| Novaplanar Technology, Inc. Patent applications |
| Patent application number | Title | Published |
|---|
| 20120058712 | POLISHING PADS FOR CHEMICAL MECHANICAL PLANARIZATION AND/OR OTHER POLISHING METHODS - Embodiments herein provide polishing pads that produce high post-polish planarity, such as on a wafer substrate or other substrates. Exemplary pads include a bulk matrix and embedded polymer particles. Pads according to embodiments herein may be used to remove material over a composite substrate, comprised of two or more different materials, or a substrate comprised of a single material. | 03-08-2012 |
| 20100178853 | POLISHING PADS FOR CHEMICAL MECHANICAL PLANARIZATION AND/OR OTHER POLISHING METHODS - Embodiments herein provide polishing pads that produce high post-polish planarity, such as on a wafer substrate or other substrates. Exemplary pads include a bulk matrix and embedded polymer particles. Pads according to embodiments herein may be used to remove material over a composite substrate, comprised of two or more different materials, or a substrate comprised of a single material. | 07-15-2010 |
