducing the number of movements for loading the substrate. | 10-08-2009 |
| 20090173622 | REACTIVE SPUTTERING WITH HIPIMS - A method and apparatus for sputter depositing an insulation layer onto a surface of a cavity formed in a substrate and having a high aspect ratio is provided. A target formed at least in part from a material to be included in the insulation layer and the substrate are provided in a substantially enclosed chamber defined by a housing. A plasma is ignited within the substantially enclosed chamber and a magnetic field is provided adjacent to a surface of the target to at least partially contain the plasma adjacent to the surface of the target. A voltage is rapidly increased to repeatedly establish high-power electric pulses between a cathode and an anode. An average power of the electric pulses is at least 0.1 kW, and can optionally be much greater. An operational parameter of the sputter deposition is controlled to promote sputter depositing of the insulation layer in a transition mode between a metallic mode and a reactive mode. | 07-09-2009 |
| 20090173621 | METHOD OF MAGNETRON SPUTTERING AND A METHOD FOR DETERMINING A POWER MODULATION COMPENSATION FUNCTION FOR A POWER SUPPLY APPLIED TO A MAGNETRON SPUTTERING SOURCE - A method of magnetron sputtering, comprises rotating a magnet of a magnetron with an angular frequency ω, and, during sputtering of material from a source of the magnetron onto a substrate, periodically modulating a power level applied to the source with at least a component comprising a frequency f which is a harmonic of the angular frequency ω of rotation of the magnet other than the first harmonic. | 07-09-2009 |
| 20090122273 | COLOR WHEEL FABRICATION - A pressure sensitive adhesive (PSA) is used to attach a plurality of wedge-shaped glass filter segments on a first side to a hub during the color ring build portion of the color wheel fabrication process. A strong adhesive, such as epoxy, is then used to adhere a second side of the filter segments directly to a turning surface of a motor, completing the color wheel fabrication. The epoxy is cured if necessary. The pressure sensitive adhesive can temporarily align the plurality of color filter segments in an alignment. The adhesive between the filter segments and the turning surface can then permanently bond the color filter segments in the alignment. | 05-14-2009 |
| 20090111216 | APPLICATION OF HIPIMS TO THROUGH SILICON VIA METALLIZATION IN THREE-DIMENSIONAL WAFER PACKAGING - A method of magnetically enhanced sputtering an electrically-conductive material onto interior surfaces of a trench described herein includes providing a magnetic field adjacent to a target formed at least in part from the electrically-conductive material, and applying a DC voltage between an anode and the target as a plurality of pulses. A high-frequency signal is applied to the pedestal supporting the semiconductor substrate to generate a self-bias field adjacent to the semiconductor substrate. The high-frequency signal is applied to the pedestal in pulses, during periods of time that overlap with the periods during which the DC voltage pulses are applied. The periods of time that the high-frequency signals are applied include a duration that extends beyond termination of the DC voltage pulse applied between the anode and the target. During each DC voltage pulse the electrically-conductive material is sputter deposited onto the side walls of the trench formed in the semiconductor substrate. | 04-30-2009 |
| 20090106968 | METHOD FOR MANUFACTURING WORKPIECES AND APPARATUS - For vacuum treatment of workpieces by a multitude of distinct processing stations (P | 04-30-2009 |
| 20090087998 | DIFFUSION BARRIER LAYER AND METHOD FOR MANUFACTURING A DIFFUSION BARRIER LAYER - A diffusion barrier system for a display device comprising a layer system with at least two layers of dielectric material, wherein at least two adjacent layers of that layer system comprise the same material. A respective method for manufacturing such a diffusion barrier system in a single process chamber of a plasma deposition system has the steps of introducing a substrate to be treated in said process chamber, discretely varying in a controlled manner during deposition at least one process parameter in the process chamber, without completely interrupting such process parameter, which results in layers with different properties and finally unloading said substrate from said process. | 04-02-2009 |
| 20090059975 | LASER MODULE FOR PROJECTION DISPLAYS - A laser module with a linear laser diode array includes multiple, mutually separated laser cells. A nonlinear optical material serves to double the frequency of the radiation emitted by the laser cells. The linear laser diode array and the nonlinear optical material are so positioned relative to each other that the resulting frequency-doubled radiation propagates, within the nonlinear optical material and essentially within mutually separated columns associable with the laser cells, both in the direction of the radiation emitted by the laser cells and in the opposite direction. The laser module includes optical elements which divert the bidirectionally propagating frequency-doubled radiation in a manner whereby, upon diversion between the columns in the respective other direction, the radiation propagates in the nonlinear optical material, so that frequency-doubled light ultimately exits the nonlinear optical material in only one direction. | 03-05-2009 |
| 20090021851 | COLOR WHEEL WITH INDIVIDUAL BALANCING MASSES ALONG A GUIDE - A color wheel is provided with a balancing device. The balancing device encompasses an essentially circular track whose center point coincides with the axial center of rotation of the color wheel. The track is provided with at least two mutually independent, movable balancing weights. Moving the balancing weights along the track requires a force greater than the gravitational force of the balancing weight. In one example method for balancing a color wheel, a determination is made of a position in which a balancing weight corresponding to the total weight of the balancing weight system would have to be placed in order to balance the color wheel. At least one of the balancing weights is then moved to the position, according to the determination, where one of the balancing weights corresponding to the total weight of the balancing weight system would have to be placed. | 01-22-2009 |
| 20080318062 | High Oxidation Resistant Hard Coating for Cutting Tools - An inventive workpiece features on at least parts of its surface a wear resistant hard coating comprising the following composition Al | 12-25-2008 |
| 20080308412 | MULTITARGET SPUTTER SOURCE AND METHOD FOR THE DEPOSITION OF MULTI-LAYERS - Apparatus and methods for sputtering are provided, which are useful for sputtering high magnetization saturation materials. In one embodiment, a plurality of sputtering target arrangements are arranged concentrically, wherein independent magnetic fields can be generated at least partially above the respective target arrangements. One or several target arrangements can include respective upper and lower parts that are spaced from one another but arranged in essentially parallel planes. Methods include co-sputtering from multiple target arrangements to produce sputtered alloy layers on a substrate, as well as alternately sputtering from different target arrangements to produce a plurality of sputtered layers on the substrate. | 12-18-2008 |
| 20080297904 | METHOD FOR COMBINATION OF LIGHT OF DIFFERENT WAVELENGTHS - A method for dividing substantially nonpolarized white light into three substantially nonpolarized fractions includes splitting the substantially nonpolarized white light into a first fraction and a second fraction, the first fraction being substantially nonpolarized light of a first wavelength interval and the second fraction of substantially nonpolarized light of a second and a third wavelength interval, the first wavelength interval being located between the second and the third wavelength interval and splitting the second fraction into a third fraction with substantially nonpolarized light of the second wavelength interval and into a fourth fraction with substantially nonpolarized light of the third wavelength interval. | 12-04-2008 |
| 20080286496 | Method for depositing electrically insulating layers - The invention relates to a method for operating an arc source, whereby an electric spark discharge is ignited and run on the surface of a target and the spark discharge is simultaneously fed a direct current with an associated constant voltage DV as well as a pulsed current generated by a periodically applied voltage signal. The voltage at the arc source is boosted over several microseconds and the shape of the voltage signal is in essence arbitrarily selectable. | 11-20-2008 |
| 20080258747 | TEST EQUIPMENT FOR AUTOMATED QUALITY CONTROL OF THIN FILM SOLAR MODULES - Provided is a method and test system for identifying a defective region of a photovoltaic cell from among a plurality of photovoltaic cells collectively forming a thin film solar module. A probe includes a plurality of test fingers arranged to be substantially simultaneously placed adjacent to an electric contact provided to different regions of one or more of the plurality of photovoltaic cells, and each of the test fingers is to receive an electrical output from the different regions of the one or more photovoltaic cells. A light source emits light to be converted by the photovoltaic cells into the electrical output during testing. A measurement circuit measures a property of the electrical output received from the different regions of the photovoltaic cells and transmits a measured value signal indicative of the property measured by the measurement circuit. And a control unit receives the measured value signal and generates a visible display indicating that at least one of the different regions of the solar module is a defective region based at least in part on the measured value signal, and also indicates a location of the defective region on the solar module. | 10-23-2008 |
| 20080237189 | METHOD FOR LASER SCRIBING OF SOLAR PANELS - A method and device for ablation of thin layers on the rim region of the surface of a plane substrate coated with a thin film. The rim region runs along the edge or edges of the substrate, and the thin layers should be ablated in at least two, not necessarily unconnected areas of the rim region along edge pieces not parallel to one another. A laser beam is pointed toward an ablation area. The areas of the rim region to be ablated are guided through the area so that in a plane of the surface of the substrate, during the whole ablation process, there is basically a constant distance in the space that lies partly in the ablation area and has its starting point outside the substrate surface and its end point within the substrate surface. | 10-02-2008 |
| 20080210549 | METHOD AND APPARATUS FOR MANUFACTURING A SUBSTRATE WITH A MAGNETRON SPUTTER COATING - Manufacturing a coated substrate by magnetron sputtering includes cyclically moving the magnetron magnetic field pattern along a sputter surface, positioning a substrate to be coated a distance from and facing the sputter surface, moving the substrate along the sputter surface and varying an amount of material deposited on the total substrate per time unit from the magnetron source that is cyclically and phase-locked with the cyclically moving magnetron magnetic field pattern. | 09-04-2008 |
