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NXP B.B.
| NXP B.B. Patent applications | ||
| Patent application number | Title | Published |
|---|---|---|
| 20080258296 | Cut-Out Heat Slug for Integrated Circuit Device Packaging - In a package, a heat slug, encapsulated by molding compound, encases an integrated circuit device (IC). In an example embodiment, a semiconductor package structure comprises a substrate ( | 10-23-2008 |