Inventors list

Assignees list

Classification tree browser

Top 100 Inventors

Top 100 Assignees


Nishikawa Kasei Co., Ltd.

Hiroshima, JP

Nishikawa Kasei Co., Ltd. Patent applications
Patent application numberTitlePublished
20080252049Resin Composition for Seamless Air Bag Covers, and Seamless Air Bag Covers or Seamless Instrument Panels with Air Bag Covers, Made by Using the Composition - A resin composition for a seamless air bag cover or a resin composition for a seamless instrument panel having an air bag cover which comprises (A) 50 to 90% by mass of polypropylene, (B) 0 to 20% by mass of a thermoplastic elastomer and (C) 10 to 30% by mass of talc having an average particle diameter of 15 to 25 μm and a distribution of a particle diameter such that the content of particles having a diameter of 5 μm or smaller is 10% by mass or smaller and the content of particles having a diameter exceeding 40 μm is 10% by mass or smaller. The resin composition exhibits sufficient properties when an instrument panel is molded. A seamless instrument panel having an air bag cover can be obtained as an integrally molded product, which can be treated as a single article in recycling.10-16-2008